At a glance
| Booth | N0570 |
| Country | HK |
| Product categories | Cleaning; Washing Equipment for Assembly & Packaging · Die Sorter; Pick & Place; Flip Chip Placement Systems · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Molding; Encapsulation; Decapsulation Equipment · Wafer Level Bonders · Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Centrifuges · Die Inspection; Die Shear · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Leak Detection Systems - Vacuum or Gas · Microscopes: Atomic Force Microscopes (AFM) · Microscopes: Optical Microscopes · Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr · Resistivity Measurement; 4 point probe; Sheet resistance · Stress; Refractive Index; Reflectivity & Conductivity Measurement · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Inspection and Metrology |
| Website | www.teltec.asia |
Company profile
Celebrating our 41st anniversary this year, tec Pacific (www.tec.asia) has been recognized as the leading Sales & Service Organization serving the Semiconductor Industry (Front & Backend) in the Asia-Pacific region. Our represented products cover the following applications: A) Metrology i) Akrometrix: Thermal Warpage and Strain Metrology Systems ii) FSM – Thin Film Stress, Thickness Measurement Systems B) Failure Analysis i) Denton Vacuum: Gold or Carbon Coaters for SEM and TEM ii) Comet-Yxlon: X-ray Inspection Systems, High Resolution Industrial Horizontal CT iii) Nisene: Automated Acid Decapsulation Systems v) Royce: Automated Die Sorters & Bond Testers C) Reliability i) Heller: Reflow Ovens， Pressure Curing Ovens ii) Microtronic: Solderability Testers iii) Web Technology: Centrifuges, Bubble Testers D) Photolithography i) Kayaku Advanced Materials: Photoresists for Lift- Off, MEMS, Compound Semiconductor, E-beam Lithography, Wafer Bonding and Wafer Level Packaging ii) Nippon Kayaku: Dry Film Resists (For MEMS, Wafer Level Packaging) iii) OAI: Mask Aligners & Exposure Systems iv) Abet: Solar Simulators, IQE/IV/QE/IPCE Measuring Systems E) Wafer Processing Tools i) CEE: Spin Coaters, Bake Plates, Developers, Bonders & Debonders ii) AML: In-situ Aligned Wafer Bonders iii) Ultra t: Wafer, Substrate and Mask Cleaners F) Substrate surface modification & Cleaning i) PVA Tepla: MW/RF Plasma Cleaning Systems ii) Jelight: UVO cleaners G) Vacuum Deposition i) Veeco: ALD Systems ii) Denton Vacuum: Thin Film Deposition Systems iii) Chemcut: Wet Processing Equipment H) Molding & Die Bonding i) XinSheng: Automated Molding Systems ii) Capon: Automated Die Bonders I)Production i)Micocontrol Electronic – Automated Laminators and Delaminators G) Others i) BNC – Pulse and Delay Generators Address: Rm. 2802 Wing On House, 71 Des Voeux Road Central, Hong Kong [email protected] tec Semiconductor Pacific (Taiwan) Limited [email protected] Shanghai Singapore / Malaysia / Vietnam Thailand
Capabilities and products
- Akrometrix thermal warpage and strain metrology systems
- CEE spin coaters, bake plates, developers, bonders and debonders
- Comet-Yxlon X-ray inspection systems and industrial CT
- Denton Vacuum gold or carbon coaters for SEM and TEM
- FSM thin film stress and thickness measurement systems
- Kayaku photoresists for MEMS, compound semiconductor and e-beam lithography
- Nisene automated acid decapsulation systems
- OAI mask aligners and exposure systems
- PVA Tepla MW/RF plasma cleaning systems
- Veeco ALD systems
Related product topics
- ALD Deposition Equipment
- Industrial X-Ray Inspection Systems
- X-Ray CT Inspection Equipment
- Photoresist Materials
- Mask Aligner and Photomask Process Equipment
- Spin Coater and Track Equipment
- Developer Equipment and Materials
- Double-Sided Mask Aligners
- Semiconductor Metrology Systems
- Film Thickness Metrology
- Industrial CT and X-Ray Metrology Systems
- Wafer Warpage and Roughness Metrology
- Plasma Cleaning Machines