At a glance
| Booth | I3000 |
| Country | TW |
| Website | semicontaiwan.org/en/about/pavilions/UK-Pavilion |
Company profile
UK Pavilion brings together 23 companies working at the forefront of photonics, chip design, quantum technologies, AI hardware, advanced materials, and semiconductor manufacturing. The pavilion spans enabling technologies including photonics, in-memory computing, power electronics, and advanced cooling, creating a cross-section of technologies used across semiconductor and adjacent hardware development. Its scope is organized around photonics, quantum and compound-semiconductor design, memory and manufacturing, manufacturing and materials, and semiconductor equipment.
Exhibits
Photonics and design offerings include semiconductor photonic product design, assembly, and packaging services covering the path from prototype work to a pilot line. The same technology group includes AI-powered solutions for smarter and safer cities, TCAD software for emerging wide-bandgap semiconductor devices, and Cubic GaN material for AR/VR and display applications. It also includes an AI processor powered by 3D optics and organic thin-film transistors that enable next-generation flexible displays and electronics. The 3D-optics-powered AI processor is described as the fastest and most energy-efficient, while the universal-memory offering is described as ultra-efficient and quantum powered. Memory and manufacturing offerings include next-generation non-Von Neumann technology that optimizes computer-memory architecture for large data sets and time-critical data. This area also covers Super Junction MOSFETs, MEMS solutions, Advanced Engineering Substrates, and ULTRARAM™, described as a quantum-powered universal computer memory. Manufacturing and materials offerings include pulse laser ablation for dicing and drilling brittle wafers, together with components and expert solutions for vacuum-coating applications. Additional manufacturing technologies include micromilling for brittle materials, nanoscale software solutions, and QDs and nanomaterials for infrared imaging and sensing applications. Equipment offerings include automated and manual wafer-handling equipment and high-volume production testers for power semiconductors. The equipment range also includes ultra-stable, single-frequency Continuous Wave DPSS lasers, diffusion furnace systems, chemical-handling equipment, and wet benches. Spectral imagers use computer vision for materials identification, while air-bearing spindles and dicing machinery extend the range into precision processing equipment. Across the pavilion, these offerings connect photonics, memory architectures, power-semiconductor testing, wafer processing, materials, sensing, and production equipment within the broader semiconductor manufacturing scope. The combined range extends from product and semiconductor-material design through memory technologies and sensing to wafer handling, production testing, coating, laser, furnace, and dicing equipment.
Capabilities and products
- joint pavilion of UK companies
- AI & Power Efficiency themed showcase