基本資料
| 攤位 | I2308 |
| 國別 | TW |
| 產品分類 | Die Bonding; Attach Equipment · Dispensing Systems · Molding; Encapsulation; Decapsulation Equipment · Solder Reflow; Soldering & Brazing Equipment · Liquid Crystal Injection or Filling Equipment · Seal Patterning Equipment · Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi · Die Inspection; Die Shear · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Deep RIE etching; Dry Etching · Equipment, Nanotechnology Tools · Cells · Inspection and Metrology · Modules · Other · Thin Film · Wafers · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Failure Analysis Systems · Optical Test Systems · Handling; Transfer; Loading Systems; Lifting devices · Plasma Sources; Controls; Monitoring; Diagnosis · Conveying; Material Handling Systems · Robotics; Transfer Systems |
| 網站 | www.nordson.com |
公司簡介
Nordson ELECTRONICS SOLUTIONS 旗下各事業部將展示適用於 SMT、PCB 組裝、半導體封裝及其他電子製造領域眾多製程的設備。我們的技術提供創新解決方案，讓客戶能更有效掌控其作業流程，生產更可靠的產品。檢測與檢驗 — 聲學顯微成像系統（AMI）：Nordson SONOSCAN；自動光學檢測（AOI）：Nordson YESTECH；自動 X 光檢測（AXI）：Nordson MATRIX；接合與材料測試（BT）：DAGE；手動 X 光檢測（MXI）：DAGE；計量感測器：WaferSense。製程技術 — 自動流體點膠與塗佈：Nordson ASYMTEK；電漿清潔與表面處理：Nordson MARCH。Nordson 的設備由屢獲殊榮的全球服務與應用支援網絡作為後盾。
能力與產品項目
- DAGE 鍵合與材料測試 (BT)
- Nordson ASYMTEK 自動流體點膠與塗佈
- Nordson MARCH 電漿清洗與表面處理
- Nordson MATRIX Automated X-Ray (AXI)
- Nordson SONOSCAN Acoustic Micro Imaging systems (AMI)
- Nordson YESTECH Automated Optical Inspection (AOI)
- SMT、PCB 組裝與半導體封裝製程設備
- WaferSense 量測感測器