At a glance
| Booth | X0004 |
| Country | CN |
| Product categories | Die Sorter; Pick & Place; Flip Chip Placement Systems |
| Website | www.tinman-sg.com |
Company profile
TINMAN Advanced System Technology Co., Ltd. was formed in 2019, specializing in the research, design, manufacturing, and sales of core equipment and auxiliary materials for high-precision packaging in optical communication modules, power modules, and memory chip modules.We provide high-end semiconductor equipment to clients worldwide. The experts in team bring valuable experience from leading semiconductor companies both domestically and internationally. They possess in-depth knowledge of semiconductor equipment design, process development, manufacturing, and management. They are well-versed in the latest industry trends and cutting-edge technologies.Our self-developed pre-sintering equipment features domestic industry-leading technology, incorporating a unique temperature control design and complex software algorithms to meet increasingly stringent process requirements. Our products have been widely adopted and gained a positive market reputation in chip packaging companies across Mainland China,Southeast Asia, North America,and other regions. Such as Singapore, Japan, Malaysia, Taiwan,the United States.
Capabilities and products
- Flip Chip Placement Systems
- core equipment for high-precision packaging of optical communication modules
- packaging equipment for memory chip modules
- packaging equipment for power modules
- pre-sintering temperature control design and software algorithms
- self-developed pre-sintering equipment