At a glance
| Booth | X0016 |
| Country | GB |
| Product categories | Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Package Substrates; Laminate; Film based · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Thermal Interface Materials; Heat Sinks · Materials, Nanotechnology · Substrate Materials · Chucks for Wafer and other Substrates · Raw Material & Custom components; Metal · Sensors · Cameras - Still; CCD; Video & Monitors · Optics; Lens Products; Auto-Focus Systems · Manufacturing Process Support and Development |
| Website | www.cealloys.sandvik/en |
Company profile
Sandvik Osprey manufacture Controlled Expansion Alloys (CE-Alloys). These are a range of high modulus, low density Aluminium-Silicon Alloys (Al-Si) alloys with tailored thermal expansion. The components tailored from our CE alloys are typically used to provide support, protection, and thermal management to various types of devices and systems. We support various demanding industries such as semiconductors, electronics, space, automotive.
Exhibits
Sandvik Osprey Ltd. manufactures controlled expansion alloys (CE-Alloys), a family of high-modulus, low-density Al-Si alloys with tunable thermal expansion. Components made from its CE alloys provide support, protection, and thermal management for demanding applications in semiconductors, electronics, aerospace, and automotive industries.
Capabilities and products
- CE alloy support and protection components for devices
- CE alloy thermal management components for semiconductor applications
- Controlled Expansion Alloys (CE-Alloys)
- high-modulus low-density Al-Si alloys with tunable thermal expansion
- low-expansion alloys for wafer chucks