At a glance
| Booth | R7200 |
| Country | TW |
| Website | www.litron.com.tw |
Company profile
LiveStrong Optoelectronics Co., Ltd. builds its business around optoelectronics and green-energy technology, using the idea of serving and sharing as the basis for a platform linking those fields with customer needs. Its technical development emphasizes IP development, algorithms, and software R&D, with work spanning optoelectronic-component characterization, measurement devices, system integration, cloud services, and green-energy technology. The company develops Industry 4.0 intelligent characteristic-measurement and analysis platforms and provides customized hardware and software design together with technical consulting. LiveStrong works closely with customers in solar optoelectronics research, biophotonics, panel applications, conventional industries, semiconductor work, and micro-LED technology research, with the stated goals of supporting innovation, productivity, and customer success. Its technology route combines semiconductor, optoelectronics, image, and spectrum detection technologies with system-level implementation for automatic detection and analysis. That integrated approach is intended to build horizontal integration across detection activities, strengthen the detection ecosystem, and develop competitive hardware and software that can support higher-value products, revenue, and production value. The company also pursues new detection technologies and has expanded into aerospace-related work, including cooperation with the National Space Organization on satellite-related key components and technologies. Its R&D organization is described as a multidisciplinary team that also draws on domestic and international academic and research capabilities to move academic results into technology-industry applications and industrial value creation. Customers are grouped broadly into research institutions, academic institutions, and enterprises, reflecting a mix of industrial production, applied research, and university-based technical work. Named customers and institutions include TSMC, Epistar, Delta, Hermes-Epitek, Motech, TSEC, ITRI, Academia Sinica, Chinese Academia Sinica, NCSIST, INER, TTC, TERTEC, NSPO, NTU, NTHU, NYCU, and NCKU.
Exhibits
LiveStrong supplies hardware and software system integration, including real-time inspection systems that combine embedded analytical algorithms with measurement and detection functions. Its service range includes Industry 4.0 multifunction automated-inspection system design and system implementation, directly covering both the design of the inspection architecture and the construction of the operating system. The company also undertakes cooperative development of optoelectronic inspection technology, development and commercialization of inspection-analysis algorithms, and industry-academia-research collaboration with shared hardware and software information resources. Sample testing and analysis services include precision film-thickness measurement, material-characteristic analysis, uniformity inspection, satellite solar-cell inspection, and optoelectronic-characteristic simulation. A separate supply category is the thin-film thickness and refractive-index measurement system, which sits within the company's material and film-surface characterization offering. The Filmetrics thin-film measurement system determines film thickness by analyzing reflection and transmission spectra and is described as requiring no moving parts for the measurement process. Its stated measurable thickness extends from films as thin as 1 nanometer to films as thick as 13 millimeters, with results obtainable in a few seconds using a nondestructive measurement approach. Beyond thickness, the system can measure refractive index and extinction coefficient, expressed as n and k values, as well as color and even surface roughness for process monitoring and yield-improvement work. The broader material and surface-characterization portfolio also identifies optical profilers, resistance measurement systems, and nanoindenters, together with reliability testing, aerospace technology, customized systems, and optical-component-related materials. Application terms associated with the measurement portfolio span semiconductor materials and wafers, coatings, solar cells and modules, LED and OLED devices, micro-LED and mini-LED, optical spectroscopy, photoluminescence and electroluminescence, quantum efficiency, solar simulation, and related optical and electrical characterization. For conductive-film characterization, the R50 resistance measurement system supports metal-film thickness and uniformity mapping, ion-doping and implantation-concentration characterization, thin-film thickness and resistivity distribution, and non-contact film-thickness measurement. R50 provides two resistance-measurement architectures: contact four-point probe, or 4PP, and non-contact eddy current, or EC; 4PP is recommended for thinner metal and ion-implanted layers, while EC is recommended for thicker metal layers and soft or flexible surfaces. The platform includes a 100mm Z-axis travel with automatic control, measurement across 10 orders of magnitude for conductor and semiconductor thin-film resistance, configurable measurement coordinates, a 200mm electrically controlled XY stage option, and RSMapper software. Its listed application markets include semiconductors, compound semiconductors, advanced packaging, solar, flat-panel and VR-related displays, printed circuit boards, wearable devices, and conductive materials. In 4PP operation, four conductive probes contact the conductive layer with controlled force; current is applied through the two outer probes and voltage is measured across the two inner probes. KLA's dual-mode implementation on R50 includes measurement of voltage on spaced probes, dynamic edge-effect correction, and probe-spacing error compensation, with different probe types offered for different surface-material characterization needs. The EC method applies a time-varying current in a coil to induce eddy currents in a conductive surface, then detects the resistance-proportional signal through magnetic coupling with the probe coil; the probe height can be dynamically adjusted at each measurement point. The EC method is described as unaffected by probe size or surface oxidation and as suitable for softer samples or other surfaces that are not appropriate for 4PP contact measurement. The two R50 methods are stated to show more than 99% correlation, while the system can be used for metal-film uniformity, ion-implantation evaluation, sheet-resistance, film-thickness and resistivity mapping, and related process-quality analysis. RSMapper can display measurement results in 2D or 3D, support offline analysis, switch among mapped and individual measurement views, and rotate 3D results for customized parameter analysis. For R50-4PP and R50-EC, listed point repeatability is less than 0.2% and accuracy is ±1%; the stated measurement ranges are 1mΩ/sp~200MΩ/sp for R50-4PP and 1mΩ/sp~10Ω/sp for R50-EC. The 100 mm and 200 mm R50 configurations use automatic XY stages sized at 100 mm * 100 mm or 200 mm * 200 mm, support sample widths up to 265mm or 365mm, and list a maximum sample-stage load of 2.5kg.
Capabilities and products
- Industry 4.0 multifunction automated-inspection system design and implementation
- real-time inspection and embedded-analysis algorithm system integration
- co-development of optoelectronic inspection technology
- inspection-analysis algorithm development and commercialization
- custom hardware/software design and technical consulting
- precision film-thickness measurement service
- material-characterization analysis service
- uniformity inspection service
- satellite solar-cell inspection
- optoelectronic-characteristic simulation
- film-thickness and refractive-index measurement system
- nondestructive film-thickness measurement from 1 nm to 13 mm
- refractive-index n&k, color and surface-roughness measurement
- optical profiler supply
- resistance measurement system supply
- nanoindenter supply
- metal-film thickness and uniformity mapping
- ion-doping and implantation-concentration characterization
- contact four-point-probe 4PP resistance measurement
- non-contact eddy-current EC resistance measurement
- sheet-resistance, film-thickness and resistivity mapping
- 2D/3D measurement-result visualization and analysis
- Industry 4.0 intelligent characteristic measurement and analysis platform
- reliability testing service