At a glance
| Booth | I2308 |
| Country | TW |
| Website | www.nordson.com |
Company profile
Nordson Advanced Technology LLC, Taiwan Branch presents equipment from Nordson ELECTRONICS SOLUTIONS divisions for SMT, PCB assembly, semiconductor packaging, and other electronics-manufacturing processes. The stated purpose of these technologies is to give customers greater control of manufacturing operations and help them produce more reliable products. Its test and inspection portfolio includes Acoustic Micro Imaging systems from Nordson SONOSCAN, Automated Optical Inspection from Nordson YESTECH, and Automated X-Ray systems from Nordson MATRIX. The same portfolio includes DAGE Bond and Material Testing, DAGE Manual X-Ray Inspection, and WaferSense metrology sensors. Processing technologies include automated fluid dispensing and coating from Nordson ASYMTEK and plasma cleaning and surface treatment from Nordson MARCH. Nordson equipment is backed by a global network of service and applications support. Within semiconductor manufacturing, the company addresses customers such as IDMs, foundries, and OSATs that are working toward smaller and more powerful chips while maintaining product reliability. Its semiconductor materials-processing focus connects advanced fluid dispensing and plasma surface treatment with packaging reliability, high-throughput manufacturing, and the needs of advanced integration.
Exhibits
The exhibit offering includes precision fluid dispensing, plasma treatment, selective soldering, and conformal coating for printed circuit boards. Nordson also lists engineered fluid-dispensing equipment for applying fluids in assembly processes, together with single-use components. Inspection and metrology categories include X-ray inspection, semiconductor inspection and metrology sensors, acoustic inspection, and optical inspection. For wafer-level packaging, Nordson describes WLP as covering fan-in and fan-out, chip-first and chip-last, chip-on-wafer, wafer-level system-in-package architectures, 2D, 2.5D, and 3D IC stacks, and chiplet architecture applications. For panel-level packaging, the company notes that SEMI Standard 3D20 was released in 2019 to standardize panel sizes and support equipment development for PLP. The company contrasts 200mm or 300mm round-wafer WLP with large square-panel PLP and cites an example in which a 300mm wafer can process 2,500 packages of 6mm x 6mm while a 600mm x 600mm panel can accommodate 12,000 packages. Nordson states that it is partnering with leading semiconductor manufacturers to integrate its systems with Overhead Hoist Transport (OHT) and Automated Guided Vehicle (AGV) material-handling systems for traceability, lights-out factory, Industry 4.0, and factory-of-the-future objectives. In semiconductor packaging, fluid dispensing is used for adhesion, structural integrity, thermal and electrical conductivity, protection, and other functions while increasingly small chip and component gaps require precise, consistent delivery of smaller fluid volumes. The listed ASYMTEK application range includes system in package (SiP), integrated passive devices, CoW, CoWos, BGA, PoP, CSP, PCB/Flex circuit, flip-chip underfill, flux dispensing for flip-chip, CPU/GPU lid sealing, thermal interface material dispensing, and sealing for lid attachment. The Forte MAX Dual-Valve solution is described as accommodating skewed parts with automated real-time adjustment, while the IntelliJet® Jetting System is presented for small dot sizes and narrow stream widths that help prevent die contamination. The Forte® Series is described as a dispensing platform for high accuracy and throughput, and the Vantage® Series is identified for high-end, high-accuracy advanced semiconductor applications. The ASYMTEK Vantage® Series is positioned as a precision fluid-dispensing platform spanning wafer to panel for advanced packaging, while the ASYMTEK Forte® Series targets dispensing productivity and accuracy for high-volume consumer electronics and printed circuit board assembly. The ASYMTEK Spectrum II S2-900 Precision Fluid Dispensing System is listed for assembly of mobile electronics, semiconductors, MEMS, and related products, and the IntelliJet® Jetting System uses a patented ReadiSet® Jet Cartridge. For plasma surface treatment, Nordson states that plasma removes impurities and activates surfaces to enhance flow and adhesion for improved package reliability. Listed MARCH plasma applications include wafer cleaning, descum, stripping and etch for wafer-level processing, VIA cleaning, wafer pre-treatment, BCB and UBM adhesion, dielectric patterning, bump adhesion, pre-die attach treatment, pre-wire bond treatment, pre-underfill treatment, pre-encapsulation and molding treatment, and MEMs. The Stratosphere™ Plasma System supports high-throughput processing of wafers up to 300mm and is described in terms of etch uniformity, process repeatability, and control. The MARCH AP Batch Series is intended for batch manufacturing and R&D environments, while MARCH FlexTRAK® systems provide high-throughput strip-type and inline boat processing. The MARCH SPHERE™ Series provides high-uniformity plasma surface treatment for wafer-level (WLP) and panel-level (PLP) packaging applications. Taken together, the exhibit scope connects inspection, metrology, fluid dispensing, coating, soldering, and plasma processing with semiconductor packaging, PCB assembly, wafer-level packaging, panel-level packaging, and other electronics-manufacturing workflows.
Capabilities and products
- Acoustic Micro Imaging (AMI) inspection systems
- Automated Optical Inspection (AOI)
- Automated X-Ray inspection (AXI)
- bond and material testing
- Manual X-Ray Inspection (MXI)
- WaferSense metrology sensors
- automated fluid dispensing and coating
- plasma cleaning and surface treatment
- precision fluid dispensing for PCBs
- selective soldering for PCBs
- conformal coating of printed circuit boards
- high-uniformity plasma surface treatment for WLP/PLP
- flip-chip underfill dispensing
- flux dispensing for flip-chip
- CPU/GPU lid sealing
- thermal interface material dispensing
- VIA plasma cleaning for wafer-level processing
- high-throughput plasma processing for wafers up to 300mm