At a glance
| Booth | P6123 |
| Country | SG |
| Website | www.sinetest.com |
Company profile
SineTest Technologies Pte Ltd focuses its research and development on analog/mixed-signal and discrete-device test solutions, with its COT test approach positioned around these device categories. Its technology scope includes real wafer-level DC + switching testing for SiC/IGBT devices, moving switching-parameter verification to the wafer stage so wafer fabs and design houses can identify switching-performance issues earlier in the development cycle. The company also develops modular power-discrete testing that can be configured for new-generation complex power modules such as IPM, giving users a way to assemble test functions for more complicated power-device requirements. Its modular architecture allows discrete DC, Dvsd and UIL functions and other modules to be combined for a customer's test request, and it can mix IC-test modules with discrete-test modules when intelligent power modules require more complex testing. SineTEST describes its wafer-level DC + switching work, IntelliVI™ voltage/current self-check technology and modular discrete-test design as patented technologies and solutions within its tester platform portfolio.
Exhibits
SineTEST supplies a real wafer-level DC + switching test solution, including Ton/Toff. measurement, for SIC/IGBT and related devices, and one description specifies use with a universal prober. IntelliVI™ is a next-generation floating-ground VI-module technology with real-time onboard voltage and current accuracy self-checking, intended to keep VI modules within a user-defined accuracy range over long operating periods and reduce concern about test escapes. The 13-slot STT-700X supports both analog/mixed-signal and discrete-device testing; for analog test configurations it can provide up to 128 digital pins and 208 analog VI channels. For discrete-device work, STT-700X can be configured with DC, UIL, DVSD, RG, CG and Switching modules for multisite CP and FT testing, while its modular design is intended to keep the test configuration flexible with a minimal footprint. The 26-slot STT-700 likewise supports analog/mixed-signal and discrete-device testing, and for mixed-signal devices it can be configured with up to 256 digital pins and 416 analog VI channels. For discrete devices, STT-700 can combine DC, UIL, DVSD, RG, CG and Switching modules for multisite CP and FT testing, extending the same modular test concept to the larger 26-slot architecture. The 6-slot STT-300S is intended for discrete-device laboratory use and engineering debug, and it can be configured with DC, UIL, DVSD, RG, CG and Switching modules for single-site, multi-function testing. With DDC1430 rated at 1400V/30A, the tester is described for small-signal discrete devices such as diodes, transistors and MOSFETs, with the stated objective of fast test time and high UPH. Across these systems, the product family covers analog/mixed-signal IC test, discrete-device test and power-module test, with STT-700X, STT-700 and STT-300S named as main tester products and ThermalFlow - TF8018 also listed in the product navigation. The modular discrete-test concept is also presented as a way for users to compile modules to meet complicated customer test requests, a capability highlighted as increasingly important as intelligent power modules require more complex combinations of IC and discrete-device test functions. SineTEST's application navigation explicitly separates analog/mixed-signal IC test, discrete-device test and power-module test, matching the tester architectures and modular measurement resources described across the STT platform family.
Capabilities and products
- analog/mixed-signal IC test systems
- discrete-device test systems
- SiC/IGBT wafer-level DC + Switching testing
- modular power-discrete testing for IPM
- real-time voltage/current accuracy self-check for VI modules
- multisite CP/FT discrete-device testing