At a glance
| Booth | N0388 |
| Country | KR |
| Website | www.protec21.co.kr |
Company profile
PROTEC CO., LTD. states that it is a global leader in the semiconductor equipment industry and in semiconductor archiving sales. The company states that it creates value based on talent and technology. Its product presentation includes Attach equipment, Dispenser equipment, Laser Assisted Bonder equipment, Micro SBM equipment, and references to green-energy solutions and advanced applications.
Exhibits
The PCA-200 is designed to perform precision attachment tasks under various conditions. It is designed to adapt to changes in material supply conditions and line configurations as the process changes, and to facilitate quick line-configuration adjustments. The system can be equipped with different types of pick-and-place heads, allowing customization for specific uses. PCA-200 performance is listed as 5K UPH. Attachment accuracy is specified as ± 7.0 μm @ 3σ for X-Y and ± 0.1° @ 3σ for rotation and tilt. Standard bonding force is listed as 0.5Kgf ~ 4Kgf, while the high-pressure bonding-force range is 1Kgf ~ 20Kgf. The head-heating section lists Constant and Heat & Cool configurations together with temperatures of 150°C and 400°C. The applicable component-size range is 1-60mm and the applicable substrate size is 300x200mm. System-reliability entries list MTBA, Mean time between assists, as < 1hrs and MTTR, Mean time to repair, as < 3 minute. The same product page lists APOLLO as a Dispenser, PLA-400RT as a Laser Assisted Bonder, and BP-5000 as Micro SBM alongside the PCA-200 Attach system. These listed capabilities combine precision attachment, customizable pick-and-place heads, rapid response to material-supply and line-layout changes, and detailed performance, force, heating, size and reliability specifications for the PCA-200. The PCA-200 is also described as easily adaptable to changes in raw-material supply conditions, complementing its line-configuration flexibility for process changes. PCA-200 therefore presents both process flexibility and clearly defined attachment performance, with clearly distinct specification groups for system performance, attachment accuracy, bonding force, head heating, component and substrate applicability, and system reliability. Beyond the PCA-200, the product page places the attachment system within a wider equipment presentation that also names APOLLO, PLA-400RT and BP-5000, while identifying Attach, Dispenser, Laser Assisted Bonder and Micro SBM product types. The page also associates the product portfolio with environment and sustainability, green-energy solutions and advanced applications, without adding further numeric specifications to those entries.
Capabilities and products
- precision attachment equipment
- Dispenser
- Laser Assisted Bonder
- Micro SBM