At a glance
| Booth | I3106 |
| Country | TW |
| Website | tdmc.com.tw |
Company profile
TDMC CO., LTD. focuses on New Diamond Material solutions for semiconductor and packaging applications, placing diamond materials at the center of its development work. The company cites diamond properties including thermal conductivity of 2200 W/m·K, a low Coefficient of Thermal Expansion, electrical insulation, and extreme hardness as the basis for addressing thermal-management challenges in next-generation high-power electronic components. Its material supply includes Single-Crystal Diamond Plates, Polycrystalline Diamond Plates, and Diamond Powders in both single-crystal and polycrystalline forms. Beyond supplying material, TDMC states that its team brings over 20 years of electronics-industry integration experience and provides customized one-stop OEM work covering Precision Cutting, Grinding, Polishing, Drilling, Surface Modification, and Metallization. TDMC also describes more than 20 years of experience in semiconductor vacuum-plasma applications, progressing from vacuum equipment through plasma treatment, etching, PVD, and sputtering to specialization in MPCVD technology for diamond crystal growth. The company says its diamond-manufacturing capabilities and processing can be customized to customer needs, while cultured diamonds can be mass-produced for thermal-conductivity, cutting, and other industrial applications. Its stated technology chain spans vacuum plasma, CVD diamond growth, material processing, thin-film work, etching, and heterogeneous integration, combining diamond production with downstream fabrication and integration services.
Exhibits
For diamond components in Taiwan, TDMC lists customized OEM services that include cutting, grinding, polishing, drilling, photolithographic circuits, TDV, backside power delivery, and packaging foundry work. The company presents CVD single-crystal diamond with thermal conductivity up to 2200 W/mK, Mohs hardness 10, broadband transparency from UV to infrared, electrical insulation, and chemical stability for extreme environments. Its polycrystalline diamond materials are described as offering a different cost-performance option, thermal conductivity of 800 W/mK and above, the ability to make larger material sizes, adjustable grain size and orientation, and suitability for mass-production requirements. MPCVD diamond growth is used to cultivate diamond in a controlled environment, with crystal size, purity, and properties adjustable according to requirements. Plasma Modification Technology uses plasma energy to change material-surface properties, with the stated functions including surface activation and adjustment of hydrophilic and hydrophobic behavior. For a diamond substrate used in power-device thermal management, TDMC describes a one-stop route from CVD single-crystal diamond growth through drilling and lithography to packaging services for high-heat IC applications. Its PVD Thin Film Technology covers electron-beam evaporation, thermal evaporation, and molecular-beam epitaxy for producing thin-film materials. Heterogeneous Integration Technology combines diamond with other materials to create functional composite structures and provide customized plug-and-play material solutions. Precision Etching Technology uses high-precision plasma etching for microstructures, including reactive-ion etching and deep silicon etching. The listed thermal-material post-processing services include precision cutting to ±1μm accuracy, surface polishing and etching treatment, customized shape processing, and multifunctional integrated design. TDMC's heterogeneous-integration offering also names reliable material-bonding technology, structural-configuration design, multiple-function integration, system-performance optimization, and complete testing and verification. In semiconductor thermal management, the application list covers power devices, LEDs, and 5G communication equipment, while other stated uses include precision cutting tools, optical components, electronic packaging, scientific instruments, medical devices, aerospace equipment, and energy technology. For optical uses, the company lists high-power laser windows, UV optical components, and infrared-detector materials; for scientific uses, it lists components for synchrotron radiation, neutron scattering, and other experimental equipment. For electronic packaging, TDMC lists multifunctional packaging solutions for high-frequency, high-power devices, connecting its diamond-material and integration capabilities directly with packaging applications. The same material platform is also presented for GaN and SiC thermal management and for heterogeneous combinations intended to address high-heat dissipation requirements. TDMC also summarizes single-crystal diamond thermal conductivity at 2200 W/mK and polycrystalline diamond at 800 W/mK+, alongside Mohs hardness 10 and a stated 100% customized-service capability. TDMC also displays 22 years of professional experience as a company metric. Its thermal-management application text specifically names high-power heat dissipation, high-frequency heat dissipation, high-current heat dissipation, GaN heat dissipation, and SiC heat dissipation. TDMC describes the application fields for its diamond materials as wide and diverse.
Capabilities and products
- Single-crystal diamond heat-spreading substrates with thermal conductivity up to 2200 W/mK
- Polycrystalline diamond heat-spreading substrates with thermal conductivity above 800 W/mK
- Supply of single-crystal and polycrystalline diamond powders
- Custom MPCVD diamond crystal growth
- Precision diamond-material cutting with ±1 μm accuracy
- Plasma surface activation and hydrophilic/hydrophobic modification
- Electron-beam evaporated thin films
- Thermally evaporated thin films
- Molecular beam epitaxy
- Heterogeneous material bonding and integration with diamond
- Microstructure processing by reactive ion etching
- Deep silicon etching
- Diamond grinding
- Diamond polishing
- Diamond drilling
- Photolithographic circuit processing for diamond components
- TDV processing for diamond components
- Backside power delivery processing for diamond components
- Contract packaging of diamond components
- Diamond surface metallization