Rohde & Schwarz GmbH & Co. KG

At a glance

Company profile

Rohde & Schwarz GmbH & Co. KG is one of the world's leading suppliers and a reliable partner in the critical infrastructure and industry segment, and its globally operating technology group develops, designs, manufactures and implements monitoring, analytics and protection solutions intended to support the reliable operation and performance of critical infrastructures and networks. Its critical-infrastructure portfolio includes ATC, spectrum monitoring and CUAS systems, and the company serves ANSPs, regulators, governmental organizations and industrial operators that use these solutions to support the operation and performance of their assets. Rohde & Schwarz GmbH & Co. KG is also one of the world's largest manufacturers of electronic test and measurement equipment and has more than 90 years of experience in that field. Its test and measurement activities address routine laboratory tasks as well as next-generation development, with application-specific and scalable equipment, long-term service and support, and instruments and solutions for electronics testing, wireless communications and automotive work. The test portfolio spans digital design, power electronics, high-speed digital interfaces, RF and microwave components, medical devices and EMC testing, with the company stating that it has supplied EMC test equipment for over 50 years. Rohde & Schwarz GmbH & Co. KG also addresses automotive connectivity and infotainment systems, automotive radar and in-vehicle networks, while aerospace and defense applications include radar and electronic-warfare testing as well as satellite systems. Its wireless portfolio covers IoT and M2M, mobile devices, infrastructure and wireless standards including 6G research, while mobile-network testing is directed in particular at network operators and regulators. The company maintains relationships with the global research and education community and supplies test solutions to laboratories and institutions worldwide, and its millimeterwave imaging technology is used in screening solutions for security and industrial applications.

Exhibits

For semiconductor and component testing, Rohde & Schwarz GmbH & Co. KG provides instruments for fast and accurate on-wafer and die testing and offers solutions across the on-wafer workflow from development through production. RF probing on probe stations is used during product design, verification and production, and the company emphasizes the integration of test instrumentation with probing systems at each of those stages. Development and design-verification tasks can include flexible wafer or die verification on manual or semi-automated probe stations, special vector calibration for S-parameter and other RF measurements, integration of frequency converters or RF frontends on the prober for millimeterwave and THz work, and combined RF and DC testing of active devices. For production, the described workflow includes synchronized interaction between the probe station and test instrumentation for fast verification, multisite probing with frequency offsets to reduce crosstalk, and reduction of touch-downs to limit damage to the device. The R&S®ZNA performance vector network analyzer provides features for verifying active and passive components at wafer and die level, making vector network analysis a core part of the on-wafer and die test offering. R&S®ZC millimeter converters extend the frequency range up to 1.1 THz for terahertz research and can be integrated close to the probe to reduce losses in millimeterwave and THz applications. The R&S®ZNBT multiport vector network analyzer is optimized for speed and supports parallel testing with up to 24 ports, which the company positions for mass-production use. The R&S®FE170 external frontend provides wideband up-conversion for modulated on-wafer testing next to the probe and is designed for compact integration within probe stations. For probe-system integration, Rohde & Schwarz GmbH & Co. KG combines its vector network analyzers with probe systems from MPI Corporation and FormFactor, while MPI QAlibria® and FormFactor WinCal calibration software support various R&S vector network analyzers. For load-pull and impedance-matching work, the company cites tuners from Maury Microwave and Focus Microwaves, with R&S ZNA and other analyzers integrated and supported in partner system software for on-wafer and load-pull systems. Its on-wafer test approach includes cost-optimized vector network analyzers with four or more true parallel ports for passive components and a performance vector network analyzer with frequency coverage up to 1.1 THz for active components. System-level calibration can be handled directly by Rohde & Schwarz vector network analyzers or by partner software, and the analyzers are integrated into system software used for on-wafer and load-pull testing. Application examples include differential RF on-wafer measurements up to 110 GHz on MPI probe stations, three-port on-wafer mixer measurements up to the THz range, on-wafer qualification of RF components and on-wafer characterization at sub-THz frequencies for 6G-related work. Related component-test applications include RF power-amplifier testing and load-pull testing, where impedance matching and testing under different impedances are used to improve active-component designs. Beyond on-wafer work, the broader test and measurement portfolio includes the FSWX signal and spectrum analyzer, R&S®MXO 3 oscilloscope, R&S®ZNB3000 vector network analyzer, CMX500 5G one-box signaling tester, R&S®SFI100A Wideband IF vector signal generator and R&S®EPL EMI test receiver. The broader application set also covers deembedding test fixtures for high-speed digital applications, electric-drivetrain optimization with MXO oscilloscopes, integrated sensing and communication for 6G, electronic-warfare and satellite testing, and AI and ML topics for 6G networks. Rohde & Schwarz GmbH & Co. KG supports PCB design testing in electronics laboratories as well as research that pushes into 6G, and its test and measurement range is presented as extending from basic instruments to advanced measurement solutions. Across electronics testing, the company connects test solutions with digital design, power electronics, high-speed digital interfaces, RF and microwave components, medical devices and EMC, while its wireless test scope includes devices, infrastructure and network testing.

Capabilities and products

• RF instruments for on-wafer and die testing
• on-wafer testing solutions from development to production
• vector network analysis for wafer and die testing
• millimeter-wave/THz testing up to 1.1 THz
• parallel RF testing with up to 24 ports
• load-pull and impedance matching testing
• RF probe-station and test-instrument integration
• vector calibration for S-parameter RF measurements
• combined RF+DC testing for active devices
• multisite parallel probing with crosstalk reduction
• wideband up-conversion for modulated on-wafer testing
• system-level calibration for on-wafer testing
• differential RF on-wafer measurement up to 110 GHz
• three-port on-wafer mixer measurement into the THz range
• sub-THz on-wafer characterization
• RF power amplifier testing

Related product topics

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