At a glance
| Booth | K2490 |
| Country | TW |
| Product categories | Device Handling; Feeding Systems · Die Sorter; Pick & Place; Flip Chip Placement Systems · Logic Test Systems · Test Sockets; Contactors and Contact accessories · Sales; Manufacturers Representation or Distributors |
| Website | www.tekcrown.com |
Company profile
Tek Crown was founded in 2007, and majored in Semiconductor IC test interface. Tek Crown is authorized by Kobelco (C3 coating), MIXNUS (Spring Probe) and Princo. We are dedicated in providing customers professional products and services.
Exhibits
Advanced Semiconductor Testing & Sorting Solutions Topleading Intel provides high-efficiency, high-precision testing and sorting solutions for discrete components, including chip capacitors, resistors, and tantalum capacitors. Our systems utilize a mature turret platform combined with self-developed AI vision inspection and electrical testing software to ensure automotive-grade reliability and Industry 4.0 compatibility. Ultra-High Speed & Industry-Leading Precision Ultra-Miniature Support: Compatible with 01005 size (the industry's smallest: 0.2 × 0.1 mm ). High Precision: Positioning accuracy of 0.001 mm Modular Design: Flexible integration of vision and electrical test modules to meet specific defect detection needs. Applications: Single-layer chip capacitors, MLCC, and chip resistors. Dynamic TCR: Automatic measurement at user-defined temperature points for high-temperature TCR testing. Safety & Durability: Includes DC Withstand Voltage (WV) and Pulse Withstand testing to filter out devices with surge vulnerabilities. Voltage Range: Provides high-voltage testing up to 150 V D C, covering the full series of tantalum capacitors. Applications: High-density storage chip stacking and advanced memory packaging. Flexible Three-in-One Detection: Designed for low-volume, high-variety production with a flexible mechanical platform. It supports components as small as 0.254 × 0.254 mm with a throughput of up to 2K UPH. Desktop Tri-Temperature Sorter: Offers active temperature control from -55℃ to 125℃, featuring a dry gas purge to prevent condensation during low-temperature testing. BNx-3000 Burn-in System: Supports up to 20,000 channels for independent monitoring and precise control (RT to 150℃). Includes an energy-saving feedback load system. AI-Powered Vision: Self-developed AI software framework for high-precision defect analysis. Data Management: Full storage of images and test data for historical traceability and smart monitoring. Industry 4.0 Ready: Standard API interfaces to assist customers in achieving digitalized and intelligent manufacturing. WEE TEST SOCKET POGO PIN STAMPED SPRING PROBE C3 COATING TF+ SUBSTRATE TEECONS PARIPOSER CHANGE KIT CONTACT FINGER RF SYSTEM PROBE STATION SYSTEM
Capabilities and products
- 0.001 mm positioning accuracy for test and sorting equipment
- 01005-size ultra-miniature component testing support
- AI vision inspection and electrical testing software
- BNx-3000 burn-in system
- DC Withstand Voltage and Pulse Withstand testing
- Kobelco C3 coating for test interfaces
- MIXNUS Spring Probe supply
- high-voltage testing up to 150 V DC
- semiconductor IC test interface products
- testing and sorting for chip capacitors, resistors and tantalum capacitors