At a glance
| Booth | R8222 |
| Country | JP |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Packages; Ceramic and Other High Temp Compounds · Preforms; Lids · Scribe Tools; Saw or Dicing Blades and Accessories · Solder; Solder Balls and other Soldering Materials · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Spin on glass material · Surface protection material; coatings · Spacer Materials · Gases Materials · Mask plate blanks; Glass · Materials, Nanotechnology · Consumables · CMP; Grind; Lap; Polish; Abrasive materials · Deposition Supplies · Deposition/Target Materials · Ingots · Plating Materials · Polysilicon or granular polycrystalline silicon; Crystal growing Material · Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN) · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Gallium Arsenide (GaAs); Sapphire Substrates · Prime; Polished; Mirrored Wafers · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · Strained silicon; Engineered Substrates · Substrate Materials · Raw Material & Custom components; Metal · Raw Material & Custom components; Plastic · Sensors · Windows · Analytical Standards; Calibrators · Tools |
| Website | www.tecnisco.co.jp/en |
Company profile
TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices. Now, with “ The TECNISCO WAY “which clearly defined our corporate values, every single staff member of our company continuously challenges creativity and evolution. With our advanced "Cross-edge" technology, we promise that we will continue to provide first-grade products and services to our customers to become a real solution partner who can realize what our customers really want. We will greatly appreciate your continued support and encouragement.
Capabilities and products
- adhesives, epoxies, die attach compounds and underfill materials
- ceramic packages and high-temperature compounds
- cutting, grinding and polishing technologies
- metalizing and bonding technologies
- precision-component cutting services
- scribe tools, saw or dicing blades and accessories