At a glance
| Booth | N0570 |
| Country | HK |
| Website | www.teltec.asia |
Company profile
Teltec Semiconductor Pacific Limited was founded in 1985 and provides equipment, materials, technical sales, and service for the semiconductor, electronics, and optoelectronics industries across the Asia-Pacific region, including semiconductor front-end and back-end operations. The company established branches in Taiwan and Singapore in the mid-1990s and an office in Shanghai in the late 1990s, and it now maintains offices and service centers in Hong Kong, Singapore, Taiwan, Malaysia, Vietnam, Thailand, and multiple Chinese cities including Beijing, Chengdu, Dongguan, Nanjing, Shanghai, Shenzhen, Ningbo, Suzhou, Tianjin, Wuhan, Wuxi, Xi’an, and Xiamen. As an agent for high-technology equipment manufacturers in the Far East, Teltec Semiconductor Pacific Limited mainly serves semiconductor packaging plants, wafer fabrication plants, LED manufacturers, printed-circuit-board plants, universities, and research institutions. Its sales and service personnel are professional engineers with electronics, electrical engineering, physics, or chemistry backgrounds and practical application experience, and supplier training and regular retraining support direct technical solutions and after-sales service. For metrology, the represented portfolio includes Akrometrix thermal warpage and strain metrology systems and FSM thin-film stress and thickness measurement systems. For failure analysis, the portfolio includes Denton Vacuum gold or carbon coaters for SEM and TEM, Comet-Yxlon X-ray inspection and high-resolution industrial horizontal CT systems, Nisene automated acid decapsulation systems, and Royce automated die sorters and bond testers. For reliability work, it includes Heller reflow and pressure-curing ovens, Microtronic solderability testers, and Web Technology centrifuges and bubble testers. For photolithography, Teltec Semiconductor Pacific Limited represents Kayaku Advanced Materials photoresists for lift-off, MEMS, compound semiconductors, e-beam lithography, wafer bonding, and wafer-level packaging, Nippon Kayaku dry-film resists for MEMS and wafer-level packaging, OAI mask aligners and exposure systems, and Abet solar simulators and IQE, IV, QE, and IPCE measuring systems. Wafer-processing tools include CEE spin coaters, bake plates, developers, bonders, and debonders, AML in-situ aligned wafer bonders, and Ultra t wafer, substrate, and mask cleaners. Surface modification and cleaning offerings include PVA Tepla MW/RF plasma cleaning systems and Jelight UVO cleaners. Vacuum-deposition and wet-processing offerings include Veeco ALD systems, Denton Vacuum thin-film deposition systems, and Chemcut wet-processing equipment. The represented range also includes XinSheng automated molding systems, Capon automated die bonders, Micocontrol Electronic automated laminators and delaminators, and BNC pulse and delay generators.
Exhibits
Shadow Moire is a non-contact, full-field optical technique that measures relative vertical displacement at each image pixel from geometric interference between a reference grating and its shadow on the sample, using a Ronchi-ruled white-line light source at approximately 45 degrees to the grating, a camera perpendicular to the grating, and an optical configuration integrated with a heating chamber. Akrometrix Studio integrates software modules for surface characterization and analysis and, with the TherMoiré AXP 3 surface measurement system, provides modular metrology solutions for fast, comprehensive characterization of microelectronic components and assemblies. KMPR is used as a high-aspect-ratio DRIE etch mask and as a plating mold for MEMS and biological devices; compared with SU-8, its reduced cross-link density makes stripping easier before hard bake, and it can be developed in PMGEA or TMAH developer. PermiNex 1000 and 2000 are photo-imageable wafer-bonding adhesives for cavity structures such as BAW, SAW, CIS packaging and microfluidic applications requiring precision alignment and low-temperature processes. PMMA is offered for imaging and non-imaging microelectronic uses including direct-write e-beam T-gate fabrication and temporary wafer bonding for wafer thinning, where it can act as a protective layer and temporary adhesive; e-beam or X-ray exposure creates polymer chain scission that enables high-resolution patterning through a solubility difference between exposed and unexposed regions. AML in-situ aligned wafer bonders support alignment, activation, and bonding in one platform and are used for MEMS, IC, III-V bonding, embossing, imprinting, nanoimprint, and other pattern-transfer work, with AWB-04 for 3-inch, 4-inch, and 6-inch wafers and AWB-08 for 6-inch and 8-inch wafers. The AML AWB platform supports bonding pressure up to 40 kN, optional UV curing, anodic-bonding voltage up to 2.5 kV, wafer spacing up to 30 mm, 1 µm in-situ alignment with visible and infrared light sources, optional near-infrared imaging, in-situ plasma activation for low-temperature direct bonding, chamber pressure from 10-6 mbar to 2 bar, and independently controlled platens up to 560 degrees C; ROCK-04 and ROCK-08 add ultra-high-vacuum capability to 10-8 mbar and specialized processes including getter activation and in-situ formic-acid treatment for Cu-Cu bonding. Bruker Dimension FastScan Pro provides automated or semi-automated nanoscale AFM metrology for industrial R&D, QA, QC, and failure analysis, supports automatic measurement of 2-inch to 12-inch wafers for semiconductor, hard-disk, and HB-LED work, can access a 200 mm wafer area with an optional 300 mm stage, and provides topography, roughness, and other metrology analysis with FastScan and 90 µm-range Icon scan heads. AutoMET software supports multi-point automated measurement, optical and AFM pattern recognition, probe-tip centering, blank and patterned wafer testing, while Dimension Edge adds electrical and mechanical characterization, closed-loop scanning, liquid measurement, and temperature-controlled work from -35 degrees C to +250 degrees C with localized nano-thermal analysis up to 400 degrees C. PVA TePla GIGAfab A200/300 is an array-microwave plasma system for semiconductor devices and wafer manufacturing, supports MES communication, 200 mm or 300 mm wafers, cassette or FOUP storage with SMIF interfaces, up to 300 mm wafer size, 2000 W maximum power, a 2.45 GHz array microwave source, QNX-based control, real-time process monitoring, and throughput of 35 to 80 wafers per hour depending on process, with an etch temperature range of 100 to 280 degrees C. Heller Mark 7 reflow ovens use low-profile heating modules, flux-recovery and cooling designs, can reduce nitrogen consumption by up to 40 percent, support cooling slopes above 3 degrees C per second, and provide CPK process monitoring, while Mark 5 systems are designed for high-volume production with line speed up to 1.4 m/min, low delta T, CPK software, and reduced nitrogen and power consumption. Heller also offers Pressure Reflow Ovens with standard pressure up to 8 bar and optional pressure up to 20 bar at up to 300 degrees C, inline vacuum-assisted reflow designed to reduce solder voids, formic-acid fluxless reflow compliant with SEMI S2/S8, and vacuum-clamping reflow for controlling wafer or substrate bow and warp in inline production. Royce AP+ is an automated die sorter for die pick-and-place with tray placement from 0.2 to 25 mm2, tape placement from 0.5 to 17 mm2, wafer input up to 300 mm, placement repeatability of plus or minus 12.5 µm, throughput up to 2000 UPH, and a Keyence CV-X vision system using a 21 mp camera for submicron 0.85 µm-per-pixel inspection and defect detection down to 2 µm. Royce DE35-ST and DE35-300 semi-automatic systems support 150 mm and 200 mm wafers with wafer diameter up to 300 mm, minimum 200 µm die pickup, optional backside and side inspection, and throughput of 500 to 1200 UPH depending on product, while Royce 650 performs wire-bond pull, ball shear, BGA ball shear, die shear, and high-speed ball shear testing with less than 1 µm X/Y resolution, plus or minus 0.1 µm Z resolution, plus or minus 0.1 percent system accuracy, and compliance with MIL-STD-883, MIL-STD-750, ASTM F1269, JESD22-B117, JESD22-B116, and CE; Royce 610 and Royce 620 provide dedicated and multipurpose pull-testing configurations.
Capabilities and products
- thermal warpage and strain metrology systems representation (Akrometrix)
- thin-film stress and thickness measurement systems representation (FSM)
- gold or carbon coaters for SEM/TEM representation (Denton Vacuum)
- X-ray inspection and high-resolution industrial horizontal CT representation (Comet-Yxlon)
- automated acid decapsulation systems representation (Nisene)
- automated die sorters representation (Royce)
- bond testers representation (Royce)
- reflow ovens representation (Heller)
- pressure-curing ovens representation (Heller)
- solderability testers representation (Microtronic)
- centrifuges representation (Web Technology)
- bubble testers representation (Web Technology)
- semiconductor lithography photoresists representation (Kayaku Advanced Materials)
- dry-film resists representation (Nippon Kayaku)
- mask aligners representation (OAI)
- exposure systems representation (OAI)
- solar simulators representation (Abet)
- IQE/IV/QE/IPCE measuring systems representation (Abet)
- spin coaters representation (CEE)
- bake plates representation (CEE)
- developers representation (CEE)
- wafer bonding and debonding equipment representation (CEE)
- in-situ aligned wafer bonders representation (AML)
- wafer, substrate and mask cleaners representation (Ultra t)
- MW/RF plasma cleaning systems representation (PVA Tepla)
- UVO cleaners representation (Jelight)
- ALD deposition systems representation (Veeco)
- thin-film deposition systems representation (Denton Vacuum)
- wet-processing equipment representation (Chemcut)
- automated molding systems representation (XinSheng)
- automated die bonders representation (Capon)
- automated laminators and delaminators representation (Micocontrol Electronic)
- pulse and delay generators representation (BNC)