At a glance
| Booth | N1184 |
| Country | FR |
| Website | www.set-sas.fr |
Company profile
SET CORPORATION SA was founded in 1975 and is based in France, supplying high-accuracy flip-chip bonders and Nanoimprint Lithography solutions. Its flip-chip bonding portfolio covers Chip-to-Chip and Chip-to-Wafer work, linking the company’s high-accuracy equipment to two principal die and wafer assembly formats. SET CORPORATION SA has equipment installed worldwide and describes its flip-chip bonders in terms of high accuracy and flexibility across bonding requirements. The equipment range extends from manual loading to fully automated versions, allowing machine configurations to match different levels of production automation. Supported bonding techniques include fluxless reflow, thermo-compression, adhesive joining compression, and thermosonic bonding. SET CORPORATION SA presents a comprehensive portfolio of flip-chip bonders intended for fast-growing markets, combining multiple equipment configurations with several supported bonding techniques. The company serves customers through a global network of representatives, including DKSH in Taiwan, and through in-depth customer training associated with its bonding equipment.
Exhibits
SET CORPORATION SA lists sensor-oriented applications including FPA and IR, UV, and X-Ray sensors, placing precision assembly and related processes in imaging and sensing environments. Packaging and integration applications include 3D Integration, RF applications, MEMS and MOEMS packaging, and MCM, covering several advanced micro-assembly and packaging formats. Display and optical application areas include µLED displays, laser bars, optical components, and photonics packaging, extending the equipment range into optoelectronic assembly work. Lithography and bonding application categories also include Hot Embossing Lithography, UV-NIL, Direct Bonding, and High Force Bonding, broadening the portfolio beyond conventional flip-chip assembly. The listed product family includes ACCµRA M, ACCµRA OPTO, ACCµRA100, ACCµRA Plus, FC150 PLATINUM, and FC300 among its named equipment platforms. Additional named platforms include NEO HB, NEO W, NPS300, LDP150, and Ontos TT - OntosIS, showing multiple product lines under the company’s micro-assembly and lithography offering. For 3D-IC integration, the main goals are to shorten connection lengths, reduce electrical resistance, improve response time, reduce power consumption, and reduce overall dimensions. Those 3D-IC objectives enable high-yield assembly of devices and facilitate effective 3D packaging solutions rather than serving only as dimensional targets. The listed 3D packaging solution formats include Interposer, Chip-to-Chip, and Chip-to-Wafer configurations. Through-Silicon-Via, or TSV, is identified as a promising interconnection method between chip layers within 3D integration. As TSV diameter is reduced and pitch increases, the required accuracy rises not only along the X and Y axes but also in the parallelism maintained between chips. Post-bonding accuracy requirements vary by application, so the required placement and parallelism performance depends on the specific 3D-integration use case. The combination of Chip-to-Chip and Chip-to-Wafer flip-chip bonding, Nanoimprint Lithography, direct and high-force bonding, and application-specific 3D integration gives the product portfolio coverage across micro-assembly, packaging, optical, sensor, RF, MEMS, MOEMS, and µLED-related work.
Capabilities and products
- high-accuracy Chip-to-Chip flip-chip bonders
- high-accuracy Chip-to-Wafer flip-chip bonders
- Nanoimprint Lithography (NIL) solutions
- thermo-compression and fluxless reflow bonding