Max Luck Technology Inc

Exhibitor at SEMICON Taiwan 2026 · Booth S7736

Booth S7736Country TW11 product topics
Show facts

At a glance

BoothS7736
CountryTW
Websitewww.en.mlti.com.tw/semiconductor/About%2Bus
Exhibitor profile

Company profile

Max Luck Technology Inc specializes in advanced materials and related applications including aluminum nitride heaters, silicon nitride substrates, alumina substrates, and diamond substrates. The company also supplies semiconductor equipment-parts design, sales, and maintenance, adding equipment support activities to its advanced-materials portfolio. In 2020, Max Luck Technology Inc developed a semiconductor CIP (Continuous Improvement Process) solution described as improving yield, increasing production capacity, extending equipment lifespan, and reducing downtime. In 2023, the company independently developed large-area diamond coatings for use as interposer thermal layers in 3D packaging, with the stated effects of enhancing heat dissipation and eliminating chip hotspots. For 2025, Max Luck Technology Inc stated a plan to produce large-diameter diamond wafer carriers, describing them as an ideal substrate for advanced semiconductor SoIC packaging. In 2026, the company introduced 12-inch transparent alumina ceramic substrates, also called Crystal Wafer Carriers (CWC), for advanced packaging processes and described them as an optical-grade solution for semiconductor packaging.

Exhibitor profile

Exhibits

The semiconductor equipment-parts range covers key modules and parts for CVD/PVD/ALD/Etching equipment, including Chamber, Heater, ESC, and various Spare Parts made from both metal and non-metal materials. The broader product structure lists Agent products, Semiconductor Equipment, Manufacturing and service, Fourth-generation semiconductor materials, Semiconductor Ceramics and Special Materials, Semiconductor advanced process system integration, CIP semiconductor equipment parts, and ESC/Heater Refurbishment. Within Chamber-related CIP work, the listed offering includes CVD Cavity CIP Improve -CVD TiNAaxelKit_Main, connecting the CIP improvement approach to a named CVD chamber-related item. Heater-related items include CVD Heater CIP_Top together with Advanced Ceramic Heaters identified as AlN Heater for Semi Equipment and AlN Heater for Industrial application. The parts range also includes ESC and various Spare Parts across metal and non-metal materials, with examples including an aluminum nitride radiator and an aluminum nitride small crucible structure. Together with the company's semiconductor CIP (Continuous Improvement Process) solution, these Chamber, Heater, ESC, refurbishment, and spare-parts offerings address equipment improvement, replacement-part supply, and maintenance-related needs across CVD/PVD/ALD/Etching environments, including both metal and non-metal component requirements within the stated parts range.

Exhibitor profile

Capabilities and products

Topic group

Related product topics

On this site