At a glance
| Booth | R8222 |
| Country | JP |
| Website | www.tecnisco.co.jp/en |
Company profile
TECNISCO, LTD. was established in 1970 as a processing service provider for precision components, using DISCO Corporation's cutting and grinding technologies. Since its founding, the company has expanded its processing range from cutting and grinding to a five-technology Cross-edge approach that combines cutting, grinding, polishing, metalizing, and bonding. TECNISCO, LTD. organizes its established operations around two core businesses, Metal Components and Glass Components, using combinations of its processing technologies to address customer requirements. The company states that it can support customer needs from prototype through mass production with its own processing solutions. Its processing and component work supports high-technology products in optical communication, industrial lasers, AV and mobile equipment, projectors, automotive applications, and medical devices. The company's products and services are also described as being adopted across seven global markets: industrial machinery, optical and wireless communication, automotive, life science, mobile equipment, aerospace, and environment and energy. Examples of end products supported by its components include industrial robots, sensors for automatic-driving devices, head-up displays, DNA-analysis equipment, head-mounted displays, advanced medical equipment, deep-ultraviolet LEDs, and vibration-sensor devices. In 2017, TECNISCO, LTD. established TECNISCO Advanced Materials Pte. Ltd. in Singapore to launch a materials business and develop and mass-produce new materials internally. The stated purpose of that materials initiative is to add further value to the Cross-edge technology base by combining in-house material development and manufacturing with the processing capabilities the company has cultivated. Under The TECNISCO WAY, which defines its corporate values, the company says its staff continue to challenge creativity and evolution while it seeks to provide first-grade products and services and act as a solution partner for customers.
Exhibits
TECNISCO, LTD. supplies metal products including heatsinks for optical communication, industrial lasers, power-semiconductor devices, and MPU applications. Its listed metal-product families include metal-diamond composites, microchannel coolers, high-pressure seamless microchannels, insulation-type Cu-AlN-Cu submounts, CuW submounts, and mounts or carriers. The silver-diamond metal-diamond composite is described as combining excellent thermal conductivity with relatively low thermal expansion, producing a long-lasting material intended for high-power applications. A CuW submount is used as a heat sink for high-power LD modules; the company states that LD alignment, a sharp edge, and warpage control are available to support effective thermal conductivity. For the LD bonding area, AuSn vapor deposition can be used to control redundant solder. The glass-product range covers display devices for projectors, sensors, mobile devices, semiconductors, and biotechnology or medical equipment, and also includes processing of chemically strengthened glass for touch-panel applications. Named glass products include through-glass via, or TGV, micro-hole glass, microfluidic glass, cavity and cap glass, mesh glass, spacer glass, and chemically strengthened glass. TGV is presented for three-dimensional wafer-level packaging, where it can support semiconductor-device miniaturization and improve high-frequency characteristics through metal vias. TGV supports anodic bonding with silicon wafers and uses a non-adhesive process that the company says can solve out-gassing issues. Its electrical characteristics include low stray capacitance compared with TSV, low inductance, and low electrical resistance through the use of metal rods, and the platform is described as suitable for WL-CSP MEMS packaging and RF applications. The TGV specifications support wafers up to φ200mm, a minimum thickness of 0.3mm, a minimum via diameter of φ0.15mm, a hole-size tolerance of ±0.02mm, and a maximum aspect ratio of 1 : 5. Via materials include Si and W, and the stated via hermeticity is 1×10-9 Pa・m3/s; straight vias are listed together with available cavity, metallization, and bump processes. The TGV line is associated with AV and mobile products, automotive pressure and acceleration sensors, gyroscopes, semiconductor RF-MEMS switches and image sensors, and medical pressure sensors. For glass processing beyond TGV, micro-hole glass can support device miniaturization when combined with semiconductor or electronic parts, while cavity glass can form high-precision cavities with thin, transparent cavity bottoms. Mesh glass can be used as a general-purpose via wafer after electrode formation and is also described as suitable for cell-culture systems; spacer glass is intended for multilayer packaging with semiconductor wafers such as MEMS devices. Microfluidic glass uses glass with thermal and chemical resistance and supports flexible three-dimensional microfluidic-channel design for biotechnology and medical applications. TECNISCO, LTD. also lists drilling-tool products, where an all-blade core drill is described as significantly extending processing-quality life, together with diamond tools. Other supplied materials and parts include Si, Al2O3, Al, sapphire, silicon products, and silicon wafers for dicing tests, extending the product range beyond metal and glass components. The TGV specifications also list fine via-pitch tolerance, consecutive pitch ＜±20μm/φ200 mm wafer, consecutive Via pitch ＜±20μm, and Via-Glass gap values of 0μm〜3.0μm as standard, 0μm〜1.0μm for Option 1, and -3.0μm〜0μm for Option 2.
Capabilities and products
- precision component cutting
- precision component grinding
- precision component polishing
- precision component metallization
- precision component bonding
- metal-diamond composites
- microchannel coolers
- high-pressure seamless microchannels
- insulation-type Cu-AlN-Cu submounts
- CuW submounts
- through-glass via (TGV) substrates
- micro-hole glass
- microfluidic glass
- cavity glass
- mesh glass
- spacer glass
- diamond tools
- chemically strengthened glass processing