At a glance
| Booth | L0616 |
| Country | CN |
| Website | www.kns.com |
Company profile
Kulicke & Soffa Pte Ltd is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, Kulicke & Soffa Pte Ltd addresses increasingly dynamic process challenges and seeks to create long-term value by aligning technology with opportunity.
Exhibits
Kulicke & Soffa Pte Ltd provides wafer-level stud bumping solutions that combine precision, speed and reliability for next-generation semiconductor manufacturing. Stud bumping is a wafer-level interconnect process that creates high-density gold bumps for advanced semiconductor packaging and enables reliable fine-pitch connections for high-performance, compact devices. Using an Electronic Flame Off, EFO, spark, the process forms a gold ball at the end of a bonding wire and thermo-sonically bonds it to the device pad with heat, pressure and ultrasonic energy before breaking the wire cleanly to leave a solid gold stud. The resulting precision bumps provide attachment points for flip-chip and wafer-level assembly and support fine-pitch interconnects for CMOS image sensors, RF modules and other high-performance semiconductor devices. ATP Lite™, ATPremier™ PLUS and ATPremier™ MEM PLUS integrate thermo-sonic control, precision mechanics and smart automation for consistent fine-pitch bump quality on 200 mm and 300 mm wafers, are widely adopted in the SAW filter market, and can include automation such as the Auto Wafer Handler System. Kulicke & Soffa Pte Ltd states that these wafer-level platforms offer unmatched throughput, the lowest cost of ownership and the fastest performance in the industry; internal benchmarking and customer deployments also show high UPH, a compact footprint, bump-height control of about ±3 µm, sustained throughput, long MTBA and fast recipe swaps between stud bumping and wire bonding configurations when needed. Both Standard Stud Bump and AccuBump™ processes bond an EFO-formed ball using heat, force and ultrasonic energy and then break the wire cleanly; Standard Stud Bump uses programmed capillary motion to tear the wire above the bonded ball in the heat-affected zone, while AccuBump™ uses advanced z-axis motion to create a flat surface and weaken the wire for precise termination. The AccuBump™ flat landing area supports later steps such as Standoff Stitch Bump, SSB, or stacked bump bonding, while control of the z-axis profile, wire-clamp timing and ultrasonic energy supports bond integrity and repeatability and tighter bump geometry for complex pad layouts. Stud bumping applications include CMOS image sensors for high-resolution sensors in smartphones, automotive cameras and industrial vision; RF modules and wireless devices requiring compact high-frequency components, reliable flip-chip bumps and low-loss signal paths; advanced logic and memory packages for high-performance computing and memory where tight pitch and thermal integrity are important; flip-chip assembly where stud bumps support later solder or adhesive bonding and improve mechanical stability and electrical performance; wafer-level packaging for ultra-thin, high-I/O-density devices such as mobile processors and IoT chips; optoelectronic devices including photonics and LED packaging where precise bump placement supports optical alignment and electrical connectivity; and SAW filter manufacturing where Kulicke & Soffa Pte Ltd states the solution provides highest throughput and yield. Kulicke & Soffa Pte Ltd also provides vertical wire bonding for ultra-dense compact interconnects that improve electrical performance and reduce footprint for next-generation high-speed, high-performance packaging. Vertical wire bonding creates electrical connections in a vertical orientation rather than a conventional horizontal layout, addressing miniaturization and high-density packaging requirements. By stacking wires vertically, the approach reduces interconnect footprint for architectures such as 3D ICs and stacked dies, shortens signal paths, lowers electrical resistance and power loss, and improves signal integrity for high-frequency and high-speed applications. Vertical wire bonding is suited to space-constrained, performance-sensitive electronics including smartphones, tablets, wearables, IoT systems and automotive electronics. Through its proprietary Vertical Connect process and advanced bonding platforms, Kulicke & Soffa Pte Ltd provides precision and scalability for high-density interconnects and presents the technology as a cost-effective alternative to copper pillars and through-silicon vias with fewer complexity and tooling requirements. Advanced control systems support consistent wire placement and bonding integrity at ultra-fine pitch, scalable high-volume manufacturing, and customer support from process development through integration. Vertical wire bonding application areas include high-performance memory with stacked-die and wafer-level configurations, SiP and RF modules with EMI shielding, 3D IC and stacked-die interconnects, wafer-level packaging with integrated metrology, and package-on-package interconnects for mobile and consumer electronics. Kulicke & Soffa Pte Ltd describes vertical wire bonding benefits as high-density interconnection for multiple dies and ultra-fine-pitch pads, fewer tools and process steps than copper-pillar and selected TSV methods, shorter wire lengths for lower signal delay and power consumption, flexibility without masks and extensive process qualifications, and consistent performance in compact, high-stress environments. Kulicke & Soffa Pte Ltd also provides ball bonding solutions with intelligent process control, automation and productivity features that improve performance, yield and scalability while enabling cost-efficient copper bonding. Ball bonding forms a microscopic spherical ball at the tip of an ultra-fine gold or copper wire using heat, pressure and ultrasonic energy, bonds the ball to the die pad with a ceramic capillary, and loops the wire to the substrate or lead frame to create an electrical connection. The process supports ultra-fine pitches and high-density interconnects for advanced packaging including stacked dies, 3D ICs and system-in-package, SiP, designs. Kulicke & Soffa Pte Ltd combines intelligent loop control, real-time analytics, smart process control, real-time monitoring and automation with expertise in ultra-fine-pitch and copper-wire bonding. Response-based processes ProCu, ProStitch Plus and ProOverhang simplify development and boost productivity, and are combined with digital-twinning tools such as AutoOLP and intelligent looping solutions such as ProCu Loop for advanced loop control, real-time process insights and faster time-to-market. Ball bonding application areas include high-performance computing for AI, machine learning and data centers; automotive electronics including ADAS, EV power modules and infotainment; consumer electronics and IoT including smartphones, tablets, wearables and edge devices; and advanced packaging with stacked dies, 3D ICs and SiP designs. Kulicke & Soffa Pte Ltd describes ball bonding benefits as miniaturization and high interconnect density, electrical performance and mechanical durability, scalability for high-volume production with minimal downtime, and copper-wire bonding as a cost-efficient alternative.
Capabilities and products
- wafer-level gold stud bumping
- stud bumping for 200 mm and 300 mm wafers
- Standard Stud Bump process
- AccuBump™ flat-surface stud-bump process
- stud bumps for flip-chip and wafer-level fine-pitch interconnects
- vertical wire bonding
- semiconductor ball bonding
- ultra-fine-pitch copper-wire ball bonding