PARAGON TECHNOLOGIES CO., LTD.

Exhibitor at SEMICON Taiwan 2026 · Booth I3323

Booth I3323Country TW5 product topics
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BoothI3323
CountryTW
Websitewww.pttech.com.tw
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Company profile

PARAGON TECHNOLOGIES CO., LTD. was established in 1995, is headquartered in Taoyuan and is listed on the Taiwan Stock Exchange under stock code 3518. The company states that it was the first in the world to apply vacuum-sputtered thin-film technology to EMI/ESD solutions for 3C products and the first vacuum-sputtering technology company listed on the Taiwan Stock Exchange. Its current core technologies cover silicon-carbide wafer manufacturing, wafer-thinning technology and vacuum-coating processes for third-generation semiconductor applications. PARAGON has expanded toward high-end semiconductor materials and core process equipment, combining key materials with internally developed equipment as parallel development paths. Its Chiayi operation in Taiwan integrates the silicon-carbide supply chain from crystal growth through substrate production. For high-power AI computing thermal-management needs, the company provides SiC substrates and wafer-level microfluidic cooling technology as part of an integrated solution. PARAGON combines advanced PVD coating capabilities with SiC material technology to serve semiconductor and AI supply-chain customers with technology and process-equipment integration services. The company also identifies advanced packaging process and thermal applications as areas for its semiconductor solutions. PARAGON also states that it has mastered large-size SiC substrate production technology and has successfully developed PVD seed-layer technology for advanced substrates. The company plans to focus its combined PVD-coating and SiC-material capabilities on future demand in high-power devices and advanced-packaging markets while continuing cross-disciplinary R&D. Its automotive wheel-rim coating service was introduced to break previous appearance-design limitations while meeting automaker quality-certification requirements and customized consumer-service needs.

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Exhibits

For advanced packaging, PARAGON TECHNOLOGIES CO., LTD. provides PVD process technology for titanium-copper seed layers used with HDI substrates, ABF substrates, through-glass-via substrates (TGV), CPO optical substrates and through-silicon-carbide vias (TSiCV). Its product and service categories also include thermal materials and functional coatings. In 2008, the company entered the automotive sector with appearance-coating services for wheel rims, addressing automaker quality-certification requirements and customized-service demand while serving customers across Asia, Europe and North America. In 2019, it introduced coating technology for 3C product appearance that integrates technology and process capabilities for metal, plastic, glass and film substrates. Those appearance-coating processes can produce metallic texture, gradient effects and light effects to meet specified customer requirements. For 5G-related product design, PARAGON also offers non-metallic coating technology. Its coating work spans multiple substrate types and product-appearance applications, extending the company's vacuum-coating process expertise from functional EMI/ESD uses to decorative and appearance-oriented services. The combined offering links functional coating, thermal materials, SiC substrates, wafer-level microfluidic cooling and advanced-packaging PVD seed-layer processes to semiconductor and high-power computing applications.

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