At a glance
| Booth | Q5842 |
| Country | JP |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Package Inspection; Lead Scanners · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Conveying; Material Handling Systems · Robotics; Transfer Systems · Factory Automation; Cell Controller Software · Manufacturing Execution Software (MES) · Production Control software · Measurement; Inspection Service · Automation & Robotics · Factory; Industrial Control; Utilization & Automation |
| Website | www.fa.omron.co.jp |
Company profile
As we enter the era of heterogeneous computing, various 3D-ICs are being put into practical use. OMRON offers various inspection equipment compatible with the mounting technology required for 2.5/3D mounting. We would like to introduce our CT scan type 3DX ray automatic inspection equipment and optical automatic appearance inspection equipment. Additionally, OMRON will contribute to improving the quality of power semiconductors, which are increasing as the EV industry market expands. We support efficient "good quality product manufacturing " by automating inspections and inline inspections (dimensional inspections and CT scan type 3D X) in our customers' manufacturing processes.
Capabilities and products
- CT scan type 3D X-ray automatic inspection equipment
- inline dimensional inspection automation
- inspection equipment for 2.5/3D mounting technology
- optical automatic appearance inspection equipment
- power semiconductor inspection automation
Related product topics
- Automated Optical Inspection (AOI)
- Semiconductor Inspection Equipment
- Semiconductor Packaging Inspection Systems
- Industrial X-Ray Inspection Systems
- X-Ray CT Inspection Equipment
- Advanced Packaging Substrate Inspection
- Automated Optical Inspection Systems
- AOI and Metrology Equipment
- Inspection & Metrology Equipment