At a glance
| Booth | L0100 |
| Country | MY |
| Website | www.mi-eq.com |
Company profile
Mi Equipment (M) Sdn. Bhd. is an engineering company located in Malaysia whose key activities are developing advanced machines for the wafer and die processing industry. The company provides total solutions with core competency in automation and R&D and develops value-added features for packaging-equipment applications in key niche markets. Mi Equipment describes itself as a semiconductor equipment solutions provider offering AI Enabled Die Sorting & Smart Binning, Wafer Reconstruction, Precision Bonding, Laser Bonding, Test Handling, AI Vision Inspection and Smart Factory platforms through its Mi, Ai, Si and Vi product series. Its equipment and platforms serve Mobility & Wearables, HPC & Memory, and Automotive & Renewable Energy segments. Mi Equipment has R&D centers and manufacturing facilities in Malaysia and China, together with sales and service networks covering Asia, North and Central America, and Europe. The company is part of Mi Technovation Berhad and organizes its development history into Seed Stage for 2007-2009, Startup Stage for 2010-2013, Growth Stage for 2014-2018, Expansion Stage for 2019-2023, and Diversification Stage from 2024 to the present. Its stated mission for the semiconductor value chain emphasizes innovation and problem-solving, active listening, effective communication and execution, quality, and cost and time efficiency, together with sustainable growth for employees, suppliers and shareholders. Mi Equipment lists Aqua Save Certification and Penang Green Office Certification among its recognitions, as well as Top Semiconductor Manufacturing Solutions Provider recognition for 2024 and 2023 and an Industry Excellence Platinum Award in 2023. Other listed recognitions include Outstanding Supplier awards in 2023, 2019, 2018 and 2017, a Certificate of Recognition from TF AMD in 2021, Best Supplier of Equipment in 2020, Supplier Partnership Award in 2017, Family Award in 2017, Penang Green Office Certification for 2022-2024, and Sustainable Water Management Certification for 2022-2024. Mi Equipment's stated vision is to lead and contribute to global cutting-edge semiconductor equipment and process through innovation and excellence. Its mission also calls for fair returns to employees, suppliers and shareholders so that ongoing investment and sustainable growth can be facilitated beyond a focus on profit alone. The mission is framed around progress for clients and stakeholders within the semiconductor value chain.
Exhibits
Mi Equipment (M) Sdn. Bhd. supplies AI Enabled Die Sorting & Smart Binning, Wafer Reconstruction, Precision Bonding, Laser Bonding, Test Handling, AI Vision Inspection and Smart Factory platforms through the Mi, Ai, Si and Vi series. These solutions address semiconductor equipment and process requirements across Mobility & Wearables, HPC & Memory, and Automotive & Renewable Energy segments. The same product and process portfolio is supported by R&D and manufacturing operations in Malaysia and China and by sales and service coverage across Asia, North and Central America, and Europe. For wafer and die processing users, the range combines sorting and smart binning, wafer reconstruction, bonding, handling, inspection and smart-factory functions within the company's equipment series, linking individual process steps with automation and R&D capabilities.
Capabilities and products
- AI-enabled die sorting and smart binning equipment
- wafer reconstruction equipment
- precision bonding equipment
- laser bonding equipment
- test handling equipment
- AI vision inspection equipment
- smart factory platforms