At a glance
| Booth | T9201 |
| Country | CN |
| Website | www.wintime.net.cn |
Company profile
Nantong Wintime Semiconductor Technology Co., Ltd., founded in 2020, is a high-tech enterprise integrating the R&D, production, and sales of high-precision dicing blades for wafer-level processing. The company provides full-process precision dicing solutions intended to improve dicing quality and reduce production costs, linking its blade products with a broader process-solution approach. It has become an accredited supplier of high-precision dicing blades, dicing tapes, and customized dicing solutions for numerous leading enterprises in China and abroad. In 2023, Nantong Wintime Semiconductor Technology Co., Ltd. launched a special semiconductor materials project with total investment of nearly tens of millions of RMB. The project includes newly built workshops and auxiliary buildings spanning 34,000 square meters and an annual output capacity of more than one million dicing blades, which the company describes as ranking among the top in China. The company holds 31 patented technologies and has received multiple awards in national, provincial, and municipal science and technology competitions as well as entrepreneurship contests. Its completed R&D project for ultra-thin wafer dicing blades uses proprietary craftsmanship to achieve blade thickness below 9 micrometers, with product performance described as reaching world-leading standards. Nantong Wintime Semiconductor Technology Co., Ltd. therefore combines high-tech-enterprise status, dicing-blade research and manufacturing, patented technology, scaled production capacity, and full-process dicing solutions in its stated company profile. The company states that it settled in Nantong, Jiangsu in 2021, adding a location milestone after its 2020 establishment while continuing its integrated wafer-level high-precision dicing-blade business. The company page also reports Jiangsu provincial specialized-SME recognition and an annual technology breakthrough award for high-precision 9-micrometer cutting achieved with an electroformed hard blade.
Exhibits
The DZY dicing blade uses a process that integrates the blade with an aluminum alloy flange to provide higher precision and is suitable for grooving and cutting hard and brittle materials such as silicon wafers and compound semiconductors including gallium arsenide. Its manufacturing technology controls diamond-abrasive concentration and bond composition to reduce chipping during cutting, adding a process-control element to the DZY blade's precision-oriented design. The DZR dicing blade is made from metallic nickel and diamond abrasive, features an ultra-thin structure and cutting performance, and is intended for grooving and dicing semiconductor wafers, functional ceramics, alloy materials, and semiconductor packaging materials. Another ultra-precision dicing blade is made by sintering heat-resistant resin powder, auxiliary additives, and diamond abrasives and is suitable for cutting semiconductor materials, ceramic materials, glass, crystal, quartz, and related materials. UV Reducing Adhesive Film uses PO or PET film as its base material with UV light-curing acrylic adhesive that reduces adhesion and is used in the electronics industry for protection against acid, alkali, and high-temperature processes. The company's product center lists DZY-series dicing blades, DZR-series dicing blades, DZR-S grooved dicing blades, JS-series metal blades, SZ-series resin blades, sharpening plates, UV reducing adhesive tape, conductive silver paste, glass powder, and grinding wheels. DZY dicing blades are presented for high-precision wafer cutting that meets semiconductor-packaging requirements for cutting accuracy and efficiency. DZR dicing blades are described as broadly used in semiconductors, optical communications, and new functional materials, providing efficient and stable cutting solutions in those industries. DZR-S grooved dicing blades are listed for semiconductor-wafer cutting, functional-ceramic cutting, alloy-material cutting, and cutting of semiconductor packaging components. The metal-blade category removes metal material through high-speed blade rotation driven by a spindle, while the resin-blade category is described as a professional cutting tool with high performance, high precision, broad application coverage, and stated performance advantages. The UV reducing adhesive tape is described as strongly adhesive under normal conditions but with adhesion that decreases sharply after ultraviolet (UV) irradiation, giving it a controlled-release function in addition to the process-protection role described for the film. Nantong Wintime Semiconductor Technology Co., Ltd. organizes its cutting solutions around semiconductor wafer, substrate, and material categories and states that it provides high-precision cutting solutions through the full process to improve cutting quality and lower production cost. The company also states that its ultra-thin dicing-blade process reaches thickness within 9 micrometers and that annual dicing-blade production exceeds one million pieces, supporting the high-precision and scaled-production aspects of its offering.
Capabilities and products
- Ultra-thin wafer dicing blades within 9 micrometers
- High-precision wafer dicing solutions
- Slotted wafer dicing blades
- Metal cutting blades
- UV-release dicing tape
- Dicing blade dressing boards
- Conductive silver paste
- Glass powder
- Grinding wheels
- Wafer dicing blades with integrated aluminum-alloy flanges
- Nickel-bonded diamond dicing blades
- Resin-bonded diamond dicing blades