At a glance
| Booth | Q5930 |
| Country | JP |
| Website | www.kanematsu.co.jp/en/business/electronics_devices/semiconductor_equipment |
Company profile
Coating processes 1) 石井表記 / Inkjet Coating System ⇒ An optimal solution for high-definition fine-pattern coating on silicon wafers, glass, resin and other substrates, matched with a variety of resists (resist inks). Surface finishing processes 1) Macoho / Wet Blast System ⇒ Precision surface finishing technology for a wide range of materials including ceramics, resin, glass and wafers, with an extensive delivery record in Japan and overseas. Film deposition processes for the semiconductor front end 1) 日本酸素 / MOCVD equipment 2) JSW Afty / ECR plasma deposition equipment ⇒ The MOCVD equipment from 日本酸素 has a substantial global track record in epitaxial growth processes and achieves high-quality film deposition. ⇒ JSW Afty, focused primarily on facet coating for semiconductor lasers, already has multiple deliveries in Taiwan. Inspection processes 1) Acroedge / measurement equipment for UV cure level and degree of surface modification 2) iL Technology / thermal-characteristic screening testers for interposer and die bonding 3) Cat Beam / X-ray inspection systems dedicated to HBM 4) NS Technologies / handlers for IC testing 5) Nimble / active temperature control solutions for IC testing 6) Esmo / engineering handlers 7) Elettronica Dedicata / load board test equipment 8) Modus Test / socket test equipment 9) CASTEC / factory automation solutions ⇒ A range of inspection methods and equipment is offered according to customer requirements and process conditions. ⇒ Acroedge converts conventional contact-based, sampling-based measurement into non-contact, inline inspection. ⇒ Suppliers including iL Technology provide non-destructive inspection solutions for internal defects and bonding condition, addressing advanced packaging, glass TGV and similar applications. ⇒ NS Technologies will exhibit its latest low-temperature-capable IC handler, the NS-8320XT, which can test 32 ICs simultaneously and also offers a large-package solution. Other processes 1) PRA / high-voltage modules for ESC power boards used in TCP-type etching equipment 2) Energy-saving products / power-saving PADs and automatic heat-exchanger cleaning equipment 3) Getech / IH soldering equipment ⇒ PRA helps reduce heat generation, suppress temperature degradation, extend service life and prevent relay failure, improving equipment MTBF. ⇒ Power-saving products reduce factory electricity use and energy consumption, with a proven record in Japan and overseas. ⇒ Getech's IH soldering equipment achieves non-contact, high-quality soldering and has multiple deliveries in automotive and large electronic component applications.
Exhibits
Provides Ishii Hyoki inkjet coating systems, Macoho wet blast systems, Nippon Sanso MOCVD equipment and JSW Afty ECR plasma deposition equipment. Inspection and test offerings include Acroedge UV-curing/surface-modification measurement equipment, iL Technology thermal-property screening testers, Cat Beam HBM X-ray inspection systems, NS Technologies and Esmo handlers, Nimble active temperature-control solutions, Elettronica Dedicata load-board and Modus Test socket test equipment, and CASTEC factory-automation solutions. Other products include PRA high-voltage modules for ESC power boards, power-saving PADs, automatic heat-exchanger cleaning equipment and Getech IH soldering equipment.
Capabilities and products
- inkjet coating systems
- wet blast system for precision surface finishing
- MOCVD and ECR plasma deposition equipment
- X-Ray inspection system dedicated to HBM
- NS-8320XT low-temperature IC handler
- capable of testing 32 ICs simultaneously
- equipment measuring UV curing degree and surface modification
- shifting from contact sampling measurement to non-contact inline inspection
- non-destructive inspection for advanced packaging and glass TGV
- high-voltage modules for ESC power boards in etching equipment
- energy-saving PADs and automatic heat exchanger cleaning equipment
- IH soldering equipment for non-contact high-quality soldering