At a glance
| Booth | L0327 |
| Country | TW |
| Website | www.sonix.com |
Company profile
Since 1986, Sonix Inc has developed advances in image accuracy and process productivity for wafer and chip manufacturers, with its work centered on acoustic imaging, metrology and nondestructive inspection. Sonix acoustic scanning microscopes are used by leading manufacturers globally for nondestructive inspection of bonded wafers and packaged semiconductors from the development laboratory through the production floor. The systems provide high-resolution images and advanced diagnostic tools that semiconductor designers and fabricators use to verify reliability, qualify new designs, monitor production and improve process control. Sonix Inc states that technology innovation is a core focus, makes substantial R&D investments, develops new solutions for changing market requirements and collaborates with customers on current needs and future innovations. Tektronix became the parent company in Jan/2017, after which the engineering teams worked together on inspection technologies for metrology and nondestructive inspection serving R&D, failure-analysis and production customers. The company emphasizes clearer imaging, higher throughput and responsive support as it develops inspection systems that move from laboratory analysis into semiconductor production use.
Exhibits
Sonix provides manual and automated wafer inspection and metrology systems for wafers from 100mm to 300mm, with extensive analysis at both wafer and device levels for quality control from development through production. AutoWafer Pro is the company's most advanced ultrasonic equipment for detecting defects in bonded wafers in production environments and performs fast, high-resolution scanning of 200mm and 300mm bonded wafers. AutoWafer is a production-ready automatic ultrasonic wafer scanner for wafers from 100mm to 200mm, can process multiple wafer sizes in a single batch, and is described as installed in more wafer applications than all other automatic ultrasonic testing tools combined. ECHO VS adds the Image Enhancement Suite to the ECHO platform for image quality and defect identification, is positioned for development laboratories and high-precision production environments, and can be fitted with an optional chuck for manual wafer inspection. The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in laboratories and on production floors. For packaged-semiconductor development, production and failure analysis, the ECHO can detect air defects as thin as 0.05 micron and spatially resolve defects down to 10 microns for bump detection, stacked-die 3D-packaging inspection, complex flip-chip inspection and traditional plastic packages. Sonix S-series ultrasonic NDT transducers are designed in-house for semiconductor-manufacturing inspection requirements, and Sonix works with customers to select transducers for their applications. Wafer software options are available to enhance bonded-wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to customer-specific requirements. Scanning acoustic microscopy is also presented for visualizing small subsurface features and defects in bonded wafers, packaged semiconductors and industrial materials through nondestructive inspection. For MEMS inspection, Sonix systems support 100% production-yield inspection of microelectromechanical pressure sensors, microphones, gyroscopes, accelerometers and related devices, with high-resolution scanning, production-speed throughput, automated handling and sorting of approved and failed wafers. Pulse2 is described as a robust universal ultrasonic flaw detector for overmolded single-die packages, bare flip chips and other standard applications. Pulse2 supports imaging of defects as small as 10 microns and uses transducers from 15MHz through 200MHz that are designed and matched in-house for different applications and materials. Optional Pulse2 capabilities include Stacked Die Imaging, abbreviated SDI, and Molded Flip Chip Imaging, abbreviated MFCI. Its microscopy-analysis software is intended to improve packaged-semiconductor imaging, accelerate production and adapt ECHO-platform systems to customer-specific requirements, with software options including ICEBERG, WINIC and FLEXIBLE TAMI. Customers can also provide a product sample for an in-depth analysis report and assistance in developing an inspection solution intended to integrate into their process. Product literature, technical papers and FAQs support users with information on scanning acoustic microscopes, transducers, wafer and packaged-semiconductor applications, acoustic-scanning methods and analysis practices. Sonix also provides application resources covering wafer inspection, package inspection and industrial inspection, with technical papers and product literature addressing acoustic scanning, analysis practices and semiconductor applications. The product and application structure separates wafer inspection products, package inspection products, wafer inspection applications, package inspection applications and industrial inspection applications into dedicated categories.
Capabilities and products
- scanning acoustic NDT for bonded wafers and packaged semiconductors
- 100–300 mm wafer inspection and metrology systems
- high-speed high-resolution scanning of 200/300 mm bonded wafers
- 0.05 µm air-gap and 10 µm defect detection
- stacked-die 3D packaging inspection
- complex flip-chip inspection
- 100% MEMS production inspection with automated handling and sorting
- 15–200 MHz ultrasonic NDT transducers
- semiconductor microscopy analysis software