At a glance
| Booth | R7312 |
| Country | KR |
| Website | www.metasol.co.kr |
Company profile
MetaSOL Co., Ltd. develops light-based process solutions for advanced semiconductor packaging and glass substrates, using controlled Intense Pulsed Light, or IPL, as a core process technology. Its approach applies short, controlled optical pulses as an alternative to selected conventional thermal, laser, and chemical methods, with goals of faster processing, lower temperature exposure, and reduced device damage. The company's R&D scope covers advanced semiconductor packaging processes, functional materials, system engineering, material engineering, and data-driven research using AI and ML for material design and process-data analysis. System engineering addresses complete packaging equipment and process systems rather than isolated components, integrating optical, mechanical, thermal, and control functions to improve equipment compatibility, process control, yield, and productivity. Material engineering covers adhesive materials, thermal-interface materials, insulating materials, electrolyte materials, and other functional materials used in semiconductor packaging and energy-storage processes. The material-development workflow includes property analysis, formulation optimization, synthesis, reliability evaluation, and process validation for production use. The company reports a portfolio of more than 20 patents and describes milestones that include ten domestic patents by 2020, establishment of a corporate research institute in 2022, completion of an internally developed photonic-debonding prototype in 2023, and TGV-related patent activity in 2024. International collaboration includes joint research relationships with partners in Japan and Europe, and the company also reports participation in an industrial R&D project for solid-electrolyte materials. For manufacturing deployment, the engineering scope extends from equipment and system design through process optimization and mass-production application, with real-time monitoring, feedback control, recipe management, and data logging. The process-control architecture collects and manages variables such as energy, temperature, and alignment to improve repeatability and support yield analysis and continuous process improvement in production.
Exhibits
IPL Photonic Debonding uses full-area, non-scanning irradiation across the wafer for high-throughput release, with the Meta-IAL™ absorption layer identified as the core material for the process. The debonding concept applies a short broadband optical pulse through a glass carrier so that the absorbing release layer reacts selectively, separating the device wafer and carrier without mechanically peeling the device structure. The process is described for low-temperature operation with minimized device damage and can support 200 mm and 300 mm wafers as well as warped wafers and ultra-thin wafers below 20 ㎛. Photonic debonding supports wafer thinning and backside processing for heterogeneous integration, including 3D TSV stacked packaging, fan-out wafer-level packaging, and HBM-related advanced packaging. Optical-system engineering for debonding includes wavelength selection, beam shaping, optical-uniformity control, simulation, and measurement-based verification to produce uniform energy distribution across the wafer. Precision stages and chucks are designed for 200 mm and 300 mm wafers, with alignment mechanisms and structures intended to suppress vibration and thermal deformation and to connect with fab automation such as EFEM and transfer robots. For TGV and copper metallization, IPL sintering can complete copper-paste metallization in seconds rather than the tens of minutes associated with conventional thermal ovens, while preventing deformation of the glass substrate. TGV forms fine conductive paths vertically through glass by creating micro-vias and filling them with conductive materials such as copper, providing short electrical connections between chips or between a chip and substrate. The glass-interposer approach is described for 2.5D and 3D packaging and benefits from surface flatness, rigidity, adjustable coefficient of thermal expansion, low dielectric loss, and low dielectric constant for high-frequency signal transmission. TGV applications include AI semiconductors, high-performance computing, 5G and 6G RF modules, chiplet-based heterogeneous integration, and fan-out panel-level packaging where signal integrity, power delivery, miniaturization, and high-density routing are required together. The material portfolio includes internally developed copper and silver conductive inks and pastes whose compositions and sintering conditions are optimized together for electrical conductivity in the customer's process environment. Low-viscosity conductive inks are offered for EHD printing of fine patterns, including high-precision applications such as OLED manufacturing, while high-viscosity inks and pastes are suited to pneumatic dispensing for thicker and stable patterns. Additional formulations support screen printing and bar-coater or blading processes, allowing material selection to match the customer's printing equipment and viscosity requirements. Advanced-packaging materials also include metal-free photoreactive materials for IPL bonding and debonding, copper seed-layer materials for TGV, and via-filling pastes applied to TGV processes. The secondary-battery research portfolio includes high-ionic-conductivity solid electrolytes, silicon-anode performance improvement, thermal-stability materials, and technologies intended for EV and ESS large-capacity applications. Solid-state battery work focuses on replacing liquid electrolyte with solid electrolyte materials that can also perform separator functions, with development directed toward safety, energy density, temperature range, and stable ion transport. Research covers both oxide-based electrolytes with chemical and thermal stability and sulfide-based electrolytes with high ionic conductivity and formability. The company also tracks lithium-ion capacitor technology, which combines battery-type anodes with activated-carbon capacitor cathodes to occupy a performance space between lithium-ion batteries and supercapacitors. The stated characteristics of lithium-ion capacitors include higher energy density and lower self-discharge than conventional supercapacitors, cycle life above the 100,000-cycle level relative to lithium-ion batteries, and lower thermal-runaway risk. Typical lithium-ion-capacitor applications include power assistance, regenerative braking, and industrial backup power where rapid response and long service life are needed together.
Capabilities and products
- IPL full-wafer photonic debonding
- IPL sintering for copper-paste metallization
- TGV laser drilling processes for through-glass vias
- IPL debonding light-absorption layer material (Meta-IAL™)
- IPL photoreactive temporary bonding materials
- copper conductive ink and paste development and supply
- silver conductive ink and paste development and supply
- low-viscosity inks for EHD fine-pattern printing
- high-viscosity inks and pastes for pneumatic dispensing
- conductive pastes for screen printing
- inks and pastes for blade-coating printing
- materials for TGV copper seed-layer formation
- TGV via-filling pastes
- high-ionic-conductivity solid electrolyte development
- silicon anode material development and performance improvement
- thermally stable battery material development
- semiconductor packaging thermal interface material development
- semiconductor packaging insulation material development
- debonding laser optical system design
- 200mm/300mm wafer precision stage and chuck design
- semiconductor process real-time monitoring and feedback control development
- semiconductor material property analysis and formulation optimization
- AI/ML material design and process data analysis