At a glance
| Booth | L0828 |
| Country | TW |
| Website | www.pibond.com |
Company profile
Pibond Oy Taiwan Branch manufactures a broad range of electronic materials for stringent performance and integration requirements and supplies materials from all product lines to leading foundries worldwide. The company specializes in the development and production of advanced siloxane and metal oxide monomers and polymers. Its products support the construction of next-generation devices and can also help reduce customer production costs and improve quality. Its materials are used by customers at multiple nodes, including “10 nm class” advanced semiconductor devices. Expertise in product development, application engineering and production techniques supports fast time to market and the performance required for advanced device designs. Pibond Oy Taiwan Branch also offers and develops materials for MEMS and Advanced IC Packaging, including needs associated with Wafer Level and emerging 3D-IC packaging architectures.
Exhibits
Pibond Oy Taiwan Branch supplies semiconductor materials used in microprocessors, memory and sensors, including products used at advanced nanoscale nodes and materials supplied to leading semiconductor foundries globally. The company describes itself as one of the very few critical material and process suppliers for current and future microprocessors, data storage and sensor chips, including the most advanced 5 nanometer semiconductor chips. Its materials are used in logic chips such as CPUs and GPUs for computers and mobile phones, and the company states that it is the only European materials supplier in advanced, complex processor applications. For memory, its materials are used in products such as NAND Flash and DRAM to support smooth production and long lifecycles. Its semiconductor materials are used in non-optical sensors including MEMS sensors, accelerometers, pressure sensors, gyroscopes, temperature sensors, humidity sensors, GPSes and compasses, and are used to facilitate sensor miniaturization with finer features. Its optically clear dielectrics are integrated in millions of optical sensors every day and are intended to enable future meta and integrated optical circuits. These optical dielectric materials support anti-reflection and light-pathway optimization, offer a wide range of refractive indexes with tunability for different thicknesses, and are used in optical sensors for visible wavelengths. The materials are also used to enhance optical-sensor devices such as smartphone cameras and enable wafer-level optics for high-volume, small-scale devices used in CMOS image sensors, face recognition, 3D imaging and movement detection. For displays, the materials support next-generation designs that are thinner, lighter, brighter, curved and more cost-efficient, including automotive, AR, VR, XR and micro-LED applications. For meta and integrated photonics, Pibond Oy Taiwan Branch develops and supplies materials and processes for diffractive, meta and integrated optics used in imaging, sensing, quantum computing, lasers, optical communication, 5G and optical switches, including dot-matrix projectors, diffusers, collimators, flat-lens optics and photonic integrated circuits. Pibond Oy Taiwan Branch also develops, manufactures and supplies biocompatible materials for medical devices, including specialized coatings, adhesives, dielectrics, monomers, oligomers and polymers, after expanding into medical-device materials in Spring 2024. These medical materials are intended for implantable devices, semiconductors, microfluidic chips, delivery devices for active pharmaceutical ingredients and formulations, implantable functional devices and microfluidic-chip applications.
Capabilities and products
- advanced siloxane and metal-oxide monomers and polymers
- MEMS and advanced IC packaging materials
- semiconductor materials for microprocessors, memory and sensors
- NAND Flash/DRAM memory materials
- MEMS sensor materials
- optically clear dielectric materials
- wafer-level optics materials
- micro-LED display materials
- diffractive, meta and integrated photonics materials and processes
- biocompatible materials for medical devices