At a glance
| Booth | I3210 |
| Country | TW |
| Website | www.tri.com.tw |
Company profile
Test Research, Inc. (TRI) provides a One Stop Test and Inspection Solution for the electronics manufacturing industry, combining optical inspection, X-ray inspection, and electrical test equipment within a broader inspection portfolio. Its inspection and test categories include 3D Solder Paste Inspection, 3D Automated Optical Inspection, 3D Automated X-ray Inspection that can be upgraded to Computed Tomography, Manufacturing Defect Analyzers, and In-Circuit Test equipment. TRI's Smart Factory approach applies AI-powered algorithms, multiple 3D technologies, metrology-grade measurement, real-time SPC trends, and machine-to-machine communications to inspection operations. The company states that its solutions comply with Industry 4.0 standards including IPC-Hermes-9852, IPC-DPMX, and Connected Factory Exchange IPC-CFX. For semiconductor and advanced-packaging inspection, TRI lists Die, Wire, Wedge, Ball, and Ribbon Bonding; Cross Wire; BBOS/BSOB; SiP; WLCSP; Underfill; Bumps; Cu Pad/Pillar; Epoxy; Flux; Glue; and foreign-material detection among its inspection targets. Its semiconductor-related capabilities also include die-bonding inspection, AI wire detection, IGBT inspection, wafer and chip metrology, and scratch-on-die inspection. The company's product navigation separately identifies Optical Inspection, Conformal Coating Inspection, Automated X-ray Inspection, Electrical Test through MDA and ICT, and SEMI Inspection through optical and X-ray systems, reinforcing the breadth of its electronics-manufacturing test and inspection portfolio. TRI also lists customer-service functions for sales and technical support alongside its product systems, supporting the deployment and use of its inspection and test equipment.
Exhibits
The TR7950Q SII Series is a highly modular wafer-inspection and micro-measurement metrology platform that uses AI-driven algorithms for advanced semiconductor manufacturing and offers an optional SWIR module for detecting hidden inner cracks and subsurface defects that standard visible-light sensors cannot see. The TR7007Q SII-S is a 3.5 μm high-resolution platform with 25 MP imaging technology for SEMI back-end, Mini-LED, C4 Bumps of approximately 100 μm diameter, and 008004 paste-inspection applications. TRI describes the TR7007Q SII-S as improving accuracy and stability for precise solder measurements and reducing false calls, while its wide-spectrum and coaxial lighting are used to raise defect-detection rates across multiple applications. The TR7900Q SII-P is built on a 1.2 μm high-resolution platform with 65 MP imaging technology for semiconductor and advanced-packaging applications, combining AI-powered algorithms with metrology capabilities in a Smart 3D AOI system. Its 3D SEMI AOI integrates with a loader and unloader module for strip and magazine handling, while Stop-and-Go 3D AOI can inspect die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints. Across these platforms, TRI applies high-resolution imaging, 3D inspection, AI algorithms, metrology, and specialized illumination to semiconductor back-end and advanced-packaging tasks that range from wafer and micro measurement to bonding and solder inspection. The broader optical-inspection family also includes 3D SPI, AOI, and Conformal Coating Inspection, while X-ray systems are offered for automated X-ray and semiconductor inspection and can extend 3D AXI toward Computed Tomography. Electrical-test offerings include Manufacturing Defect Analyzer and In-Circuit Tester systems, allowing TRI's inspection portfolio to pair image-based inspection with board-level electrical testing.
Capabilities and products
- 3D solder paste inspection (3D SPI)
- 3D automated optical inspection (3D AOI)
- 3D automated X-ray inspection (3D AXI/CT)
- conformal-coating inspection (CI AOI)
- manufacturing defect analyzers (MDA)
- in-circuit test equipment (ICT)
- wafer inspection and micro-measurement metrology platforms
- inspection for semiconductors and advanced packaging