基本資料
| 攤位 | I3000 |
| 國別 | TW |
| 產品分類 | PV: Cells · Base Loader Systems · Die Sorter; Pick & Place; Flip Chip Placement Systems · Package Simulation; Characterization Equipment · Bumping Systems · Crystal Growing & Machining Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Environmental Enclosures; Minienvironments · Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE) · Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint · Spin on Glass (SOG); on Dielectric (SOD) Track systems · Optical Test Systems · Molding; Encapsulation; Potting; Resin Materials · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Materials, Nanotechnology · Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN) · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Epitaxial; Epi; Gettered; Internal Gettered Wafers · Gallium Arsenide (GaAs); Sapphire Substrates · Prime; Polished; Mirrored Wafers · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · Strained silicon; Engineered Substrates · Substrate Materials · Connectors; Plugs; Interconnects; Cable; Wire · Electronic Hardware; Fixtures and Supplies · Optics; Lens Products; Auto-Focus Systems · Simulation; Characterization; Verification Software · Statistical Analysis; Modeling; Cost of Ownership (CoO) Software · Laundry service; Cleanroom Garments and other · Lithography; Patterning service · Measurement; Inspection Service · Assembly · CAD; CAM; CIM · Equipment; Hardware; Product Design, Integration and Manufacturing · Flat Panel Display (FPD) Design & Manufacturing · Nanotechnology Intellectual Property Development; Research · Package Materials; Interconnect; Subcomponent; Subassembly Design Services · Static; ESD Testing & Control Services · Education; Research Institutions (For-Profit); Vocational Training · Other |
公司簡介
光子學／量子／化合物／設計。Bay Photonics — 半導體光子產品的設計、組裝與封裝服務，從原型到試產線。Gorilla Technology Inc — AI 驅動解決方案的領導者，致力於打造更智慧、更安全的城市。KuasaSemi — 用於新興寬能隙（WBG）半導體元件的 TCAD 軟體。Kubos Semiconductors — 用於 AR/VR 與顯示器應用的立方氮化鎵（Cubic GaN）新型化合物半導體材料。Lumai — 由 3D 光學驅動、最快且最節能的 AI 處理器。SmartKem Ltd — 有機薄膜電晶體（OTFT）開發商，可實現次世代軟性顯示器與電子產品。記憶體／製造。Blueshift Memory — 次世代（非馮紐曼）技術，最佳化電腦記憶體架構以處理大型資料集與時間關鍵性資料。IceMOS Technology Ltd — 超接面 MOSFET、MEMS 解決方案與先進工程基板的領導製造商。Quinas Technology, ULTRARAM™ — 超高效率、革命性的量子驅動通用電腦記憶體。製造與材料。Advancete — 用於脆性晶圓切割與鑽孔的脈衝雷射燒蝕技術。Gencoa — 為真空鍍膜應用提供元件與專業解決方案。Microbritt — 用於脆性材料加工的微銑削技術。Nanomation — 奈米尺度的軟體解決方案。Quantum Science — 專精於紅外線成像與感測應用的量子點（QD）與奈米材料。設備。EMU Technologies — 自動與手動晶圓搬運設備製造商。ipTEST Ltd — 功率半導體大量生產測試機的領導製造商。Skylark Lasers — 超穩定、單頻連續波 DPSS 雷射。Thermco Systems — 擴散爐系統、化學品處理設備與濕式工作台的市場領導者。ProSpectral — 運用電腦視覺進行材料辨識的光譜成像儀。Loadpoint Ltd — 空氣軸承主軸與切割機具的業界先驅。如有疑問與潛在合作，請於 SEMICON Taiwan 期間蒞臨英國館（UK Pavilion）。
能力與產品項目
- Advancete 用於脆性晶圓切割與鑽孔的脈衝雷射燒蝕
- Bay Photonics 半導體光子產品設計、組裝與封裝
- EMU Technologies 自動與手動晶圓搬運設備
- IceMOS Super Junction MOSFETs 與 MEMS 解決方案
- KuasaSemi 新興 WBG 半導體元件用 TCAD 軟體
- Kubos Cubic GaN 化合物半導體材料
- Microbritt 脆性材料微銑削技術
- SmartKem organic thin-film transistors (OTFTs)
- Thermco 擴散爐系統、化學品處理設備與濕式工作台
- ipTEST 功率半導體大量生產測試機