At a glance
| Booth | N0976 |
| Country | TW |
| Product categories | Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Wafer Level Bonders · Cells · Bumping Systems |
| Website | www.saultech.com.tw |
Company profile
Saultech provides precision Die Bonder and Sorter solutions for advanced packaging, including CoWoS, 3D IC and Hybrid Bonding. Its hybrid bonding die bonders feature a high-rigidity granite dual-gantry base and the Bond Wave process for advanced-packaging die attach.
Capabilities and products
- Bond Wave process for particle and bubble control
- active vibration isolation and laminar flow for bonding void-risk elimination
- dual-gantry dual-bond-head high-throughput bonding
- non-destructive peeling technology for 25 μm dies
- precision die bonder solutions for advanced packaging
- sorter solutions for CoWoS 3D IC and Hybrid Bonding
- ±0.2 μm die-to-wafer bonding accuracy