Technic, Inc.

At a glance

Company profile

For more than 80 years, Technic, Inc. has described itself as a global leader in semiconductor process chemistries, analytical control systems, and advanced packaging technologies. The company serves leading semiconductor manufacturers, foundries, OSATs, and equipment suppliers worldwide, with solutions intended to improve process control, enhance yields, and enable next-generation semiconductor devices. Its broader technology identity combines specialty chemistry, equipment, and analytical control tools. Technic's range includes process chemicals, surface-finishing equipment, engineered powders, and analytical control tools that it says are used around the world.

Exhibits

For semiconductor fabrication, Technic supplies photoresist strippers, metal etchants, and cleaners, including products used for semiconductor processing and surface preparation. Its Semcon semiconductor equipment range covers laboratory and small-scale production electroplating technologies as well as fully automated production equipment for electroless processes such as ENIG and ENEPIG. The Semcon equipment range extends from single-cell countertop testing devices to fully enclosed automatic rack-transport systems with multi-programmable functions. The Semcon 1000 Wafer Plating Tool is designed for research and low-volume production and is used for wafer electrodeposition evaluation and application-performance testing. The Semcon Fountain builds on Semcon 1000 single-wafer processing for R&D and small-scale production with a patented chamber design and solution sparger intended to resemble a full-scale production environment more closely. The Semcon 2000 is a wet-bench, multiprocessing electroplating tool intended to provide plating accuracy with high uniformity and repeatability. The Semcon 2500 is an automatic, fully enclosed, multi-wafer rack system for electroless and immersion processes such as ENIG and ENEPIG, using a programmable multi-process interface and maintenance/changeover access for process development or full-scale production. Technic's Wafer Test Cell provides a portable wafer-plating environment for laboratory research, small-scale production testing, and sampling of plated wafers. Technic's semiconductor electroplating chemistry is marketed under the Elevate® name and covers high-performance electroplating for copper, nickel, tin, and precious metals. Its semiconductor fabrication and packaging chemistries are used in advanced packaging platforms including FOWLD, Fan-In WLP, Flip Chip, and 2.5/3D. For copper, Technic supplies multiple plating processes intended to meet semiconductor application requirements across different production tool sets. For nickel and tin, the company lists a standard nickel process, a boric-acid-free nickel process, and a pure-tin process presented as a silver-free solder-cap option for advanced packaging. Its precious-metal range extends from sulfite-gold chemistry to a one-step gold-tin alloy plating bath. Across the semiconductor portfolio, the combined offering therefore covers electroplating chemistry, wafer-plating equipment, photoresist stripping, etching, cleaning, analytical control tools, and other surface-finishing technologies. The equipment and chemistry are positioned for both research and production contexts, from portable or single-wafer evaluation tools through multi-wafer automatic systems and packaging chemistries used in production platforms. Within its semiconductor offering, Technic groups electroplating chemistry into copper, nickel and tin, and precious-metal processes, with sulfite gold, cyanide-based gold, and other precious metals listed under the precious-metal category. The same semiconductor offering includes photoresist strippers, metal etchants, cleaners, Analytical Control RTA, High Purity Chemistry, Semcon 1000, Semcon Fountain, Semcon 2000, Semcon 2500, and Semcon Wafer Racks. The materials portfolio likewise identifies semiconductor categories for copper, nickel and tin, precious metals, photoresist strippers, metal etchants, cleaners, analytical control, high-purity chemistry, and Semcon wafer equipment. Technic also lists industrial pretreatment chemistry such as cleaners, activators, and etchants, along with electrolytic plating for nickel, tin, silver, copper, and zinc in the EU, showing that its surface-finishing platform extends beyond the semiconductor-specific products. For printed circuit boards, Technic includes photoresist developers and strippers, preclean and microetch products, desmear chemistry, metallization, copper and tin plating, electroplated final finishes, and immersion finishes such as ENIG, ENEPIG, EPIG, and ISIG. Additional listed process categories include imaging products, photoimageable materials, TechniFlex LCL, IRP Thermosetting Inks, LED Inks, Peelable Masks, and Process Control EBA. Technic's equipment range also includes wafer-plating test cells and a broader set of equipment categories, linking chemistry development and process control with hardware used for plating and surface finishing. By covering copper, nickel, tin, precious metals, stripping, etching, cleaning, high-purity chemistry, analytical control, and multiple Semcon tool formats, Technic presents a semiconductor process portfolio that spans chemistry selection, wafer treatment, plating execution, and bath or process monitoring.

Capabilities and products

• photoresist strippers for semiconductor fabrication
• metal etchants for semiconductor fabrication
• cleaners for semiconductor fabrication
• laboratory/small-scale production electroplating technologies
• wet-bench multiprocessing electroplating equipment
• electroless process equipment for ENIG/ENEPIG
• portable wafer plating test cell
• copper electroplating chemistry
• nickel electroplating chemistry
• tin electroplating chemistry
• precious-metal electroplating chemistry

Related product topics

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