At a glance
| Booth | N1184 |
| Country | FR |
| Product categories | Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Hot Embossing System · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Wafer Level Bonders · Equipment, Nanotechnology Tools · Assembly |
| Website | www.set-sas.fr |
Company profile
Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders - Chip-to-Chip and C hip-to-Wafer - and versatile Nanoimprint Lithography (NIL) solutions. With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders. Ranging from manual loading to fully automated version, our machines adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic… SET offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serves its clients through a global network of representatives (DKSH in Taiwan) and in-depth customer trainings.
Capabilities and products
- Nanoimprint Lithography (NIL) solutions
- adhesive joining compression bonding
- chip-to-chip flip-chip bonding
- chip-to-wafer flip-chip bonding
- fluxless reflow bonding
- high-accuracy flip-chip bonders
- thermo-compression bonding
- thermosonic bonding