At a glance
| Booth | N0166, T9124 |
| Country | JP |
| Website | orbray.com |
Company profile
Since 2023, Orbray Co., Ltd. has used the name Orbray after changing its company name from ADAMANT Namiki Precision Jewel Co., Ltd., continuing a precision-processing business that began with the manufacture of sapphire bearings. From that starting point, the company has continuously applied three core technologies, cutting, grinding and polishing, to extend its precision-processing expertise into a range of fields and to manufacture very small precision components used around everyday technology. Bonding Capillary, a wire-bonding tool, is one of Orbray Co., Ltd.'s flagship products and uses a high-quality zirconia-reinforced alumina ceramic developed from the company's accumulated technical expertise; the company says this ceramic differs from the material used by other companies. The ceramic formulation was developed to move beyond limitations of conventional processing methods, and Orbray Co., Ltd. applies proprietary ultra-high-precision machining to achieve high surface smoothness and uniformity of shape. Adding zirconia improves the ceramic's wear resistance, extending product life while also improving the efficiency and yield of the wire-bonding packaging process. Orbray Co., Ltd. is also developing large-diameter diamond substrates, using the physical properties of diamond to address semiconductor-device requirements in thermal management, radiation resistance, high frequency and high power. Through these activities, the company applies its precision-processing technologies to both semiconductor packaging tools and substrate development for high-performance semiconductor devices.
Exhibits
Orbray Co., Ltd. offers a Gallium Oxide Wafer based on gallium oxide (Ga2O3), a next-generation power-semiconductor material described with a high breakdown field for EV applications, and uses its sapphire-crystal and polishing technologies to provide beta-type substrates. The stated Gallium Oxide Wafer specification is Crystal Beta, Size 10x15x0.5mm, Orientation (010), Polish Single and OFF-angle Custom. For sapphire wafers, Orbray Co., Ltd. uses precision processing to support c-, r-, a- and m-plane surface orientations and controls the off-cut angle to within 0.1 degree for applications including epitaxial growth and wafer bonding. The sapphire-wafer range includes Standard grade substrates for general LED use and Prime grade wafers with controlled flatness and high-quality cleaning intended to reduce particle and metal contamination. Prime grade sapphire-wafer applications include micro-LED, DUV-LED and RF devices as well as GaN, AlN and Ga2O3 template development, extending the substrate range into several next-generation semiconductor and epitaxial-growth uses. Orbray Co., Ltd. also has single-crystal growth technology using the EFG method, or Edge-defined Film-Fed Growth Method, as part of its sapphire substrate manufacturing capability. Listed sapphire-wafer diameters are φ2 inch, φ4 inch, φ6 inch, φ8 inch and φ12 inch, using artificial sapphire with Al2O3 at 99.99% or higher and a standard c-plane (0001) crystal orientation. The listed thickness values are 430±15μm, 650±15μm, 1300±20μm, 1300±20μm and 3000±20μm, while orientation-flat lengths include 16±1mm, 30±1mm and 47.5±2.5mm, with some larger specifications negotiable. Flatness specifications include TTV values of ≦10μm and ≦15μm for listed sizes, BOW ranges from -10 ~ 0μm through -25 ~ 0μm, and Warp values from ≦15μm through ≦30μm, with larger-size items marked for consultation. Front-side finishing is listed as Epi-ready with Ra＜0.3nm, back-side finishing as Lapping with Ra 0.6 - 1.2μm, and packaging as vacuum packaging in a clean room. For Prime grade wafers, the reference cleaning values include particles of 0.3μm or larger at 0.18 pcs/cm2 or less and metal contamination at 2E10/cm2 or less, with TXRF used for the listed metal-contamination measurements. Sapphire-wafer specifications can be customized for a-, r- and m-plane orientations, off-angle changes, shape changes and double-side polishing, allowing the substrate format to be adapted for different development and process requirements. Additional processing and service options include substrate drilling, grooving, cutting and backside polishing, as well as optional attachment of measurement data for substrate cleanliness and substrate shape. Depending on specification, inventory is available for substrates from 2 to 8 inches and for sizes up to 300mm, providing stocked options alongside the customizable sapphire-wafer program. NAPHIA™️ Prime grade wafers are also included in Orbray Co., Ltd.'s sapphire-wafer offering as a named Prime grade substrate line.
Capabilities and products
- Bonding Capillary wire-bonding tool
- ultra-high-precision machining
- large-diameter diamond substrate development
- beta-type Ga2O3 wafer substrates
- c/r/a/m-plane sapphire wafers
- sapphire wafer off-cut angle control to 0.1°
- Epi-ready sapphire surface at Ra＜0.3nm
- sapphire substrate drilling, grooving, cutting and backside polishing