At a glance
| Booth | T9304 |
| Country | CN |
| Website | www.ginet.cn |
Company profile
Suzhou Ginet new material technology Co.Ltd is a materials company from Changshu, Jiangsu Province, China, and is presented as a pioneer in conductive copper paste. The company emphasizes customization and independent R&D as explicit operating strengths for its materials business. Its SEMICON materials scope is classified under materials and assembly, with thick film pastes and materials identified as the relevant supply category. The company also emphasizes stabilized performance and cost advantage in the way it positions its material offerings for manufacturing users. The broader material portfolio includes high-end inorganic non-metal powder materials, including electronic-grade, high-purity, ultrafine spherical silica powder for electronic-substrate applications. Those powder materials are associated with high-speed copper-clad laminate, IC substrates, and SLP-like substrates, linking the materials portfolio to electronic packaging and substrate manufacturing. The company’s materials positioning combines conductive copper paste with a wider electronic-materials focus rather than limiting the portfolio to a single paste product. Customization is presented as a customer-facing capability, while independent R&D is presented as the internal development capability behind the product offering.
Exhibits
The exhibit and supply scope centers on conductive copper paste, with customization offered for customer requirements and independent R&D supporting product development. Conductive copper paste sits within a broader materials-and-assembly scope that includes thick film pastes and related materials. For customers working with electronic substrates, the broader material range includes electronic-grade, high-purity, ultrafine spherical silica powder. The listed application areas for the spherical silica powder include high-speed copper-clad laminate, IC substrates, and SLP-like substrates. Together, these offerings position Suzhou Ginet new material technology Co.Ltd around conductive paste, thick-film material supply, customized material development, and inorganic powder materials used in electronic substrate and packaging-related structures. The thick-film-paste category places the conductive copper-paste offering within material systems used in electronics manufacturing and assembly rather than as standalone production machinery. The electronic-grade spherical silica material extends the portfolio toward substrate materials, with high purity and ultrafine spherical morphology identified as product characteristics in the broader materials profile. High-speed copper-clad laminate, IC substrates, and SLP-like substrates are three named application areas for that spherical silica powder, giving the broader material range direct relevance to electronic substrate structures.
Capabilities and products
- conductive copper paste
- material customization