At a glance
| Booth | S7736 |
| Country | TW |
| Website | www.mlti.com.tw |
Company profile
•Founded in 2016, Max Luck Technology Inc. (MLTi) specializes in advanced materials and related applications, including aluminum nitride heaters, silicon nitride substrates, alumina substrates, and diamond substrates. •In 2020, MLTi developed a semiconductor CIP (Continuous Improvement Process) solution to improve yield, increase production capacity, extend equipment lifespan, and reduce downtime. •In 2023, MLTi independently developed large-area diamond coatings for use as interposer thermal layers in 3D packaging, effectively enhancing heat dissipation and eliminating chip hotspots. •In 2025, the company plans to produce large-diameter diamond wafer carriers, an ideal substrate for advanced semiconductor SoIC packaging. •In 2026, MLTi introduced 12-inch transparent alumina ceramic substrates, also known as Crystal Wafer Carriers (CWC), for advanced packaging processes, providing an optical-grade solution for semiconductor packaging.
Exhibits
Advanced materials and applications include aluminum nitride heaters, silicon nitride substrates, alumina substrates and diamond substrates, along with a semiconductor CIP (Continuous Improvement Process) solution. It also developed large-area diamond coatings for interposer thermal layers in 3D packaging and introduced 12-inch transparent alumina ceramic substrates / Crystal Wafer Carriers (CWC) for advanced packaging.
Capabilities and products
- aluminum nitride heaters
- silicon nitride and alumina substrates
- semiconductor CIP (Continuous Improvement Process) solution
- large-area diamond coatings as interposer thermal layers in 3D packaging
- enhancing heat dissipation and eliminating chip hotspots
- large-diameter diamond wafer carriers
- 12-inch transparent alumina ceramic substrates
- fine ceramic materials for advanced packaging