Keystone Microtech Corporation

At a glance

Company profile

Keystone Microtech Corporation was established in September 2006 and focuses on semiconductor test hardware and test solutions. The company has experience designing testing hardware for high-speed, RF, consumer, automotive, and ASIC applications. Keystone Microtech Corporation also provides after-sales repair service for test hardware. The company initially focused on integrated-circuit testing solutions including load boards, probe cards, and related peripherals, and its products and services have been accepted by domestic and overseas customers. Its technical-service scope includes SI/PI simulation, thermal simulation, and production-process support alongside IC front-end and back-end test solutions. Keystone Microtech Corporation also groups Load Board, Probe Card, and peripheral equipment under integrated-circuit test solutions and lists IC Burn-in Board and FPGA Evaluation Board under system-verification solutions.

Exhibits

For IC front-end testing, probe cards contact wafers before packaging to perform functional and electrical tests, separating nonconforming devices before they incur additional packaging cost. As semiconductor products become more complex and advanced-packaging costs rise, Keystone Microtech Corporation positions higher-specification probe cards to meet increasing test requirements. Keystone Microtech Corporation provides high-pin-count, high-current, high-speed, and high-frequency probe cards customized for products such as mobile application processors, power-management ICs, mmWave RF devices, high-performance-computing chips, and WiFi networking devices. The company states that its customized probe-card products have supported cooperation with domestic and overseas first-rate customers and have obtained customer verifications or certifications. Its vertical Cobra probe cards support different peripheral and array combinations, simultaneous high-volume output, Al Pad and Cu Pillar Bump testing, and applications including MCU, TDDI, and SoC devices, with maximum pin count up to 15,000. Vertical MEMS probe cards support full-array combinations and high-volume output, Al Pad and Cu Pillar Bump testing, low probe force below 1.7 gF, high current rating above 1800mA to 2800mA, low inductance below 2.5 nH, and maximum pin count up to 80,000. The MEMS offering also includes automatic needle insertion to increase production efficiency and is described as applicable to current advanced-process products. High-speed interface coverage includes HDMI, MIPI, SerDes PAM4, USB 4.0, and PCIe Gen5. High-performance and high-power related applications listed by the company include APU, GPU, HPC, AI chips, and mobile AP devices. Probe-card outgoing inspection includes flying-probe testing, manual electrical testing of active components, and PRVX4 testing. The listed test-platform motherboards include V93K DD and V93K EXA, UltraFLEX and UltraFLEXplus, J750, E320 (KYEC), and S100 (YTEC). For IC back-end testing, the product scope includes load boards and burn-in boards, while the front-end scope centers on probe-card solutions. Load boards are identified as the company's hardware category for IC final test, probe cards as the category for wafer test, and burn-in boards as the category for reliability test. Technical services listed with these products include SI/PI simulation and thermal simulation, providing engineering support around the test-hardware development flow. The company also lists Production Process as a technical-service area associated with its front-end and back-end IC test solutions.

Capabilities and products

• IC final-test load boards
• wafer-test probe cards
• reliability-test burn-in boards
• SI/PI simulation services
• thermal simulation services
• custom high-pin-count high-speed high-frequency probe cards
• Cobra vertical probe cards
• MEMS vertical probe cards
• FPGA evaluation-board system verification
• after-sales repair for test hardware
• SerDes PAM4 high-speed interface probe testing
• USB 4.0 high-speed interface probe testing
• PCIe Gen5 high-speed interface probe testing

Related product topics

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