At a glance
| Booth | J2352 |
| Country | TW |
| Website | www.tripod-tech.com |
Company profile
TRIPOD Technology Corporation's Automation BU develops and manufactures electronic production machinery for the semiconductor, PCB, and POS industries, and the business unit states capital of USD72,000,000. The Automation BU reports more than 3,000 installation bases worldwide across IC, DISCRETE, MEMS, and LED packaging and testing companies as well as PCB manufacturers. 健鼎科技股份有限公司 describes a PCB market in which higher-density electronic products are driving stricter high-frequency, anti-interference, precision, and reliability requirements, while production-equipment specifications and prices are also rising. Its technology strategy covers product development, process-yield improvement and stabilization, evaluation and introduction of new process technologies, equipment and materials, and industry-academia development, with additional emphasis on technical incubation and research collaboration. The company also identifies Industry 4.0 deployment for new-factory construction and existing-factory transformation, using lean production, equipment automation, and information automation to improve yield and reduce labor cost. For 2025, it reports consolidated operating revenue of 73,399,297 thousand, consolidated gross profit of 18,992,489 thousand, consolidated pre-tax net profit of 13,997,755 thousand, and consolidated after-tax net profit of 10,224,624 thousand, with the corresponding 2024 figures stated as 65,803,607, 15,287,530, 10,996,489, and 8,382,701 thousand. Its PCB production sites are identified at Pingzhen in Taoyuan, Wuxi in Jiangsu, Xiantao in Hubei, and Bien Hoa in Vietnam, and consolidated actual sales volume for 2025 is stated as 69,770 thousand square feet. Operating policy emphasizes diversified customers and products, cautious capacity expansion, higher equipment utilization, cross-plant resource sharing, information-system management of production progress and delivery changes, yield improvement, and evaluation of new production locations to build supply-chain resilience. The company also states environmental, occupational-safety, social-responsibility, and governance priorities, including greenhouse-gas inventory work, energy conservation, carbon reduction, circular-economy activities, resource recycling, and commitments to customers, employees, suppliers, shareholders, society, and corporate responsibility. Its environmental and occupational-safety management systems are described as meeting ISO 14001 and ISO 45001 requirements, and its Hubei plant is identified as having passed advanced AEO certification. The company also states that it qualified through the FTSE4GOOD independent evaluation system for inclusion as a constituent of the Taiwan Sustainability Index, and that in 2026 it was included in the Taiwan Stock Exchange Corporate Governance 100 Index for the first time.
Exhibits
The Automation BU's named production-equipment range includes Test Handler/Sorter, Taping Machine, PCB Laser Marking machines, target drill machines, and POS systems for semiconductor, PCB, and POS production environments. Within semiconductor and PCB automation, these products directly cover test handling and sorting, taping, laser marking, and target drilling, matching the company's stated development and manufacturing scope for automated production equipment. 健鼎科技股份有限公司 also organizes its PCB application portfolio around automotive electronics, notebook computers, mobile phones, hard disks, memory modules, TFT-LCD, and server or workstation applications. In automotive electronics, the listed use cases include windows, airbags, steering wheels, power systems, and other equipment requiring electronic power support, where printed circuit boards are used to conduct circuitry. For display applications, TFT-LCD is described as an active-matrix LCD technology that uses thin-film transistors to improve image quality and is applied in televisions, flat-panel displays, and projectors. Memory-module applications are described around printed circuit boards carrying memory integrated circuits for installation in electronic systems such as personal computers, workstations, and servers, while hard-disk applications are associated with random-access storage using rotating platters and actuator-mounted heads. Planned product development includes Advanced rigid-flex boards for Enterprise SSD, TFT, fingerprint-recognition modules, and Automotive applications; High thermal dissipation PCB for Optoelectronic transceiver, DIMM(DDR5), Basestation, and Automotive lighting; and High current/Voltage PCB for Automotive, Wireless Charger, and DC Breaker applications. Process development targets include HDI four-step stacked blind-via products for Smart phone, higher yield for advanced rigid-flex boards, improved Stub length tolerance back-drilling capability, high-aspect-ratio plating and via filling at A/R=15:1/20:1, and improvements in HLC alignment, board thickness, and working-panel size. Fine-line development includes L/S 40 /40um mass-production introduction and 30/30um development, while additional work covers blind-routing depth capability and introduction of vertical or horizontal high-vacuum via-filling equipment. Material and process evaluation covers High Speed material, Ultra Low loss material, high-voltage-resistant material, NiPd/Ni surface treatment, Industry 4.0 equipment and information automation, and Heat pipe evaluation. Industry-academia work includes Eagle stream platform material evaluation and introduction as well as technology cooperation for automotive Radar and industrial Radar.
Capabilities and products
- Printed circuit board manufacturing
- Test handlers and sorters
- Taping machines
- PCB laser marking equipment
- PCB target-hole drilling equipment
- POS systems