Shenzhen Hanchi Technology Co.,LTD

Exhibitor at SEMICON Taiwan 2026 · Booth M1255

Booth M1255Country CN14 product topics
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BoothM1255
CountryCN
Websitehanchitech.com
Exhibitor profile

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Shenzhen Hanchi Technology Co.,LTD has worked in semiconductor assembly and test for more than 10 years and focuses on semiconductor smart factories, with core capabilities in equipment R&D, AI algorithms, logistics simulation, and virtual commissioning used to build standardized intelligent packaging equipment, plant-wide smart logistics, and one-stop software and hardware solutions. Its technology set also includes protective-foam or protective-tape winding, deep-learning AI AOI, ultra-high-precision leakage detection, digital twins, and intelligent path planning for flexible, mistake-proof Reel and Tray intelligent packaging and semiconductor assembly-and-test AMHS solutions. The company states that it has completed cumulative deliveries valued at more than RMB 100 million to leading OSAT and IDM customers. It has established sales and after-sales service systems in mainland China, Taiwan, and Southeast Asia for semiconductor assembly-and-test customers. Company-site metrics list 10Y+ of industry experience, 100+ cooperative partners, and 1000+ industry customers. Shenzhen Hanchi Technology Co.,LTD describes itself as an industry leader in intelligent packaging and AMHS solutions for semiconductor assembly and test and states that its self-developed intelligent equipment and industrial software support reduced-staffing smart factories with lifecycle service.

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Exhibits

HANCHI APL (Automatic Packing Line) is described as a flagship intelligent packaging solution tailored for semiconductor IDMs and OSATs, with the company stating more than 90% global market share and top-tier supplier certification from leading chip enterprises; it includes APL-Reel for tape-and-reel packaging and APL-Tray for JEDEC trays and waffle trays, with stated zero transfer risks and 100% outgoing yield. The APL series supports Tape&Reel, Tray, and Outer Box operations and performs fully automatic intelligent vacuum packaging of chip products together with folding and cartoning of inner and outer boxes, using more than 40 intelligent monitoring and inspection measures for lifecycle control of the packaging process. Automatic packing-line functions include label printing, application and verification, stamping, loading desiccant and humidity cards, vacuum sealing of packaging bags, and automatic loading and unloading for Reel, Tube, and Tray products, and listed models include HC-AVP-R-007 and HC-AVP-R-013. HANCHI AMHS is an integrated automated material-handling system for semiconductor back-end IDMs and OSATs that covers the process chain from raw-material warehouses through front-end packaging and back-end assembly and test to finished-goods warehouses, integrating OHT, Conveyor, AMR/CTU, Stocker, and intelligent-equipment loading and unloading interface modifications. HANCHI ARC is an automatic reel changer for semiconductor tape-and-reel production that is stated to be SEMI S2/S8 certified and ESD-compliant, with functions for automatic reel replacement, tape cutting, tape threading, tail-tape application, label printing and application, zero risk of material mixing or wrong labels, MTBA ≥4 hours, MTBF ≥168 hours, and personalized customization, and it is presented as increasing taping-machine output and reducing labor cost. Warehouse-automation systems include WMS, integrate with MES and ERP, support system-instruction, barcode-scanning, and manual storage modes for materials, spare parts, and temporary remaining-material storage, and provide temperature and humidity control, real-time storage-status display, and flexible multi-cabinet combinations. The MGP mold automation retrofit is stated to save 75% of labor, increase capacity by 20%, improve product quality, reduce labor intensity, and prevent workplace injuries, while fully releasing MGP mold flexibility and its low-cost advantage.

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