At a glance
| Booth | I3210 |
| Country | TW |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Package Inspection; Lead Scanners · X-ray; XRF; 3-D X-Ray; LEXES Systems · Functional Test Systems · Logic Test Systems · Package Test Systems · Parametric Test Systems |
| Website | www.tri.com.tw |
Company profile
Test Research, Inc. (TRI) offers a One Stop Test and Inspection Solution. TRI provides high-precision and high-resolution inspection solutions for the electronics manufacturing industry, including 3D Solder Paste Inspection (3D SPI), 3D Automated Optical Inspection (3D AOI), 3D Automated X-ray Inspection (3D AXI, upgradable to Computed Tomography), Manufacturing Defect Analyzers (MDAs), and In-Circuit Test equipment (ICT). TRI's Smart Factory innovations optimize the current Inspection through AI-powered algorithms, multiple 3D technologies, metrology-grade measurement, real-time SPC trends, and M2M communications. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX). TRI's AI-powered Inspection solutions for the Semiconductor and Advanced Packaging Industry can inspect Die / Wire / Wedge / Ball / Ribbon Bonding, Cross Wire, BBOS/BSOB, SiP, WLCSP, Underfill, Bumps, Cu Pad/Pillar, Epoxy, Flux, Glue, and foreign material detection. Die Bonding AI Wire Detection IGBT Inspection Wafer Chip Metrology Scratch on Die For more information about TRI's Inspection capabilities for the Semiconductor and Advanced Packaging Industry, please visit the link below, https://www.tri.com.tw/en/about/about-68-2-2.html Visit booth #I2800 to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff.
Capabilities and products
- 3D Automated Optical Inspection (3D AOI)
- 3D Automated X-ray Inspection (3D AXI) upgradable to CT
- 3D Solder Paste Inspection (3D SPI)
- AI inspection for SiP, WLCSP, underfill, bumps and Cu Pad/Pillar
- AI inspection for die, wire, wedge, ball and ribbon bonding
- AI-powered inspection with metrology-grade measurement and real-time SPC
- IPC-Hermes-9852, IPC-DPMX and IPC-CFX connected-factory support
- In-Circuit Test equipment (ICT)
- Manufacturing Defect Analyzers (MDAs)
- foreign material detection for semiconductor advanced packaging