At a glance
| Booth | M1258 |
| Country | TW |
| Website | tazmo.co.jp/products_cate/handoutai |
Company profile
TAZMO Apprecia Formosa Inc. is the Taiwan exhibitor linked to TAZMO's semiconductor and display manufacturing-equipment business. TAZMO's semiconductor manufacturing portfolio covers coat and develop equipment, bonding and debonding equipment, cleaning equipment, and systems for chemical supply and regeneration. The company also develops and manufactures equipment for liquid-crystal displays and other flat panels, including slit coaters used for LCD color filters. Its LCD color-filter slit coater is described as having a high share worldwide, while nanoscale thin-film coating is part of the technology base TAZMO uses to strengthen its position in this field. TAZMO develops transfer systems that emphasize accurate and rapid movement together with space saving, and its wafer-transfer robots combine high throughput, high-precision handling, stable operation, long maintenance-free operation, and application functions added in response to user requirements. Drawing on experienced technical specialists and equipment-business know-how, TAZMO approaches mass production and provides total solutions spanning optical simulation, mold fabrication, etching, and inspection, while using its development capability to address changing needs and different applications.
Exhibits
For semiconductor processes, the supply range explicitly includes bonding and debonding equipment together with CMP slurry supply systems. After mechanical debonding, residual material can be cleaned automatically as part of the process flow. The TWH series includes a carrier mechanical-debonding and cleaning system for devices bonded with thermosetting or thermoplastic materials; it removes the carrier and automatically continues through residue cleaning. Because the TWH carrier mechanical-debonding and cleaning system handles the device on a tape frame, the device can theoretically be thinned toward the limit that the handling scheme permits. Its multi-layout platform can be supplied as individual units or configured as equipment, with mechanical-debonding and cleaning units, safety specifications including explosion-protection and fire-code requirements, and a GUI intended to simplify operation and recipe editing. The TWH-SR-CC series is specified for 8-inch and 12-inch dicing frames, can use a dicing-frame cassette or load port, includes an EFEM robot and aligner, and can accommodate one mechanical-debonding unit and up to two cleaning units. The TWH-PL peel system removes residue remaining on the device surface after carrier separation by using peel tape in a dry process; its listed work size is 200 or 300 mm wafers, pressure is 0 to 300 N, speed is 0 to 20 mm/sec, and tape-core inner diameter is 76.8 mm. The TWH-SR mechanical-debonding system handles 150 to 300 mm wafers with Si or GLASS carrier substrates, processes wafers attached to a dicing frame, uses a porous chuck and TAZMO original blade, and operates at room temperature. The TWH-CC tape-frame cleaning system cleans a device surface while the wafer remains attached to the tape frame; it supports 8-inch and 12-inch tape frames, 0 to 1500 rpm rotation, two nozzle lines, high-step device shapes, selectable nozzles, optional two-fluid spray and ultrasonic cleaning, and selectable waste-liquid filtration. The WH-BD bonding system processes 200 or 300 mm workpieces, lists X-Y alignment accuracy of 30 μm, bonding pressure of 20 kN for 300 mm and 10 kN for 200 mm, electrostatic chucks, temperatures up to 250℃, vacuum pressure below 10 Pa, and bonding accuracy of TTV below 3 μm under the stated bare-wafer condition. The TWS coating and bonding system was developed to support ultra-thin wafers for advanced three-dimensional packaging and device thinning, applying a uniform coating, bonding to a carrier, and curing with ultraviolet light. For the TWS coating and bonding process, TAZMO lists throughput above 25 WPH, TTV below 3 um, room-temperature bonding with UV-curable resin to reduce thermal shock, reusable support substrates, a glass-recycling option, and a fully dry bonding and debonding process. The TWS 2000 series covers 150 to 200 mm wafers and the 3000 series covers 200 to 300 mm wafers, with GLASS carrier substrates and cassette formats that include OPEN or double-pitch cassettes for the 2000 series and FOUP/FOSB for the 3000 series. The TWS carrier-debonding system irradiates through the Glass side to remove a release layer from work bonded with UV-curable material, then uses a PEEL mechanism for adhesive remaining on the device surface; it lists a YAG laser, dicing-tape-frame compatibility, an optional frameless configuration, and a fully dry process. The TWS carrier release-layer coating system cleans the glass support and applies the release-layer film required before bonding; an ID-management function counts how many times the glass has been used, and the coating process draws on TAZMO coater know-how for difficult release-layer liquids. The TWS carrier cleaning system removes residue from recovered supports after demounting and is arranged around a robot-transfer axis with a canister cabinet and cleaning cup; both the 2000 and 3000 series cover glass supports in the listed 150 to 200 mm and 200 to 300 mm ranges. TAZMO's broader semiconductor-equipment examples also include pre-aligners, phosphoric-acid reclaim systems, wet single-wafer cleaning and etching equipment, bonding equipment, inkjet systems, and laser-assisted equipment.
Capabilities and products
- semiconductor coating/developing equipment
- wafer bonding/debonding equipment
- semiconductor cleaning equipment
- chemical supply/regeneration systems
- CMP slurry supply system
- carrier mechanical debonding with automatic residue cleaning
- 8/12-inch tape-frame wafer cleaning equipment
- 200/300 mm wafer bonding equipment
- automatic coating and bonding for ultra-thin wafers
- carrier release-layer film deposition
- post-debond carrier residue cleaning