At a glance
| Booth | M1157 |
| Country | TW |
| Website | sunsun-tech.com.tw |
Company profile
SUNSUN-TECH was founded in 2010 and states a vision of becoming part of the driving force behind commercialization of Silicon Photonics. The company describes 16 years of establishment and identifies developments and AI applications in 2022 as a point when it recognized Silicon Photonics as an indispensable technology. In 2023 its technical team began designing and developing FAU bonding and packaging equipment according to the product-manufacturing needs of target customers. SUNSUN-TECH positions itself not only as an equipment supplier but as a technical partner providing integrated solutions for Silicon Photonics and CPO packaging. Its stated approach to CPO commercialization combines precision-alignment equipment with patented resins so customers can address obstacles to mass production. The resulting development direction centers on high-precision bonding and packaging equipment for optical-coupling components rather than general-purpose semiconductor assembly equipment.
Exhibits
The SFM-1000 CPO intelligent packaging machine is a named semiconductor-packaging system developed for Silicon Photonics CPO solutions and high-precision optical-coupling component packaging and alignment. The equipment supports Lens Module three-dimensional advanced packaging and specifies production precision of ±1 um. Its alignment process uses an advanced vision system for positioning and combines that positioning with AI correction computation and control technology. The system processes alignment inspection and bonding functions in parallel, integrating optical positioning with the bonding workflow rather than treating inspection as a separate manual stage. PC Control integrates automatic alignment, dispensing and curing functions within the machine. For material handling, the equipment supports fully automated Wafer table/Tray loading to reduce manual loading steps around the bonding process. The supported process scope includes bonding and inspection of optical-communication components, directly connecting the equipment with photonic-component assembly workflows. A dual-head unit working system is used to raise output and expand machine functionality during automated packaging operations. SUNSUN-TECH develops and produces this high-precision intelligent bonding equipment around CPO requirements created by advanced-packaging performance and communications demands. Together with the company's FAU bonding and packaging development, the SFM-1000, precision-alignment technology and patented-resin approach form an integrated path from optical alignment through dispensing, curing, bonding and inspection. The company's product-technology structure explicitly includes both semiconductor packaging equipment and semiconductor packaging materials, linking equipment development with the resin-based packaging approach described in its CPO strategy.
Capabilities and products
- design and development of FAU bonding and packaging equipment
- precision alignment and bonding equipment for silicon photonics CPO packaging
- Lens Module 3D advanced packaging
- ±1 um precision optical-coupling component packaging alignment
- vision positioning and AI-corrected alignment and bonding
- automatic alignment, dispensing, curing and Wafer table/Tray loading
- patented resins for silicon photonics CPO packaging