At a glance
| Booth | L1105 |
| Country | TW |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Spin on glass material · Surface protection material; coatings |
| Website | www.microcosm.com.tw |
Company profile
Established in 1996, Microcosm Technology Co., LTD. specializes in the development, production, and innovation of high-performance FCCL and functional polyimide materials for the semiconductor, display, and FPCB industries. With expertise in independent key material formulation, synthesis technology, and professional production, we provide advanced materials and solutions such as colorless and transparent polyimide, alkaline removable peelable materials, flexible printed circuits board, bonding sheet, coverlay, copper-clad laminates, and photosensitive polyimide (PSPI). Our commitment to research and development ensures high-reliability and high-quality products that meet the evolving demands of the global electronics industry. Microcosm Technology Co., LTD. is a partner of choice for businesses seeking advanced materials and solutions to stay ahead of the competition. Our relentless pursuit of innovation has allowed us to develop strong relationships with industry-leading companies around the world. Our collaborative approach ensures that we understand the unique challenges faced by our clients and deliver tailored solutions that drive their success.
Capabilities and products
- adhesives, epoxies, die attach compounds and underfill materials
- alkaline removable peelable materials
- bonding sheet materials
- colorless and transparent polyimide
- copper-clad laminates
- coverlay materials
- flexible printed circuits board materials
- functional polyimide materials for semiconductor and display industries
- high-performance FCCL materials
- photosensitive polyimide (PSPI)