At a glance
| Booth | N0689 |
| Country | TW |
| Website | www.uk-tech.net |
Company profile
U.K. TECHNOLOGY CORP. was established by 1994 and states that it was the earliest company to develop a plan for an LCD production line. The company serves LCD makers in Taiwan, Hong Kong, and China and has obtained dealerships for Japanese production facilities and raw materials. Its activities include transmitting technology and skills while conducting R&D and production at the same time. To expand its market and service coverage in China, U.K. TECHNOLOGY CORP. set up a branch office in Dong Guan in 1999. Its personnel are described as having worked in the LCD industry field for over 20 years, providing an experienced base for customer work in LCD production-related activities. The company states that its personnel continually visit developed countries and bring back advanced technology and new knowledge for use in its operations. It also works in association with several makers in Japan, using the resulting exchange of ideas as a foundation for qualitative improvement. For professional training and skills development, U.K. TECHNOLOGY CORP. invites senior specialists to impart knowledge from their specialized fields. Together, overseas visits, collaboration with several Japanese makers, simultaneous R&D and production, and training by senior specialists form the company's stated route for bringing advanced technology and new knowledge into qualitative improvement and professional skill development.
Exhibits
The HBS Series fully automatic wafer hybrid bonding system is a highly automated and highly integrated bonding platform designed to meet hybrid-bonding requirements and to combine multiple bonding-process functional modules in one system. The HBS Series realizes a room-temperature direct bonding process, making room-temperature direct bonding an expressly listed process capability of the fully automatic hybrid-bonding equipment. Fully automatic temporary bonding equipment is used in 3D IC, Advanced packaging, MEMS & Sensors, Power Devices, RF, and LED fields and is characterized by high automation, high Throughput, and high process extensibility. The fully automatic temporary bonding equipment can be flexibly customized according to customer requirements, adding a customer-specific configuration option to its listed application range. Fully automatic SOI bonding equipment is used for high-speed logic circuits, power chips, automotive electronics, RF chips, MEMS, and optical communications and likewise provides high automation, high Throughput, and high process extensibility. The fully automatic SOI bonding equipment can also be flexibly customized according to customer requirements, so the bonding portfolio combines automated hybrid bonding, temporary bonding, and SOI bonding with customization for different process and application needs.
Capabilities and products
- fully automatic wafer hybrid bonding system supply
- room-temperature direct bonding process
- fully automatic temporary bonding equipment supply
- fully automatic SOI bonding equipment supply
- bonding equipment customization
- LCD production equipment and raw-material agency