At a glance
| Booth | T9404 |
| Country | TW |
| Website | www.liveoptronics.com |
Company profile
LiVe Optronics Company Limited is a Taipei-based laser-chip design company delivering advanced laser chips for optical communication and precision sensing. The company partners with leading academic photonics laboratories in Taiwan and uses Taiwan’s mature compound-semiconductor supply chain to support high-quality volume manufacturing of advanced laser chips in Asia. Its portfolio is organized around VCSEL and DFB laser-chip product lines for optical communication, AI optical interconnect and precision-sensing applications. The company describes its technical foundation as in-house III-V photonic-chip design combined with close academic collaboration and deep integration with the compound-semiconductor supply chain. LiVe Optronics Company Limited states that this combination supports high-power, high-reliability laser light sources for AI-era optical systems. The headquarters is in Taipei, and the business is focused on laser-chip design rather than general optical-component supply. The company also focuses on advanced laser-chip technology for high-speed optical communication and precision sensing and is committed to high-quality production in Asia.
Exhibits
The product range includes 850 nm VCSEL arrays for optical communication and AI optical-interconnect applications. The VCSEL line also includes 850 / 1060 nm products and is described as a multimode surface-emitting laser product family. The DFB product family covers 1310 / 1550 nm devices and is described as providing high-power CW and narrow-linewidth laser sources. Applications listed for the 1310 / 1550 nm DFB lasers include silicon-photonics integration, co-packaged optics, FMCW LiDAR and long-reach optical communication. The 850 nm VCSEL array and 1310 / 1550 nm CW-DFB lines are positioned for AI optical interconnect and precision sensing. VCSEL applications include 400G / 800G / 1.6T Ethernet, AI high-speed transport and active optical cables. The product portfolio therefore connects short-wavelength VCSEL devices with high-speed optical links and pairs 1310 / 1550 nm DFB sources with silicon-photonics, CPO, LiDAR and long-reach communication use cases. The company positions both product families within its advanced laser-chip design capability, with manufacturing supported by its academic and compound-semiconductor supply-chain collaborations. VCSEL devices are identified as multimode surface-emitting lasers, while the DFB family is identified as distributed-feedback laser chips, giving the portfolio two distinct laser architectures. These two product families span 850 nm and 1060 nm VCSEL devices together with 1310 nm and 1550 nm DFB devices for optical-communication and sensing requirements. Across the VCSEL and DFB families, the covered wavelength span is summarized as 850~1550nm.
Capabilities and products
- advanced laser-chip design
- 850 / 1060 nm VCSEL laser chips
- 850 nm VCSEL arrays at 25–224 Gb/s PAM-4
- 1310 / 1550 nm high-power narrow-linewidth CW-DFB lasers
- III-V photonic-chip design