At a glance
| Booth | L0100 |
| Country | MY |
| Product categories | Die Sorter; Pick & Place; Flip Chip Placement Systems |
| Website | www.mi-eq.com |
Company profile
Mi EQUIPMENT (M) SDN BHD is an engineering company, located in Malaysia, with key activities in developing advance machines for the wafer and die processing industry. Mi EQUIPMENT provides reliable and affordable total solution to customers with core competency in automation and R&D. Mi EQUIPMENT will go one step further by introducing value added features that will position Mi EQUIPMENT as leading Solutions Provider of packaging equipment in key niche market.
Exhibits
Mi Equipment is a Leading Semiconductor Equipment Solutions Provider, offering advanced AI Enabled Die Sorting & Smart Binning, Wafer Reconstruction, Precision Bonding, Laser Bonding, Test Handling, AI Vision Inspection and Smart Factory platforms through our Mi, Ai, Si and Vi series of products serving the in Malaysia and China as well Sales & Service networks covering Asia, North & Central America and Europe. We are Leading & Contributing to Global Cutting-Edge Semiconductor Equipment & Process with Innovation and Excellence. To be a beacon of progress for our clients and stakeholders within the semiconductor value chain through: To offer fair returns to our employees, suppliers & shareholders, facilitating ongoing investments and promoting sustainable growth; extending beyond mere profit. Top Semiconductor Manufacturing Solutions Provider Top Semiconductor Manufacturing Solutions Provider
Capabilities and products
- AI Enabled Die Sorting & Smart Binning
- AI Vision Inspection systems
- Smart Factory platforms for semiconductor equipment
- advanced machines for wafer and die processing
- die sorter, pick & place and flip chip placement systems
- laser bonding equipment
- precision bonding equipment
- test handling equipment
- wafer reconstruction equipment
Related product topics
- Smart-Factory System Integration
- IC Test Handlers and Positioner Systems
- Semiconductor Packaging Equipment
- Die Attach Equipment
- Die Sorter & Flip-Chip Placement
- Flip-Chip Placement Systems
- Wire and Die Bonding Equipment
- Die Removal and Sorting Equipment
- AI-Powered Inspection
- AI Visual Inspection Systems
- Wafer Processing and Foundry Services
- Semiconductor Test Handlers
- Package Singulation and Die Sorting