At a glance
| Booth | R7312 |
| Country | KR |
| Website | www.metasol.co.kr |
Company profile
MetaSOL — light-based process solutions for advanced semiconductor packaging and glass substrates. By replacing conventional thermal, laser, and chemical methods with controlled Intense Pulsed Light (IPL) flashes, MetaSOL delivers faster, low-temperature, minimal-damage manufacturing. IPL Photonic Debonding Full-area, non-scanning irradiation across the entire wafer — zero-stress release with high throughput. Core material: Meta-IAL™ absorption layer. TGV / Copper Metallization IPL sintering completes copper paste metallization in seconds — versus tens of minutes for conventional thermal ovens — while preventing substrate deformation. www.metasol.co.kr
Exhibits
Intense Pulsed Light (IPL) process solutions for photonic debonding and TGV/copper metallization, including full-area non-scanning IPL debonding, the Meta-IAL™ absorption layer, and IPL sintering of copper paste.
Capabilities and products
- light-based process solutions using Intense Pulsed Light (IPL)
- process solutions for advanced semiconductor packaging and glass substrates
- IPL Photonic Debonding with zero-stress release
- Meta-IAL absorption layer core material
- IPL sintering completes copper paste metallization in seconds
- low-temperature processing preventing substrate deformation