At a glance
| Booth | P6022 |
| Country | SG |
| Website | ocassys.com |
Company profile
In 2023, TQC PRECISION ENGINEERING PTE. LTD entered into a strategic joint venture with OCAS Systems, and the two companies are currently jointly developing a cutting-edge wafer prober for both 8-inch and 12-inch wafers. The collaboration is intended to combine the strengths and expertise of TQC PRECISION ENGINEERING PTE. LTD and OCAS Systems to create a wafer prober that addresses increasing demands in the semiconductor market. The development remains in progress and spans both 8-inch and 12-inch wafer formats, making the joint project a two-size wafer-prober development program rather than a completed single-size product. OCAS Systems provides the technology background in the partnership: since starting in 2018, it has designed and manufactured innovative, leading-edge, and cost-effective automated vision-inspection equipment and packaging machines that apply software technologies for the semiconductor and electronics-packaging industries, while serving semiconductor Outsourced Assembly and Test (OSAT) and Original Design Manufacturer (ODM) customers around the world. The partnership links TQC PRECISION ENGINEERING PTE. LTD with OCAS Systems’ experience in automated vision inspection and packaging machinery while focusing their combined development effort on semiconductor wafer probing.
Exhibits
The OS6000 Wafer Prober is an OCAS 300mm wafer prober that combines the automation and reliability requirements of high-volume manufacturing environments with prober technology intended for demanding wafer-test operations. OS6000 is described as combining high precision and rapid response with minimized energy losses and minimal maintenance requirements, with the stated result of improving overall system efficiency during operation. Its linear-drive motors are described as exceptionally smooth, enabling seamless wafer positioning and precise probing across the testing area while providing the motion behavior needed for repeatable test-area access. A solid granite base provides the structural stability and repeatability needed to support reliable and consistent probing results across repeated positioning and test cycles. The advanced optical system performs precise wafer alignment so that probe contact can be made accurately at the intended location before electrical probing takes place. OS6000 uses direct-drive motor technology together with an absolute encoder and a Robax glass scale with an ultra-low coefficient of thermal expansion, combining drive, position feedback, and a low-expansion measurement reference in the motion system. Within the TQC and OCAS joint-development context, the OCAS 300mm prober demonstrates automation, positioning, probing, alignment, structural stability, repeatability, motion control, and measurement elements relevant to wafer-prober development.
Capabilities and products
- joint development of 8-inch and 12-inch wafer probers