At a glance
| Booth | N0166, T9124 |
| Country | JP |
| Product categories | Wire Bonding Equipment · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Polysilicon or granular polycrystalline silicon; Crystal growing Material · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Substrate Materials · Micro Machining services (small hole drilling and milling) · Assembly · Manufacturing Process Support and Development |
| Website | orbray.com |
Company profile
Since 2023, our company has changed its name from “ADAMANT Namiki Precision Jewel Co., Ltd.” to Orbray. Since we began manufacturing sapphire bearings, we have continuously applied our three core technologies— cutting, grinding, and polishing —to expand our precision processing expertise into various fields. The components produced by Orbray are extremely small and may not be directly visible in everyday life, yet these precision parts quietly play crucial roles around us. Among them, the Bonding Capillary (wire bonding tool) is one of our flagship products. We use a high-quality zirconia-reinforced alumina ceramic that is different from what other companies use. This material was developed based on years of accumulated technical expertise, breaking through the limitations of conventional processing methods. Through Orbray's proprietary ultra-high-precision machining technology, we have achieved exceptional surface smoothness and uniformity in shape. At the same time, by adding zirconia, we have significantly improved the ceramic's wear resistance, not only extending the product’s lifespan but also enhancing the efficiency and yield of the wire bonding packaging process. In addition, our company is dedicated to the development of large-diameter diamond substrates. Leveraging the outstanding physical properties of diamond, we aim to meet the core demands of high-performance semiconductor devices in terms of thermal management, radiation resistance, high frequency, and high power. This effort actively contributes to the advancement of the semiconductor industry.
Capabilities and products
- Bonding Capillary wire bonding tools
- diamond substrates for high-power semiconductor thermal management
- large-diameter diamond substrates
- ultra-high-precision machining for ceramic capillary smoothness
- zirconia-reinforced alumina ceramic capillaries