At a glance
| Booth | N0966 |
| Country | KR |
| Website | www.parksystems.com |
Company profile
Park Systems Corp. was established in 1997 as a company specializing in nanoscale measurement equipment and develops, manufactures and sells high-precision atomic force microscopes (AFMs) with fully automated software designed for ease of use. Headquartered in Korea with offices in the US, Japan and Singapore, the company serves scientists and engineers worldwide. Its AFMs are designed for materials science, electronics, life science, nanotechnology and other research and industrial fields, delivering ultra-high resolution and extremely precise measurements with accuracy and ease of use. Park Systems describes itself as an innovator in nanoscale microscopy and metrology that continues to invest in emerging technologies, with products used by researchers and corporations around the world.
Exhibits
Park AFMs use a decoupled architecture for lateral and vertical scanners, including flexure-based independent XY and Z scanners, to provide accurate nano-resolution measurements and distortion-free images. True Non-Contact technology prevents destructive tip-sample interaction, preserves tip and sample integrity, maintains high-resolution accurate scans, and extends tip life. A user-friendly mechanical and software architecture streamlines tip and sample loading, sample access, rapid tip-to-surface approach and searches for areas of interest. Smart Scan, an AI-powered operating system, simplifies AFM operation for novice and expert users. Park AFMs use low-noise Z detectors with 0.02 nm noise over a large bandwidth to produce accurate sample topography without edge overshoot. Park AFM is designed to produce data that can be trusted, replicated and published at the highest nano resolution, and Park identifies scanner architecture as the fundamental difference from its closest competitor. Its NX AFM Head Z scanner, powered by the NX AFM electronic controller, further improves nano-resolution data accuracy. The industrial AFM portfolio supports semiconductor fabrication metrology, device failure analysis and other industrial applications, providing highly accurate, repeatable and complete measurements for semiconductor and display manufacturing. Application areas include wafer processing, photomask repair from automatic defect review through repair verification, advanced packaging and R&D metrology with White Light Interferometry (WLI), flat-panel display measurement for OLED, LCD and photonics on samples exceeding 300 mm, optical profilometry with nanometer-level vertical resolution, and HDD head and media inspection with automated defect detection. Across industrial uses, Park AFM solutions increase manufacturing efficiency and production quality; wafer systems support accurate device construction, photomask workflows improve repair efficiency and throughput, WLI supports quality assurance and process control, and HDD inspection supports quality standards and manufacturing yield. For advanced packaging architectures including CoWoS, SoIC, hybrid bonding, chiplet integration and panel-level packaging, automated AFM platforms characterize bonding surfaces, redistribution layers (RDL), TSV structures, thin films and overlay alignment features with high resolution, accuracy and repeatability. The advanced-packaging lineup includes Park NX-TSH600 for panel-level packaging, Park NX-TSH400TF for 300 mm tape-frame advanced packaging and Park NX-TSH300 Overlay combining AFM with optical overlay. NX-TSH600 integrates into semiconductor panel-level packaging environments, measures samples up to 600 mm × 600 mm, supports complete automation and SEMI compliance, and is deployed in PLP production by leading global semiconductor manufacturers, with its installed base continuing to grow. Its end-to-end automation receives recipes from a host and covers probe selection, scanning multiple target areas, measurement-data analysis and report generation. Panel transfer uses an equipment front end module (EFEM) with robotics, sensors and algorithms for alignment and handling, including warped panels; the automatic tip exchanger stores up to 24 pre-mounted probes, with 12 probes per cassette. The EFEM has dual load ports and a dual-arm robot, with a pre-aligner, ID readers and an automated flipper for front- and back-side AFM measurement, while a porous ceramic sample chuck applies uniform vacuum to hold large PLP samples. Off-axis optics use a 0.8× objective for fiducial identification across wide PLP areas, while on-axis optics use a 10× objective for detailed pattern viewing and measurement-location identification. XEA software provides recipe copy/paste, specialized editing, real-time recipe updates, parameter adjustment, database management and maintenance, and the system communicates with fab hosts through SECS/GEM with SEMI E30, E40, E87, E90, E94 and E84 PI/O for AMHS integration; the XEA navigator provides an intuitive interface that integrates system adjustment and operation. The gantry-mounted Tip Scanning Head moves to measurement positions while the sample remains on the chuck, avoiding sample size and weight limitations; its separated flexure-guided 2D XY and 1D Z scanners reduce out-of-plane motion by eliminating horizontal and vertical crosstalk and enable precise, linear and fast Z dynamics. True Non-Contact™ mode obtains topography from attractive van der Waals forces, preventing tip wear and sample damage to improve data reliability and reduce total cost of ownership through longer tip life. For 3D nanometrology, Park AFM measures width or critical dimension, pitch, height or depth, taper or sidewall angle and surface roughness; NX-TSH600 is used for PLP roughness measurements across samples of different materials and thicknesses, where roughness measurement supports improving and managing adhesion across varied samples, with a listed scan size of 40 µm × 40 µm and resolution of 1,024 pixels × 128 lines.
Capabilities and products
- automated AFM for semiconductor fabrication metrology
- AFM for device failure analysis
- AFM for photomask repair
- white light interferometry (WLI) metrology
- large-sample measurement above 300 mm
- nanometer-resolution optical profilometry
- HDD head and media inspection
- True Non-Contact AFM measurement
- Smart Scan AI-powered AFM operating system
- 600 mm × 600 mm panel AFM measurement
- AFM critical-dimension (CD) measurement
- AFM surface-roughness measurement