At a glance
| Booth | S7858 |
| Country | JP |
| Website | tanaka-preciousmetals.com/tw |
Company profile
TANAKA PRECIOUS METAL GROUP CO., LTD. was founded in 1885 in Tokyo and has more than 140 years of history in precious metals. The group works with gold, platinum, palladium, silver, and other precious-metal materials through refining, processing, application development, and recycling, supplying high-technology industries including semiconductors, electronics, automotive, energy, and medical. After beginning with currency and precious-metal trading, TANAKA expanded into industrial applications as Japan industrialized and as global technology industries developed. In the early twentieth century, the company applied platinum to industrial uses including catalysts, electrode materials, and laboratory equipment, establishing a foundation in industrial precious metals. As semiconductor and electronics industries expanded, TANAKA invested in advanced-material development and became one of the early companies developing bonding wire and precious-metal materials for semiconductor packaging. From the 1960s, it began mass production of gold wire and bonding wire for semiconductors and later expanded into copper wire, silver wire, and high-reliability packaging materials. Its current product and technology portfolio serves semiconductor packaging, power devices, automotive electronics, communications equipment, and high-reliability electronic components and includes bonding wire, plating materials, catalyst materials, and advanced contact materials. The group also develops precious-metal recovery and regeneration technologies and operates a resource-circulation system described as an urban mine. TANAKA has sites across Asia, Europe, and the Americas and uses a global research, development, and manufacturing network to provide consistent quality and technical support. The company is an LBMA and LPPM certified member and states that it has international-level precious-metal refining and inspection capabilities to support quality and credibility against global standards. TANAKA states that it will continue combining materials science with advanced manufacturing technology while developing sustainable, circular, and high-reliability solutions for semiconductor and other high-technology industries.
Exhibits
For parts used in vacuum-deposition equipment, TANAKA uses a nickel-plating method to recover precious metals, electroplating liners so platinum and palladium sputtered films can be removed more easily after semiconductor-manufacturing and related processes. According to application requirements, the company produces products ranging from common compounds such as potassium cyanide and palladium chloride to complex organic precious-metal compounds under a quality-control system. It also supplies precious-metal powders with stable quality based on its technologies for use as materials across different fields. Its halogen-free gold paste for gold-to-gold bonding at 200°C consists only of submicron gold particles and solvent and is designed to provide low electrical resistance and high thermal conductivity in metal bonding. TANAKA describes a precious-metal high-entropy alloy powder as the world's first high-entropy alloy powder made from precious metals, with particle size below 10μm, high crystallinity, and extremely high compositional uniformity. Its precious-metal clad materials use copper or iron-based materials as substrates and can be produced with cladding thicknesses from thin to thick in multilayer and multi-strip configurations. Bonding wire is presented as an important material for electrically connecting semiconductor chips with external circuits, with ball bonding and wedge bonding identified as the two main bonding methods. TANAKA's bonding-wire range extends from fine gold wire for integrated-circuit assembly to silver-alloy wire with high electrical and thermal conductivity, copper and copper-alloy wire positioned for cost performance, and large-diameter aluminum and copper wire for power devices. The company describes its bonding-wire business as a global first supplier and cites SEMI Global Semiconductor Packaging Materials Outlook - 2024 Edition for that statement. For semiconductor-chip and external-circuit connection, TANAKA supplies ultra-fine gold, silver, copper, and palladium-coated copper, or PCC, wires as well as thicker aluminum and copper wires and ribbons for power-device applications. The company states that its wires have smooth, clean surfaces and strong dimensional stability and are paired with its metal-bonding technology to provide application solutions. Gold and gold-alloy bonding wire is backed by more than 50 years of experience and is described as combining chemical stability and electrical conductivity with fine-pitch and low-loop compatibility while maintaining high purity. Silver-alloy bonding wire provides electrical and thermal conductivity together with high reflectivity in the visible-light range, making it suitable for optoelectronic semiconductor devices such as LEDs, and the company states that it can reduce cost by about 80% compared with gold wire. For copper and copper-alloy bonding wire, TANAKA supplies oxygen-free-copper-grade high-purity copper in ultra-fine sizes down to a minimum 15um and states that it can reduce cost by about 90% compared with expensive gold wire. For power devices, TANAKA supplies automotive-grade high-purity aluminum and copper bonding wire in the 100-500µm range and ribbons with widths of 0.5-2.0mm. The company notes aluminum's moisture resistance for power devices carrying large currents in harsh environments and also provides copper wire for power devices where higher electrical conductivity is required. PCC bonding wire is copper wire with a palladium-coated surface and is positioned as reducing cost while maintaining bonding performance and joint reliability. The listed bonding-wire types include Fine Wire at 14um~80um, Thick Wire at φ100μm~500μm, and Ribbon, with material options including Gold, Silver, Copper, Aluminum, and Palladium Coated Copper. The product information also states that TANAKA can provide products made from recycled gold according to customer requirements, linking bonding-material supply with the group's precious-metal recycling capabilities.
Capabilities and products
- precious-metal refining and recycling
- precious-metal recovery from vacuum-deposition equipment parts
- precious-metal compound manufacturing
- precious-metal powder supply
- halogen-free gold paste for Au-Au bonding at 200°C
- precious-metal high-entropy alloy powder below 10μm
- precious-metal clad materials
- gold/gold-alloy bonding wire
- silver-alloy bonding wire
- copper/copper-alloy bonding wire
- aluminum/copper bonding wire and ribbon for power devices
- PCC palladium-coated copper bonding wire