At a glance
| Booth | X0004 |
| Country | CN |
| Website | www.tinman-sg.com |
Company profile
Tinman Advanced System Technology Pte Ltd was formed in 2019 and specializes in the research, design, manufacturing, and sales of core equipment and auxiliary materials for high-precision packaging of optical communication modules, power modules, and memory chip modules. The company describes its business as being deeply engaged in semiconductor advanced packaging and states that it provides high-end semiconductor equipment to clients worldwide. Its team includes experts with experience from leading semiconductor companies in domestic and international markets, bringing knowledge of semiconductor-equipment design, process development, manufacturing, and management. The team is also described as being familiar with current industry trends and cutting-edge technologies, linking its equipment-development work to process requirements in advanced semiconductor packaging. Tinman Advanced System Technology Pte Ltd reports that its products have been widely adopted by chip-packaging companies in Mainland China, Southeast Asia, North America, and other regions, and specifically names Singapore, Japan, Malaysia, Taiwan, and the United States among the markets served. Its corporate site presents operating metrics using the labels 50+ Customized Case, 100+ Shipment, and 100+ Professional alongside the company profile and product center.
Exhibits
For semiconductor advanced packaging, Tinman Advanced System Technology Pte Ltd provides high-precision die attach equipment and high-precision AOI equipment. Its product center lists the A19 Flip Chip Bonder, T18 High-Precision Die Bonder, and M18 Multi-chip Die Bonder as named equipment within that advanced-packaging portfolio. The broader supply scope also includes core equipment and auxiliary materials for high-precision packaging in optical communication modules, power modules, and memory chip modules, covering both equipment and supporting material needs around those module types. Tinman Advanced System Technology Pte Ltd has also self-developed pre-sintering equipment that it describes as using domestic industry-leading technology, with a unique temperature-control design and complex software algorithms. That pre-sintering equipment is designed to meet increasingly stringent process requirements, making temperature control and software-based process handling explicit parts of the company's equipment approach. The A19 Flip Chip Bonder, T18 High-Precision Die Bonder, and M18 Multi-chip Die Bonder sit alongside the company's AOI offering, giving the product center a combination of placement or bonding equipment and inspection equipment for advanced packaging. Across these products, the stated activities extend from research and design through manufacturing and sales, rather than limiting the offering to equipment distribution alone. The equipment focus is specifically tied to high-precision packaging and semiconductor advanced packaging, with optical communication, power, and memory-chip modules identified as the module categories served. Tinman Advanced System Technology Pte Ltd therefore presents a portfolio that combines high-precision die attach, AOI, named flip-chip and die-bonding platforms, pre-sintering technology, and auxiliary materials for advanced semiconductor packaging workflows.
Capabilities and products
- high-precision die-attach equipment
- high-precision AOI equipment
- pre-sintering equipment for advanced packaging
- auxiliary materials for high-precision packaging