At a glance
| Booth | P6012 |
| Country | SG |
| Product categories | Package Handling; Conveying Equipment · Vision; ID; Bar Code Systems · Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers · Robotics; Transfer Systems |
| Website | ocassys.com |
Company profile
Since we started in 2018, OCAS Systems designs and manufactures innovative, leading-edge and cost-effective automated vision inspection equipment and packaging machine that utilises its expertise in applying latest software technologies for the semiconductor and electronics packaging industries. In 2023, OCAS Systems has entered into a strategic joint venture with a prominent company, TQC Precision Engineering Pte Ltd to jointly develop a cutting-edge 8” & 12” wafer prober. The aim of this collaboration is to combine the strengths and expertise of both companies to create a revolutionary wafer prober that addresses the increasing demands of the semiconductor market. OCAS Systems serves customers from semiconductor Outsourced Assembly and Test (OSAT) and Original Design Manufacturer (ODM) around the world.
Capabilities and products
- 8” & 12” wafer prober
- automated vision inspection equipment for semiconductor packaging
- package handling and conveying equipment
- robotics and transfer systems
- semiconductor and electronics packaging machine