At a glance
| Booth | N1176 |
| Country | TW |
| Website | www.shibaura.com.tw/AboutTaiwanZhipu |
Company profile
Shibaura Mechatronics Taiwan Corporation is a Taiwan subsidiary established with 100% investment from Shibaura Mechatronics. The company was established in April 1999. Its primary business covers sales of Shibaura Mechatronics products, after-sales servicing, spare-parts supply, equipment performance upgrades, and local production of equipment and spare parts. Its operating structure includes equipment sales, equipment performance improvement, maintenance, spare-parts support, and product localization. The equipment and service scope spans semiconductor manufacturing equipment, vacuum application equipment, liquid-crystal display panel manufacturing equipment, and healthcare-related offerings. Performance-improvement services are listed for semiconductor manufacturing equipment, media-device manufacturing equipment, vacuum application equipment, and liquid-crystal display panel equipment. Maintenance and spare-parts activities support product categories that include liquid-crystal panel production equipment, semiconductor manufacturing equipment, and laser processing equipment. The broader product portfolio also includes FPD manufacturing equipment, media device manufacturing equipment, TFT + Touch Panel Bonder Equipment, Automation Equipment, Laser Equipment, and Associated Manufacturing Equipment. Product localization is part of the company's stated service scope, including local production of equipment and spare parts. Within the Shibaura Mechatronics group context described in June 2026, smart, solutions and services are presented as ways to support customer manufacturing and value creation.
Exhibits
For semiconductor manufacturing, the offering includes WET CLEANING / ETCH EQUIPMENT FOR WAFER AND PHOTOMASK. It also includes ETCHING / ASHING EQUIPMENT FOR WAFER AND PHOTOMASK. FOUP INSPECTION EQUIPMENT is listed as another semiconductor manufacturing equipment category. The bonding lineup includes HIGH SPEED HIGH ACCURACY EPOXY DIE BONDER. It also includes TSV / COW FLIP CHIP BONDER. For display-related chip assembly, the lineup includes µLED & MINI LED CHIP BONDER / MOLDING / TILING EQUIPMENT. These semiconductor offerings cover wafer and photomask wet cleaning and etching, wafer and photomask etching and ashing, FOUP inspection, epoxy die bonding, flip-chip bonding, and µLED or MINI LED chip bonding, molding and tiling. Beyond the semiconductor equipment list, the company's equipment-sales categories include semiconductor manufacturing equipment, vacuum application equipment and liquid-crystal display panel manufacturing equipment. The listed main products further cover liquid-crystal panel manufacturing equipment, media device manufacturing equipment, TFT + Touch Panel Bonder Equipment, Automation Equipment, Laser Equipment, and Associated Manufacturing Equipment. Equipment performance improvement is available across semiconductor manufacturing equipment, media device manufacturing equipment, vacuum application equipment and liquid-crystal display panel equipment. Maintenance is part of the service offering for installed equipment. Spare-parts support is listed for liquid-crystal panel production equipment, semiconductor manufacturing equipment and laser processing equipment. The company also provides equipment and spare-parts localization as part of its product and service scope. Sales and after-sales servicing apply to Shibaura Mechatronics products, while spare-parts supply, performance upgrades and local production provide supporting services around those products. The combination of wet-process equipment, inspection equipment and bonding equipment directly addresses semiconductor manufacturing tasks represented in the company's equipment categories.
Capabilities and products
- wet cleaning/etch equipment for wafers and photomasks
- etching/ashing equipment for wafers and photomasks
- FOUP inspection equipment
- high-speed high-accuracy epoxy die bonder
- TSV/COW flip-chip bonder
- µLED/MINI LED chip bonding, molding and tiling equipment
- semiconductor manufacturing equipment performance upgrades
- semiconductor equipment maintenance
- semiconductor equipment spare-parts supply and localization