At a glance
| Booth | I3106 |
| Country | TW |
| Website | tdmc.com.tw |
Company profile
TDMC is dedicated to becoming a global leader in "New Diamond Material" solutions. We specialize in semiconductor and packaging applications, placing diamond materials at the core of our innovation. Leveraging diamond’s exceptional properties—including an ultra-high thermal conductivity of 2200 W/m·K, low Coefficient of Thermal Expansion (CTE), superior electrical insulation, and extreme hardness—we provide the ultimate material solution for the thermal management challenges of next-generation high-power electronic components. To meet the diverse demands of various market applications, we offer a wide range of diamond material forms, including Single-Crystal Diamond Plates, Polycrystalline Diamond Plates, and Diamond Powders (Single-Crystal/Polycrystalline). Beyond material supply, our team brings over 20 years of integration experience in the electronics industry. We provide clients with customized, one-stop OEM services and tailored fabrication, including Precision Cutting, Grinding, Polishing, Drilling, Surface Modification, and Metallization. We are committed to being a steadfast pillar in the global semiconductor thermal management field, assisting our customers in overcoming heat dissipation barriers to achieve peak performance. We welcome any inquiries or collaborative ideas regarding diamond material applications. Let us work together to drive the technological revolution powered by "New Diamond Materials."
Capabilities and products
- Diamond Powders (Single-Crystal/Polycrystalline)
- Polycrystalline Diamond Plates
- Single-Crystal Diamond Plates
- diamond materials for semiconductor and packaging applications
- diamond precision cutting, grinding, polishing and drilling
- diamond surface modification and metallization
- diamond thermal management for high-power electronic components