At a glance
| Booth | J2234 |
| Country | JP |
| Product categories | Wafer Level Bonders · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Line Width; Critical Dimension (CD) Measurement · Overlay Measurement · Plate Inspection Equipment · Inspection and Metrology |
| Website | www.toray-eng.co.jp |
Company profile
Toray Engineering offers solution based on a concept of '''' engineering and monozukuri,'''' ''''incorporating a diverse range of original technologies relating to pharmaceuticals, fine chemicals and advanced materials plant construction, factory automation system building,semiconductor and FPD manufacturing and testing eguipment, and simulation technology. we also aim to fulfill customer requirements for cutting-edge monozukuri in specific priority growth areas, namely environment and engergy, life innovation, and overseas operations.
Capabilities and products
- FPD manufacturing equipment
- FPD testing equipment
- defect, particle, bump, and contamination inspection
- die inspection and die shear
- ellipsometer metrology
- factory automation system building
- film thickness, thickness, and uniformity measurement
- semiconductor manufacturing equipment
- semiconductor testing equipment
- wafer level bonders
Related product topics
- Semiconductor Automation Equipment
- Factory Automation System Integration
- Wafer-Level Bonders
- Defect & Particle Inspection Systems
- Die Inspection and Die Shear Equipment
- FPD Inspection And Processing Equipment
- FPD Test And Inspection Equipment
- Film Thickness Metrology
- Ellipsometer Metrology
- Semiconductor Test Equipment