MICRONICS JAPAN CO., LTD.

Exhibitor at SEMICON Taiwan 2026 · Booth K2960

Booth K2960Country JP6 product topics
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BoothK2960
CountryJP
Websitewww.twmjc.com.tw
Exhibitor profile

Company profile

MICRONICS JAPAN CO., LTD. develops, manufactures and sells probe cards used for wafer inspection in semiconductor processes, semiconductor testers, wafer probers and FPD inspection equipment. Its main product is the semiconductor probe card, an inspection interface used to judge wafer quality; the printed circuit board can carry up to a hundred-and-some thousand ultra-precision probes, which contact wafer electrodes to transmit signals from the tester. The company plans and builds key probe-card production equipment in-house so that integrated production management can support product development and delivery responses for different requirements. The MEMS U-Probe is used for memory-device wafer One Touch Down testing, and MICRONICS JAPAN CO., LTD. states that it holds the global No.1 market share in probe cards for memory testing. Vatry is a vertical probe-card product for highly integrated and high-speed Logic and SoC devices, using a structure developed from conventional vertical probe cards and supporting products with more than 10,000 pins. MEMS-SP uses a MEMS spring-pin structure for flip-chip package testing of microprocessors and SOC devices and is described as providing strong contact performance and maintainability, with additional probe-card offerings for small Pad and LCD-Driver applications. Beyond probe cards, the company provides semiconductor Test Sockets for high-frequency testing, compact testers and wafer probers developed for requirements ranging from analysis to power-device testing. In Taiwan, the company works with its Taiwan subsidiary 美科樂電子 for sales and integrated after-sales service in support of semiconductor-test products and customer requirements.

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Exhibits

MICRONICS JAPAN CO., LTD. provides testing solutions for semiconductor design and manufacturing from probe cards, testers and wafer probers used in wafer testing to test sockets used in final testing. The probe card is the key interface equipment for measurement reliability during semiconductor wafer testing as semiconductor processes move toward higher density, higher speed and higher efficiency. During wafer testing, semiconductor devices on wafers are tested for electrical properties, while wafer probers are used for IC characteristic evaluation, reliability evaluation and defect analysis and perform high-precision measurement and evaluation of test element groups (TEG), including process characteristics and electrical verification. A semiconductor tester provides an electrical signal to a semiconductor IC, compares the output signal with the expected value and checks whether the IC operates according to its design specifications. In final inspection, completed IC chips receive performance and reliability inspection using a test socket. MJC provides two types of Test Socket and manufactures them to match the specifications of the customer's test environment. BeeContacts test sockets use a self-cleaning structure, are suitable for lead-free packages and are described as providing long service life that can reduce cleaning frequency and improve yield. J-Contacts provides high-reliability test sockets for measuring high-frequency devices, complementing probe-card, tester and wafer-prober solutions across wafer and final test stages. In the wafer process, a circuit pattern is printed on the wafer and a fine electronic circuit is formed by injecting ions before wafer electrical testing. During assembly, IC chips are cut from the wafer and encapsulated in a package using a resin mold before they proceed to final inspection. The semiconductor-series application categories shown with these testing solutions include Computer, Mobile phone, Smart car, Smart appliances and Wireless. Together, probe cards, wafer probers, testers and test sockets cover measurement and evaluation from wafer-process development and wafer electrical testing through package-level final inspection.

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