Netherlands Office Taipei

Exhibitor at SEMICON Taiwan 2026 · Booth K2760

Booth K2760Country TW1 product topics
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BoothK2760
CountryTW
Websitesemicontaiwan.org/en/about/pavilions/Netherlands-Pavilion
Exhibitor profile

Company profile

The Netherlands Pavilion proudly presents a curated lineup of 19 pioneering companies delivering cutting-edge technologies across the semiconductor value chain, including manufacturing equipment, chip design, heterogeneous integration, advanced packaging, photonics, metrology, AI and edge acceleration, and quantum technologies. Participating companies include: • Axelera AI-Metis™ AI platform: a complete hardware and software solution for AI inference at the edge. • Boschman-Advanced packaging equipment and technology. • Fastmicro-Particle defect inspection tools, including sample and fallout scanners. • Fonontech-Equipment based on impulse printing technology. • Hitec Power Protection-Dynamic UPS systems. • HQ Pack-Packaging design, production, and refurbishment for returnable high-tech packages. • ITEC-Advanced die attach equipment and semiconductor assembly solutions for IC packaging, LED, and RFID applications. • Invest in Holland – Gateway to investment opportunities and business support in the Dutch high-tech ecosystem. • Mecal High-Tech Systems-Development and integration of advanced mechatronic solutions. • MicroAlign-High-precision fiber alignment and photonic packaging solutions for silicon photonics and optical interconnects. • NTS-Precision mechatronic systems, mechanical modules, and contract manufacturing solutions for the semiconductor and high-tech industries. • OrangeQS-Wafer metrology and quality control solutions, specializing in automated wafer inspection, measurement, geometry analysis, and manufacturing process monitoring. • Prodrive Technologies-High-performance components including cameras, motion controllers, embedded systems, and plasma control technologies; system integration services. • Qualinx BV-Ultra-low-power GNSS chips and Digital RF technology for IoT positioning and edge devices. • Schunk Xycarb Technology-Tantalum-coated products for semiconductor manufacturing. • SCIL Nanoimprint Solutions-FabSCIL for nanoscale patterning. • SFC-High-power bespoke power supplies and custom precision coil assemblies. • Tempress -Diffusion and deposition solutions • Trymax-Semiconductor plasma-based equipment and process solutions.

Exhibitor profile

Exhibits

Semiconductor-value-chain products and services include the Metis™ edge-AI platform; advanced packaging and die-attach equipment; particle-defect inspection scanners; impulse-printing equipment; dynamic UPS systems; returnable high-tech packaging; advanced and precision mechatronic systems; high-precision fiber alignment and photonic packaging; wafer metrology and automated inspection; cameras, motion controllers, embedded systems and plasma-control technologies; ultra-low-power GNSS chips and Digital RF; tantalum-coated products; FabSCIL nanoscale patterning; bespoke high-power power supplies and precision coils; diffusion/deposition solutions; and semiconductor plasma equipment/process solutions. The pavilion also includes investment/business support, contract manufacturing and system-integration services.

Exhibitor profile

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