At a glance
| Booth | J2234 |
| Country | JP |
| Website | www.toray-eng.co.jp |
Company profile
Toray Engineering Co., Ltd. provides solutions based on the concepts of engineering and monozukuri, combining original technologies across pharmaceutical, fine-chemical, and advanced-material plant construction, factory-automation system building, semiconductor and FPD manufacturing and testing equipment, and simulation technology. The company states that it also aims to meet customer requirements for cutting-edge monozukuri in priority growth areas covering environment and energy, life innovation, and overseas operations.
Exhibits
For PLP, or panel-level packaging, Toray Engineering offers foreign-particle inspection equipment using proprietary optical technology that the company says has achieved high reliability in glass-substrate inspection requiring high precision; the listed model is HS-930e. Its coating equipment for advanced semiconductor packaging applies high-precision coating technology and large-glass handling technology developed through display manufacturing to support high-performance semiconductor production, with TRENG-PLP coater listed in the product range. The company provides flip-chip bonders used for semiconductor-package assembly and states that the line supports a broad range from R&D to mass-production applications. Its bonder lineup includes equipment for TSV three-dimensional integration, FOWLP, FOPLP, and optical-device applications. The laser micro-trimming equipment uses laser irradiation to remove defective portions of mini and micro LEDs, repair semiconductor memory, and trim resistor fuses; the product range lists the LMT-HR series. Toray Engineering also lists optical wafer appearance-inspection equipment for semiconductor manufacturing processes, including INSPECTRA®. Its electron-beam wafer inspection and measurement equipment uses a Die to Database algorithm together with wide-field electron-microscope images, and the company states that this approach contributes substantially to yield improvement in leading-edge semiconductor-device manufacturing; the listed equipment is NGR. For polyimide etching used with newer semiconductor-package formats such as CSP and T-BGA, the company describes a method that etches polyimide film using a patented safe chemical; TPE3000 is listed with this offering. Together, the listed semiconductor-related portfolio spans precision inspection, advanced-package coating, bonding, laser processing, optical wafer inspection, electron-beam inspection and measurement, and polyimide-film etching across R&D and production-oriented environments. The optical wafer appearance-inspection and electron-beam wafer inspection and measurement products are handled by Toray Engineering Advanced Semiconductor MI Technology Co., Ltd. (TASMIT), while the polyimide-etching offering is handled by TRENG F Products Co., Ltd..
Capabilities and products
- PLP foreign-particle inspection equipment
- coating equipment for advanced semiconductor packaging
- flip-chip bonder
- bonding equipment for TSV/FOWLP/FOPLP
- laser micro-trimming equipment
- pharmaceutical plant construction
- fine-chemical plant construction
- advanced-material plant construction
- factory automation system building
- semiconductor and FPD manufacturing/testing equipment
- simulation technology services