At a glance
| Booth | K2048 |
| Country | KR |
| Website | www.tfe.co.kr |
Company profile
TFE Inc. provides semiconductor IC final-test solutions and states that it has been selected as a best supplier by Global IDM customers for decades, particularly in back-end testing for Memory and System LSI devices. Its competitive approach is described as a total solution that combines a System Part supplying all products required for the testing process with a Field Support Part that provides consultation on testing processes. TFE develops and manufactures in-house the products required for the final semiconductor testing process, including test boards, kits, and sockets, using its proprietary technologies. The company applies its Align & Smart Contact technology and accumulated testing experience to optimize, develop, and manufacture final-test products according to individual customer requirements. Its product structure spans mechanical products, printed circuit boards, contactors, simulation services, and turn-key or integrated test solutions, covering both hardware components and engineering support around semiconductor testing. Mechanical categories listed by TFE include Memory Kit, SoC Kit, Thermal Unit, and Fixture, while board categories include Interface Board, Burn-In Board, and SLT Board. Contactor categories include Memory Socket, SoC Socket, Burn In Socket, and Interposer or Board Saver, and simulation services include Thermal, SI / PI, and Stress analysis.
Exhibits
TFE has design capability for most PNP Kits used with handlers for major Memory Semiconductor customers and maintains more than 230 sets of molds for producing Insert Carriers for various IC packages. Its final-test hardware portfolio includes the test boards, kits, and sockets that TFE states it develops and manufactures in-house as part of a customer-tailored testing solution. For mechanical test interfaces, the listed portfolio includes Memory Kit and SoC Kit products as well as Thermal Unit and Fixture categories that support the physical side of semiconductor testing. Board products include Interface Board, Burn-In Board, and SLT Board, extending the final-test offering into printed-circuit-board interfaces for different stages and test configurations. The contactor family includes Memory Socket, SoC Socket, Burn In Socket, and Interposer or Board Saver products, giving TFE multiple socket and interface formats around device testing. TFE's Burn In Socket is described with damage-free contact on the device ball and PCB pad, high-speed testing implementation, availability of a 0.25P solution, long service life, high durability, and customized optimized solutions. Simulation services cover Thermal, SI / PI, and Stress analysis, providing engineering evaluation alongside the hardware that the company supplies for final test. The System Part and Field Support Part are combined into turn-key and integrated-test approaches, linking supplied test products with consultations on testing processes. Across handlers, insert carriers, boards, kits, sockets, contactors, and simulation work, TFE's stated approach is to optimize the final-test configuration according to customer requirements rather than treat each component as an isolated product.
Capabilities and products
- memory test kits
- SoC test kits
- thermal units
- test fixtures
- test printed circuit boards
- interface boards
- burn-in boards
- SLT boards
- semiconductor test contactors
- memory sockets
- SoC sockets
- burn-in sockets
- interposers (Board Saver)
- semiconductor test simulation services
- integrated test solutions
- handler PNP kit design