At a glance
| Booth | M1148 |
| Country | TW |
| Website | ap.resonac.com/products |
Company profile
Resonac International(Taiwan) Co., Ltd is a Taiwan-registered company associated with Japan-based Resonac Corporation, with import and export qualification recorded for the Taiwan entity. Its corporate history includes name changes from earlier Taiwan entities related to Hitachi Chemical and Showa Denko to Resonac International(Taiwan) Co., Ltd. Across the wider product organization, Resonac applies technologies in inorganic, metal and organic chemistry to individualized products for fields including energy, environment, information, electronics, agriculture, automotive, construction, food, household, infocommunications, industrial, medical and pharmaceutical, packaging and print, personal care, semiconductor backend and printed-wiring-board materials.
Exhibits
The semiconductor-material portfolio includes Material System Solution(MSS), described as selecting suitable material combinations for semiconductor-device front-end and back-end processes, together with Die Attach Film (DAF) and Epoxy Molding Compound (EMC). Resonac's dual-curing crosslinkers place a (meth)acrylate group and a reactive ester group in one molecule, enabling catalyst-free crosslinking below 100 °C while retaining practical working life. For thermal design in compact equipment, skived heat sinks are designed to maximize heat-transfer area within the same installation volume, while the Karenz series consists of monomers containing both (meth)acryloyl and isocyanate groups in a single molecule. The SR Series photosensitive solder resists protect and insulate high-density wiring in semiconductor packages, with low CTE and low shrinkage for low warpage, high resolution for denser packages and high heat resistance for TCT and reflow resistance; the lineup includes liquid SR7300 and film SR-F series. The RD Series photosensitive film forms printed-wiring-board circuits with direct-writing laser exposure and supports fine-pitch profiles and semi-additive processing; listed conditions include 405 nm direct imaging, substrate roughness Ra:0.4 µm, post-exposure bake at 80 degree C for 30 Sec., and development in 1.0 wt% Na2CO3aq. at 30 degree C and 0.16 MPa. The RY Series is designed for fine-pitch circuit formation on semiconductor package substrates, with film thickness of 10 um or less and circuit width of 4 um or less, support for semi-additive processing and stepper exposure, and listed development at 1.0 wt% Na2CO3aq, 30 ℃ and Minimum developing time×2. The HM Series forms thick resist pattern layers for high-aspect-ratio copper plating on printed wiring boards and electroforming in metal-mask manufacturing, with a 35-168 um lineup, chemical resistance for copper plating and electroplating, compatibility with standard sodium-carbonate development and stripping solutions, and smooth sidewall formation. Thermal Conductive Sheets (TC) are electrically conductive TIM materials used between IC chips and heat spreaders, heatsinks or heat pipes, using vertically aligned graphite fillers for thickness-direction thermal conductivity and flexible gap filling for differences in chip height or uneven interfaces. The thermal sheets can be temporarily fixed to heat modules through slight adhesiveness and can conform to warped substrates for next-generation large devices, with the stated cooling effect intended to support electronic-device reliability and energy efficiency. For SiC power modules, Resonac offers sintered copper paste as a die-bonding and large-area bonding material intended to combine heat resistance, heat dissipation and reliability, including large-area use between packages and coolers. At T j ,max = 175℃, a stated power-cycle test gives sintered copper a characteristic life approximately 40 times that of high-lead solder and approximately five times that of sintered silver; its listed thermal conductivity is 300W/(m･K), compared with 30W/(m･K) for high-lead solder in the cited comparison. Two developing sintered-copper products are described for die-bonding and large-area bonding, with 5 mm to 13 mm squares for die-bonding and 30 mm to 50 mm squares for large-area use, where lower-pressure thermo-compression is intended to reduce total loading. The EPINAL Series solvent-free die bonding paste is available in conductive and non-conductive types for bonding chips to leadframes and organic substrates, with low elastic modulus and high adhesive strength for MSL1, an aluminum-and-silver-filler type, and a 17W/m-K high-thermal-conductivity type for power devices and modules. Acrylonitrile is supplied as a raw material used mainly for plastics and also for fibers and synthetic rubber, with ISCC certification stated for the material; listed applications include ABS resin, carbon fiber, adiponitrile for Nylon66 ABS, acrylic fiber, Nitrile Butadiene Rubber(NBR) and acrylamide, with bulk packing from 1000MT~. Die Attach Film (DAF) combines dicing-tape and die-bonding-film functions for semiconductor wafer singulation and bonding, with applications from 3D NAND and DRAM devices to lead frames, film options from ultra-thin through thick types for FOW and FOD, and compatibility with SDBG in addition to conventional blade dicing. The DAF lineup is described with low elasticity for thermal-stress relaxation, high adhesive strength and heat resistance for package reliability, high elastic modulus for small-chip wire bondability, thermosetting adhesive-film technology and single-layer products for electronic components and modules. For vacuum insulated glass, the Vaneetect VS Series includes Vaneetect <VS-1305B>, a low-melting glass based mainly on vanadium with silver and tellurium that forms a hermetic seal at 300°C, compared with conventional sealing that requires 400°C or higher. Vaneetect <VS-1305B> is also described for tempered vacuum insulated glass because reliable sealing at 300°C avoids the higher-temperature conditions that can reduce tempered-glass strength; the material is stated to be free of substances restricted by the EU RoHS Directive and contains no lead, allowing recycling as glass.
Capabilities and products
- Die Attach Film (DAF)
- Epoxy Molding Compound (EMC)
- low-temperature dual-curing crosslinkers
- skived heat sinks
- photosensitive solder resist for package substrates
- direct-imaging circuit-formation film
- package-substrate circuit-formation film
- thick-film resist formation film
- Thermal Conductive Sheets (TC)
- sintered copper paste for SiC power modules
- solvent-free die bonding paste
- Acrylonitrile chemical raw material
- low-melting glass for hermetic sealing
- 300°C hermetic sealing for vacuum insulated glass