At a glance
| Booth | M1148 |
| Country | TW |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Molding; Encapsulation; Potting; Resin Materials · Package Substrates; Laminate; Film based · Printing Masks; Screens · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · CMP; Grind; Lap; Polish; Abrasive materials · Substrate Materials · Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards) · Raw Material & Custom components; Plastic |
| Website | www.hitachi-chem.co.jp |
Company profile
Resonac International (Taiwan) Co., Ltd. is a Taiwan registered company associated with Japan based Resonac Corporation. Taiwan company registry data confirms the English company name, the Taipei address, the phone and fax records, import and export qualification, and directors representing Resonac Corporation. The same registry history shows the company name changed from earlier Hitachi Chemical and Showa Denko related Taiwan entities to Resonac International (Taiwan) Co., Ltd. The available public registry information describes business tax categories including wholesale of other office machinery and household appliances; it does not by itself identify a specific semiconductor product line for this Taiwan entity. For enrichment, the safest description is that this is the Taiwan international subsidiary or sales entity of Resonac Corporation, with details limited to registry-confirmed corporate identity and group ownership unless additional official product pages are supplied.
Capabilities and products
- Material System Solution (MSS) front-end and back-end material combinations
- adhesives and epoxies for semiconductor materials
- die attach compounds
- molding, encapsulation and potting resin materials
- package substrates, laminates and film-based materials
- printing masks and screens
- underfill materials
Related product topics
- SMT Screen Printers and Stencils
- Semiconductor Packaging Materials
- Semiconductor Adhesives and Epoxies
- Die Attach Compounds
- Molding, Encapsulation And Potting Resins
- Encapsulants and Potting Materials
- Flip-Chip Underfill Materials
- Package Substrate Core and Build-Up Materials
- Semiconductor Process Chemicals and Materials
- Package Substrates and Laminate Materials