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Taiwan Maxwave Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth S7452

Booth S7452Country TW10 product topics
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BoothS7452
CountryTW
Websitewww.taimax.com.tw/%E9%9B%BB%E5%AD%90%E5%8C%96%E5%AD%B8
Exhibitor profile

Company profile

Taiwan Maxwave Co., Ltd. supplies electronic chemicals, advanced materials and production-related solutions for manufacturing customers, with business fields that also include aerospace and energy-development products and services. Its customer base spans about 700 companies across upstream, midstream and downstream electronics and chemical industries, including semiconductor, display-panel, LED, solar, UV-coating, water-treatment, lithium-battery, ceramic-material, electromagnetic-shielding and X-ray non-destructive-testing applications. The company states that it has more than 20 years of experience and has built partnerships in Japan, Korea, Singapore, the United States and Europe. A laboratory, customer-service center and materials-control center support its stated Just in Time Service approach for technical response and supply. Taiwan Maxwave describes its working method as joining customers in solving process-technology problems and combining customized requirements with product and service support. The company has been listed in the Taiwan region TOP5000 ranking of large enterprises by China Credit Information Service from 2007 onward. It first passed ISO 9001 international quality-management-system certification in 2009 through UKAS and states that it has continued to update the system with later international standards. Its listed management-system certifications include ISO 9001:2015 for quality, ISO 14001:2015 for environmental management, ISO 45001:2018 for occupational health and safety, and ISO 27001:2022 for information security. Electronic chemicals, advanced materials, aerospace products, production overall solutions and energy development are presented as connected business areas rather than isolated product categories. Within production-related services, Taiwan Maxwave also lists automation-equipment planning and design, extending its role from material supply to equipment-planning support.

Exhibitor profile

Exhibits

For IC manufacturing, Taiwan Maxwave supplies chemicals for oxide growth, photolithography, etching, cleaning, impurity diffusion, ion implantation and thin-film deposition, and it can formulate customized etchants and photoresist strippers for those processes. For wafer bumping, including Gold bumping and Solder bumping, its application description covers thin-film or electroless-plating processes combined with electroplating or printing to place solder or gold directly on IC pads, with customized etchants and photoresist-removal agents supplied for the process. Its touch-panel application covers capacitive structures in which conductive material is applied to the screen and glass panel to form charged electric fields in horizontal and vertical directions, and the company supplies process chemicals and customized products for this manufacturing context. The electronic-chemical application range also includes TFT-LCD processes, LED manufacturing and MOSFET BGBM processing, with customized photoresist strippers for epitaxy and customized silicon wet etchants for removing grinding stress and roughening silicon surfaces. Taiwan Maxwave groups its own developed chemicals into metal etchants, photoresist strippers and precision cleaning solutions, including named series such as Ag Etch, Al Etch, PIS, PRS and CLS products. The metal-etchant portfolio covers silver, aluminum, gold, chromium, copper, gallium arsenide, gallium phosphide, indium tin oxide, nickel, titanium, copper-titanium, titanium nitride, titanium-nickel, titanium-nickel-silver, titanium-nickel-copper, titanium-tungsten, silicon and silicon oxide. For silver and aluminum processing, listed products include Ag Etch-126 with selectivity to nickel, Ag Etch-192 with selectivity to molybdenum, Ag Etch-319 for titanium-nickel or vanadium-silver multilayers, Al Etch 85-2-13 as a phosphoric-acid-type standard aluminum etchant, Al Etch 868 for molybdenum-aluminum-molybdenum touch-panel structures, and Al Etch-284 for a smooth post-etch surface. Gold etchants include EGAU-1, EGAU-159, EGAU-183, EGAU-19, EGAU-4 and EGAU-6 as potassium-iodide or iodine-type standard products, EGAU-10, EGAU-16 and EGAU-8 with nickel selectivity, EGAU-309 and EGAU-615 with selectivity to multiple metals, and EGAU-716 with metal selectivity and no residue. Copper-related products include Cu Etch-520 for copper-molybdenum etching, Cu Etch-385 as a hydrochloric-acid-type standard copper etchant, Cu Etch-786 and Cu Etch-816 for UBM copper etching, Cu Etch-855 for low-rate UBM copper etching, and Cu Etch-B15 with selectivity to multiple metals. The same portfolio lists GaAs Etch-539 and GaAs Etch-778 with high selectivity to aluminum arsenide, TFE-640 for gallium-phosphide etching, ITO products BOD Etch-272, BOD Etch-300, ITO Etch-A1, ITO Etch-B1, ITO Etch-C1, TFE-155 and TFE-408, and nickel products Ni Etch-105, Ni Etch-369 and NiV Etch-326. Titanium and related UBM products include Ti Etch-200, Ti Etch-219, Ti Etch-290, Ti Etch-378, Ti Etch-863, Ti Etch-899 A/B and Ti Etch-C15, along with TiCu Etch-621 for samples on glass substrates, TiN Etch-491, TiNi Etch-336, TiNiAg Etch-552, TiNiCu Etch-202 and TiW Etch-833. Silicon-processing products include Si Iso-Etch 1-20-5, Nodule Etch-792, Poly Etch 5-3-3, Poly Etch-199 and Poly Etch-741 for BGBM backside roughening, Poly Etch-227 and Poly Etch-820 for backside etching and stress relief, Poly Etch-904 for boron-doped silicon, BOE and SBOE series for silicon dioxide, and PAD Etch-26M with selectivity to silicon, aluminum and silicon nitride. The photoresist-stripper range addresses polyimide film, positive and negative photoresists, dry film and post-dry-etch photoresist residue, with PIS-509 and PIS-523 for polyimide and multiple PRS products selected for materials or removal conditions. Among the listed strippers, PRS-615, PRS-627, PRS-628 and PRS-816 combine high dissolution capability with selectivity to silver, aluminum and copper, PRS-568 is selective to most metals, PRS-219 removes fully cured SC-450 resist, and PRS-581 is used for dry- and wet-film removal including Asahi and Hitachi films. Post-dry-etch residue products include PRS-018 and PRS-270, while PRS-389 and PRS-777 are listed for residue removal with applicability to gallium-arsenide materials; PIS-723I, PIS-790V and PIS-890V cover dry-film and polyimide removal with metal or copper selectivity. The standard chemical range includes single acids such as DHF diluted hydrofluoric acid, hydrogen peroxide, sulfuric acid, phosphoric acid, acetic acid, hydrochloric acid, hydrofluoric acid, nitric acid and ammonium fluoride. Single-base products include KOH, sodium hypochlorite, sodium hydroxide, ammonium hydroxide, TMAH 2.38%, TMAH 25% and TMAH 2.38% with surfactant. Solvents include 2-Pyrrolidinone, acetone, cyclopentanone, cyclohexanone, DMSO, ethyl ethoxy propionate, ethylene glycol, ethyl lactate, gamma-butyrolactone, HMDS, IPA, MEK, methanol, n-butyl acetate, NMP, PGME, PGMEA and xylene, together with DT-995 and DT-998 cleaners. The advanced-materials range covers natural and synthetic graphite and conductive carbon black for lithium-ion and other batteries, conductive additives, conductive polymers and thermal-management uses. Special acrylic monomers are used as reactive diluents in UV radiation crosslinking and as reaction monomers for coatings, adhesives, inks, photoresists and optical films; Taiwan Maxwave describes low viscosity, high dilution, high reactivity and options for low odor and low skin irritation as selection characteristics. The named special-acrylic-monomer list includes CHA, BZA, PEA, EOEOEA, 1-ADMA, MEDOL-10, CHDOL-10, OXE-10, GBLA, V3F, V4F, V8F, IBXA, THFA, NVP and NVC. CHA, BZA, PEA, EOEOEA, MEDOL-10, CHDOL-10, OXE-10, GBLA, IBXA, THFA, NVP and NVC are listed for UV-curing diluents, UV inkjet inks and adhesive applications, with differences in curing speed, dilution, heat resistance, yellowing behavior and adhesion to substrates such as PMMA or plastics. Fluorinated monomers V3F, V4F and V8F are listed for water- and oil-repellent functions, release agents, anti-fog agents, PU fluorinated additives and anti-fingerprint film materials, with applications including textiles, resin and rubber mold release, agricultural films, PU synthetic leather and touch-panel glass protection. The advanced-materials portfolio also includes functional oligomer resins developed for customer needs with low-energy curing and fast reaction, water-soluble PVP resin, coating-material combinations, and battery and screen-printing materials such as conductive carbon black, graphite, NMP and solvents. For aerospace and industrial inspection, the broader product list includes Carestream digital and conventional non-destructive testing, COMET industrial X-ray equipment, VisiConsult X-ray systems and solutions, KOWOTEST NDT-related equipment and high-energy X-ray linear accelerators.

Exhibitor profile

Capabilities and products

Topic group

Related product topics

Graphite and Carbon Material Purification and MachiningFactory Automation System IntegrationIndustrial X-Ray Inspection SystemsNon-Destructive Inspection EquipmentSpecialty Chemicals and Custom SynthesisCleaning Chemicals & StrippersSemiconductor Process Chemicals and MaterialsAcids And EtchantsElectronic-Grade Process ChemicalsDry-Film Stripper Chemistries
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