At a glance
| Booth | M0158 |
| Country | TW |
| Product categories | Equipment, Nanotechnology Tools · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Lead Frames & Headers: Etched; Stamped · Package Substrates; Laminate; Film based · Printed Circuit Boards (PCB); Printed Wire Boards (PWB) · Tape Automated Bonding (TAB) Accessories · Thermal Interface Materials; Heat Sinks · Spacer Materials · Materials, Nanotechnology · Consumables · Chucks for Wafer and other Substrates · Other |
| Website | www.niching.com.tw |
Company profile
Niching Industrial Corp. is a Taiwan-based semiconductor and advanced-materials channel company. Founded in 1993, it established a marketing channel for semiconductors, flat-panel displays, LEDs, green energy and nanotechnology. Niching was listed in Taiwan in 2008 under stock code 3444 and established a nano-material laboratory in 2005. It developed Taiwan's first self-made touch nano silver in 2013. Its product areas cover semiconductor consumables and materials such as heat sinks, silver paste and cutting blades, with locations including Taichung, Hsinchu, Kaohsiung and Suzhou.
Exhibits
利機自2005年即正式成立奈米材料實驗室，開發自主技術，具備網印型, 雷射雕刻型, 凹版轉印型, 可凹折型, 點膠型, 金屬壓印及燒結型等各種銀漿的配方開發能力與相關應用技術, 並可針對客戶需求, 進行客製化配方修改。 採用各式化學官能基表面改質技術, 及物理或化學混成分散方法, 將有機材料與無機材料產生均相材料, 而產生特殊的材料機械, 光學, 物理, 或化學性質, 具備廣泛的應用。 運用溼式化學製程技術, 製作各種奈米級銀材料, 具備奈米銀粒與奈米銀絲等 開發與生產能力。
Capabilities and products
- die-bonding tools
- etched and stamped lead frames and headers
- nanoporous carbon materials
- package substrates, laminate and film-based materials
- semiconductor cutting blades
- semiconductor heat sinks
- semiconductor silver paste
- wire-bonding capillaries and bonding tools