At a glance
| Booth | K2054 |
| Country | CN |
| Product categories | Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic) · Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards) · Structural Circuits; Test; Thermal Fixturing · Test Sockets; Contactors and Contact accessories · Assembly |
| Website | www.smithsinterconnect.com |
Company profile
Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.
Capabilities and products
- semiconductor probe card solutions
- semiconductor test sockets
- test platforms for Package on Package (PoP) devices
- test platforms for area array devices
- test platforms for peripheral devices
- test platforms for wafer-level devices
- test products for fine micro-pitch and high-bandwidth devices