At a glance
| Booth | M0158 |
| Country | TW |
| Website | www.niching.com.tw |
Company profile
Niching Industrial Corp. is a Taiwan-based semiconductor and advanced-materials channel company and a professional sales-channel provider for semiconductor and other high-tech industries, providing value-added services to customers. The company was founded in 1993 and developed marketing channels serving semiconductors, flat-panel displays, LEDs, green energy and nanotechnology. Niching Industrial Corp. was listed in Taiwan in 2008 under stock code 3444, and its nano-material laboratory was formally established in 2005 to develop proprietary technologies. In 2013, the company developed Taiwan's first self-made touch nano silver. Its operating locations include Taichung, Hsinchu, Kaohsiung and Suzhou.
Exhibits
For semiconductor, LCD and LED testing and assembly, Niching Industrial Corp. provides FC-CSP, PBGA/CSP and MCP/UTCSP together with related substrates, lead frames, wire-bonding capillaries and die-bonding tools, dicing solution, die-bonding resin, embossed tape, chip-transport trays for wire-bonding tests, aluminum-coated wafers and daisy-chain wafers. Its nanotechnology offerings include silver paste and nanoporous carbon, while another product description also identifies silver paste and nano top carbon. The nano-material laboratory develops formulations and application technologies for screen-printing, laser-engraving, gravure-transfer, foldable, dispensing, metal-imprinting and sintering types of silver paste and can modify formulations for customer requirements. Niching Industrial Corp. applies surface modification using various chemical functional groups together with physical or chemical hybrid-dispersion methods to combine organic and inorganic materials into homogeneous materials with distinctive mechanical, optical, physical or chemical properties for broad applications. Wet-chemical process technology is used to make nanoscale silver materials, with development and production capabilities for nano-silver particles and nano-silver wires. The self-made silver-product range includes customized silver paste, low-temperature pure-silver sintering paste, low-temperature semi-sintering silver paste, anisotropic conductive adhesive material, high-thermal-conductivity silver adhesive and screen-printing silver paste. The product overview also includes IC packaging substrates, memory substrates and logic-IC substrates, along with vacuum valves such as butterfly valves, pendulum valves, gate valves and anti-contamination angle valves. Packaging and test-related products include heat spreaders, high-precision QFN lead frames, bonding needles, packaging components, wire-bonding test chips, reclaimed wafers, aluminum-coated sample chips and sample chips. LCD-related products include chip carrier trays, COF spacer tape and COF substrate transport reels, while cutting and thinning products include hard blades, soft blades and thinning grinding wheels. The semiconductor consumables and materials range also includes heat sinks, silver paste and cutting blades.
Capabilities and products
- screen-printing silver paste formulation development and customization
- laser-engraving silver paste formulation development and customization
- gravure-transfer silver paste formulation development and customization
- flexible silver paste formulation development and customization
- dispensing silver paste formulation development and customization
- metal-imprinting and sintering silver paste formulation development
- low-temperature pure-silver sintering adhesives
- low-temperature semi-sintering silver adhesives
- anisotropic conductive adhesive materials
- high-thermal-conductivity silver adhesives
- silver nanoparticle development and manufacturing
- silver nanowire development and manufacturing
- organic/inorganic homogeneous hybrid material fabrication
- nanoporous carbon supply
- memory IC package substrate supply
- logic IC package substrate supply
- high-precision QFN leadframe supply
- wire-bonding capillary supply
- die-bonding tool supply
- wafer dicing fluid supply
- die-bonding resin supply
- embossed tape supply
- chip transport tray supply
- aluminum-coated wafer supply
- daisy-chain test wafer supply
- vacuum butterfly valve supply
- vacuum pendulum valve supply
- vacuum gate valve supply
- chemical-contamination-resistant angle valve supply
- heat spreader supply
- bonding needle supply
- wire-bonding test chip supply
- reclaimed wafer supply
- aluminum-coated sample die supply
- COF spacer tape supply
- COF substrate transport reel supply
- wafer dicing blade supply
- wafer thinning grinding wheel supply