At a glance
| Booth | N0976 |
| Country | TW |
| Website | www.saultech.com.tw/en |
Company profile
Saultech Technology Co., Ltd. researches, develops, manufactures and sells precision equipment and provides professional services intended to support customer satisfaction. The company specializes in the innovation and development of Pick & Place technology and products, with sorting machines and die-bonding machines as its primary equipment categories. Its Pick & Place products are applied in LED, LD, IC semiconductor and optical-glass industries, particularly for die sorting and die-bonding operations in mid-to-late production stages. For advanced packaging, Saultech provides precision Die Bonder and Sorter solutions that include CoWoS, 3D IC and Hybrid Bonding applications. Its hybrid-bonding die bonders use a high-rigidity granite dual-gantry base and the Bond Wave process for advanced-packaging die attach. Under its Pick & Place technology and product roadmap, Saultech expands collaboration with customers, channel partners and industry peers to develop equipment. The company describes its equipment-development approach as combining innovation with cost effectiveness while continuing to extend Pick & Place technology into new products. Saultech's quality policy covers research and development, manufacturing, sales and professional service for precision equipment. Its team states that it focuses on operational details and continuously optimizes internal processes in order to maintain stable, mature and consistent performance across its work. The company also commits its staff to respond collectively to product-quality issues with support and action intended to preserve a stable and seamless customer product experience. Saultech states that up to 60% of its workforce is dedicated to research and development, connecting its recruiting profile with its focus on semiconductor and LED equipment innovation. Its activities therefore span equipment technology, manufacturing and service rather than development alone, with precision Pick & Place, sorting and die bonding forming the common technical base.
Exhibits
Saultech Technology Co., Ltd. supplies hybrid bonding, Fan out, RDL and AOI solutions for advanced semiconductor-packaging work. Its new generation of high-precision automation is focused on Fan-out, 2.5D/3D IC and SiP advanced-packaging applications. The equipment integrates high-precision Pick & Place and Die Attach technologies and reaches an accuracy of ±0.2µm. Saultech states that the same equipment supports a variety of chips and packaging materials for high-density heterogeneous integration requirements. The advanced-packaging offering is complemented by precision Die Bonder and Sorter solutions for CoWoS, 3D IC and Hybrid Bonding. Hybrid-bonding die bonders combine the high-rigidity granite dual-gantry base with the Bond Wave process for die attach in advanced packaging. Beyond these advanced-packaging systems, Saultech's primary product range includes sorting machines and die-bonding machines for LED, LD, IC semiconductor and optical-glass production. Those machines are positioned for chip sorting and die-bonding operations in the mid-to-late stages of production. Saultech develops the equipment within a Pick & Place product roadmap that involves collaboration with customers, channel partners and industry peers. The company also provides service alongside equipment research, development, manufacturing and sales, so its supply scope includes support for the precision systems it produces.
Capabilities and products
- Hybrid Bonding solutions for advanced packaging
- Fan-out advanced-packaging solutions
- RDL advanced-packaging solutions
- AOI solutions for advanced packaging
- ±0.2µm Pick & Place / Die Attach
- Die Bonder and Sorter for CoWoS/3D IC
- die sorters for LED/LD/IC